초록 ▼

Heat transfer out of a housing for a locallized source of heat such as that produced by a semiconductor chip of electronic apparatus is provided by a low thermal impedance heat transfer member such as a heat pipe, a thermal reservoir or heat transfer buffering member and a Peltier effect device inte

Heat transfer out of a housing for a locallized source of heat such as that produced by a semiconductor chip of electronic apparatus is provided by a low thermal impedance heat transfer member such as a heat pipe, a thermal reservoir or heat transfer buffering member and a Peltier effect device interfaced with the thermal reservoir and the ambient surrounding the housing so as to provide a refrigeration function for the thermal reservoir. A high heat capacity or high latent heat of phase transition material can be used for the thermal reservoir. In a portable computer with a battery power supply, the thermal reservoir can be independent or the battery can be employed in the thermal reservoir functions.

대표청구항 ▼

[ What is claimed is:] [1.] In electronic apparatus having within a housing, a localized source of heat,the improvement comprising:a thermal reservoir member positioned in said electronic apparatus housing,low thermal impedance means adapted for transferring heat from said localized heat source into

[ What is claimed is:] [1.] In electronic apparatus having within a housing, a localized source of heat,the improvement comprising:a thermal reservoir member positioned in said electronic apparatus housing,low thermal impedance means adapted for transferring heat from said localized heat source into said thermal reservoir member, and,a Peltier effect refrigerating member having first and second hot portions and a cold portion and electrical input contacts to said first and second hot portions,said Peltier effect refrigerating member being positioned in said housing with said first and second hot portions and said electrical input contacts exposed outside said housing and said cold portion being in good thermal transfer contact with said thermal reservoir member.