초록 ▼

Microchannels for conducting and expelling a fluid are embedded in a surface of a silicon substrate. A channel seal is made of plural cross structures formed integrally with the silicon substrate. The cross structures are arranged sequentially over each channel, each cross structure having a chevron

Microchannels for conducting and expelling a fluid are embedded in a surface of a silicon substrate. A channel seal is made of plural cross structures formed integrally with the silicon substrate. The cross structures are arranged sequentially over each channel, each cross structure having a chevron shape. The microchannel is sealed by oxidizing at least partially the cross structures, whereby the spaces therebetween are filled. A dielectric seal which overlies the thermally oxidized cross structures forms a complete seal and a substantially planar top surface to the silicon substrate. The dielectric seal is formed of a low pressure chemical vapor deposition (LPCVD) dielectric layer. The channel is useful in the production of an ink jet print in head, and has a polysilicon heater overlying the dielectric seal. A current passing through the heater causes a corresponding increase in the temperature of the ink in the microchannel, causing same to be expelled therefreom. After expulsion of the fluid, the microchannel is refilled by capillary action. Control circuitry, including bonding pads and sensors, can be formed integrally on the silicon substrate. In drug or chemical delivery systems, sensors and/or stimulation circuitry for sensing or inducing neural and other response can be formed directly in the silicon substrate which contains the microchannel. The sensor is disposed in close proximity to the chemical distribution nozzle, facilitating neural and other studies. Microvalve arrangements can be formed with the microchannel, controlled by the on-chip circuitry.

대표청구항 ▼

[ What is claimed is:] [1.] A method of forming a microchannel nozzle, the method comprising the steps of:performing a boron diffusion to form a boron-doped layer on the surface of a silicon wafer;first etching the boron-doped layer on the surface of a silicon wafer to form a plurality of sequential

[ What is claimed is:] [1.] A method of forming a microchannel nozzle, the method comprising the steps of:performing a boron diffusion to form a boron-doped layer on the surface of a silicon wafer;first etching the boron-doped layer on the surface of a silicon wafer to form a plurality of sequential structures;second etching beneath the sequential structures to form a longitudinal channel thereunder; andfirst sealing the longitudinal channel by thermally oxidizing the sequential structures, whereby oxidized silicon reduces the size of the spaces between the sequential structures.