초록 ▼

A self-contained liquid cooled heat sink system disposed in a computer has a plurality of socket portions through which a cooling liquid is pumped. Operating heat from a plurality of heat-generating computer components, representatively circuit board-mounted processor chips, is efficiently transferr

A self-contained liquid cooled heat sink system disposed in a computer has a plurality of socket portions through which a cooling liquid is pumped. Operating heat from a plurality of heat-generating computer components, representatively circuit board-mounted processor chips, is efficiently transferred to the heat sink system by heat pipe modules associated with the heat-generating components. Each module includes (1) an evaporator plate held in thermal contact with its associated component, (2) a condenser plate removably plugged into one of the sockets and in a heat transfer relationship therewith, and (3) a plurality of thermosyphoning type heat pipes interconnected between the evaporator and condenser plates. The use of the heat pipe modules permits rapid and easy pull-away electrical and cooling system disconnection for each processor board as well as providing for effective cooling of the processors without the necessity of forcing a flow of air across them.

대표청구항 ▼

[ What is claimed is:] [10.] A computer system comprising:a microprocessor;a data storage device operative to store data that may be retrieved by said microprocessor;a heat-generating structure;a first thermal connector spaced apart from said heat-generating structure;a fluid cooling system isolated

[ What is claimed is:] [10.] A computer system comprising:a microprocessor;a data storage device operative to store data that may be retrieved by said microprocessor;a heat-generating structure;a first thermal connector spaced apart from said heat-generating structure;a fluid cooling system isolated from said heat-generating structure and operative to dissipate heat received by said first thermal connector; anda heat transfer module operative to transfer heat from said heat-generating structure to said first thermal connector and including:a second thermal connector disposed in a heat exchange relationship with said heat-generating structure,a third thermal connector removably connectable to said first thermal connector in a heat exchange relationship therewith, anda heat transfer structure interconnected between said second and third thermal connectors and operative to transfer heat from said second thermal connector to said third thermal connector,said first thermal connector having a generally socket-like configuration, and said third thermal connector having a generally plug-like configuration so as to be received within an interior portion of said first thermal connector,said first thermal connector including first and second opposing separate body sections having facing recesses that combinatively define in said first thermal connector a socket opening for removably receiving said third thermal connector, and a clamping structure operative to clamp said first and second body sections toward one another against opposite sides of the received third thermal connector.