초록 ▼

There is disclosed herein a printed circuit board, one embodiment of which comprises: a dielectric substrate 10; a solid metallic heat sink 16 attached to or embedded within the substrate; a cavity 18 formed generally in the substrate, wherein at least one wall 20 of the cavity is defined by a surfa

There is disclosed herein a printed circuit board, one embodiment of which comprises: a dielectric substrate 10; a solid metallic heat sink 16 attached to or embedded within the substrate; a cavity 18 formed generally in the substrate, wherein at least one wall 20 of the cavity is defined by a surface 17 of the heat sink 16; a component mounting pad 14 disposed on the substrate proximate the cavity; a predetermined volume of electrically insulative liquid 22 contained within the cavity; and a thermally conductive member 24 embedded within the substrate, the member 24 being in direct thermal contact with each of the mounting pad 14 and the liquid 22.

대표청구항 ▼

[ What is claimed is:] [1.] A printed circuit board, comprising:a dielectric substrate;a solid metallic heat sink attached to or embedded within said substrate;a cavity formed generally in said substrate, wherein the cavity has a first predetermined volume and wherein at least one wall of the cavity

[ What is claimed is:] [1.] A printed circuit board, comprising:a dielectric substrate;a solid metallic heat sink attached to or embedded within said substrate;a cavity formed generally in said substrate, wherein the cavity has a first predetermined volume and wherein at least one wall of the cavity is defined by a surface of said heat sink;a component mounting pad disposed on said substrate proximate the cavity;a second predetermined volume of electrically insulative liquid contained within the cavity; anda thermally conductive member disposed within said substrate, said member being in direct thermal contact with said mounting pad and said liquid.