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Electronic apparatus having removable processor/heat pipe cooling device modules therein 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-001/16
  • H05K-007/20
출원번호 US-0951932 (1997-10-16)
발명자 / 주소
  • Ekrot Alexander C.
  • Shero James P.
출원인 / 주소
  • Compaq Computer Corporation
대리인 / 주소
    Konneker & Smith, P.C.
인용정보 피인용 횟수 : 27  인용 특허 : 8

초록

A computer server unit has a closely spaced series of parallel, facing processor modules with inner edge portions thereof being operatively and removably received in socket connectors on a main system board within the server unit housing. Voltage regulation modules, in the form of power converter ca

대표청구항

[ What is claimed is:] [9.] Electronic apparatus comprising:a series of computer processor modules;a series of heat pipes having first longitudinal portions secured to said computer processor modules in thermal communication therewith, and second longitudinal portions spaced outwardly apart from sai

이 특허에 인용된 특허 (8)

  1. Huynh Duy Q. (Boca Raton FL) Vadapalli Prabhakara R. (Boca Raton FL), Compact high power personal computer with improved air cooling system.
  2. Webb Matthew L., Computer having a heat sink structure incorporated therein.
  3. Niklos John R. (Worthington OH), Cooling device for electronic components arranged in a vertical series and vertical series of electronic devices contain.
  4. Koike Norihiro (Tokyo JPX), Cooling system for cooling electronic apparatus.
  5. Winick Alan Lee ; Mitty Nagaraj ; Harpell Gary A., Cooling system for enclosed electronic components.
  6. Kimura Hideyuki (Tsuchiura JPX) Takahashi Tsuyoshi (Odawara JPX) Suzuki Tomio (Hiratsuka JPX) Ohdaira Toshio (Odawara JPX) Uefune Kouki (Minamiashigara JPX) Nishimura Yuji (Odawara JPX), Magnetic disk storage system.
  7. Hsu Winston (14508 Pebblewood Dr. Gaithersburg MD 20878), Modular electronic packaging for computer servers.
  8. Toedtman Thomas (Lake Forest CA) Welch Randall S. (Lake Forest CA), Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices.

이 특허를 인용한 특허 (27)

  1. Rockenfeller,Uwe, Apparatus and method for cooling electronics and computer components with managed and prioritized directional air flow heat rejection.
  2. Amaike, Takeshi; Heo, Seon Meyong; Watanabe, Makoto; Yasaku, Takayuki; Izumi, Shinya; Shikamura, Naoya, Cartridge type server unit and a cabinet to accommodate multiple said server units.
  3. Lee, Dong Gyu, Compact thermal exchange unit of thermo-electric cooling mode using heat pipe.
  4. Jochym,Daniel A.; Shenberger,Christian E.; Mease,Keith D.; Scorsone,Joseph J., Computer system and scalable processor assembly therefor.
  5. Ram S. Viswanath ; Hong Xie ; Robert Sankman, Computer utilizing refrigeration for cooling.
  6. Moore, David Allen; Franz, John P.; Cader, Tahir; Sabotta, Michael Lawrence, Cooling assembly.
  7. Chu,Richard C.; Ellsworth, Jr.,Michael J.; Schmidt,Roger R.; Simons,Robert E.; Tsukamoto,Takeshi, Cooling system and method employing at least two modular cooling units for ensuring cooling of multiple electronics subsystems.
  8. Chu,Richard C.; Ellsworth, Jr.,Michael J.; Schmidt,Roger R.; Simons,Robert E.; Zoodsma,Randy J., Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems.
  9. Wilson, John Alexander; Garrett, Robert Haden, Cooling system for a computer and method for assembling the same.
  10. Kohn, Stephane, Electronic apparatus, such as a modem or the like, comprising a plurality of air-cooled processors.
  11. Rieger Yvonne D. ; Rausch William F. ; Stevenson Mark W. ; Pinger Chad S., Evaporator mounted blower speed control.
  12. Heard, Christopher S., Failure-tolerant high-density card rack cooling system and method.
  13. Ellsworth, Jr., Michael J.; Lehman, Bret W.; Matteson, Jason A.; Schmidt, Roger R., Frame level partial cooling boost for drawer and/or node level processors.
  14. Moore, David A; Franz, John P; Cader, Tahir; Sabotta, Michael L, Heat dissipating system.
  15. Peng,Xue Wen; Chen,Rui Hua, Heat dissipation device.
  16. Malone,Christopher G.; Simon,Glenn C., Heat exchanger including flow straightening fins.
  17. Franz, John P; Cader, Tahir; Sabotta, Michael L; Moore, David A, Liquid cooling.
  18. Franz, John P.; Sabotta, Michael L.; Cader, Tahir; Moore, David A., Liquid temperature control cooling.
  19. Osecky, Benjamin D.; Gaither, Blaine D., Method and apparatus for providing continued operation of a multiprocessor computer system after detecting impairment of a processor cooling device.
  20. Pfahnl,Andreas C., Modular liquid cooling of electronic assemblies.
  21. Moore, David A; Franz, John P; Cader, Tahir; Sabotta, Michael L, Modular rack system.
  22. Han Duk-Ho,KRX, Radiation apparatus and radiation method for integrated circuit semiconductor device and for portable computer.
  23. Amaike, Takeshi; Heo, Seon Meyong; Watanabe, Makoto; Yasaku, Takayuki; Izumi, Shinya; Shikamura, Naoya, Server unit comprising stacked multiple server unit cabinets accommodating multiple cartridge type server units.
  24. Bear, Daniel B., Single or dual buss thermal transfer system.
  25. Morris, Terrel L., Systems and methods that use at least one component to remove the heat generated by at least one other component.
  26. Morris, Terrel L., Systems and methods that use at least one component to remove the heat generated by at least one other component.
  27. Pfahnl,Andreas C.; Griffith,Peter, Thermally enhanced pressure regulation of electronics cooling system.
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