초록 ▼

An arrangement is provided that may be used for cooling electronic equipment, where the electronic equipment is housed in a rack arrangement with an arrangement for transferring the heat energy produced by the equipment to one or more rack-related cooling units each of which is designed to transfer

An arrangement is provided that may be used for cooling electronic equipment, where the electronic equipment is housed in a rack arrangement with an arrangement for transferring the heat energy produced by the equipment to one or more rack-related cooling units each of which is designed to transfer heat energy by means of convection to the ambient air about the rack and the equipment. At least one of the cooling units contains vertically-oriented cooling flanges, positioned next to one another, and a fan unit that is designed to be able to provide, on demand, the cooling unit and the cooling flanges with a stream of forced air, thereby increasing heat emission from the cooling flanges to the ambient air. The fan unit is located at the side of a rack unit, and positioned beside, or part way inside, the cooling unit. The fan unit is arranged to provide a stream of forced air to each space that is formed between the flanges of the cooling unit; the flow of said stream of forced air is restricted to within the area for the sections of the cooling unit flanges that faces towards the rack unit. The stream of air produced for several collateral spaces is aimed to flow in an upward direction.

대표청구항 ▼

[ What is claimed is:] [1.] An arrangement for cooling electronic equipment, comprising:a rack arrangement for housing electronic equipment to be cooled, the rack arrangement including heat transfer bodies for transferring the heat energy produced by the electronic equipment to one or more rack-rela

[ What is claimed is:] [1.] An arrangement for cooling electronic equipment, comprising:a rack arrangement for housing electronic equipment to be cooled, the rack arrangement including heat transfer bodies for transferring the heat energy produced by the electronic equipment to one or more rack-related cooling units, each of the one or more rack-related cooling units being adapted to transfer heat energy by convection to ambient air about the rack arrangement and the electronic equipment;at least one of the cooling units includes vertically-oriented cooling flanges, positioned next to one another, successive ones of the cooling flanges defining spaces therebetween, and a fan unit adapted to provide the cooling unit and the cooling flanges with a stream of forced air such that heat emission from the cooling flanges to the ambient air is increased, the fan unit being positioned proximate the cooling flanges and located at a side of the rack unit;the fan unit being arranged to provide a stream of forced air to each of the spaces formed between the cooling flanges of the cooling unit, a flow of the stream of forced air being restricted to within an area defined by portions of the cooling flanges that face toward the rack unit, and the flow of the stream of forced air being in an upward direction for at least several spaces, wherein at least one of the cooling units includes several parallel flanges, oriented away from the rack, extending away from a rack-related base plate.