|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||349/155 ; 349/153 ; 349/157|
|발명자 / 주소|
|출원인 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 13 인용 특허 : 20|
A method for forming a uniform cavity between electrode substrates of a dlay comprises the steps of patterning a border to define a display area between the electrode substrates, patterning electrode spacers between the electrode substrates, and wafer bonding the electrode substrates to the border and to the electrode spacers to form a uniform cavity within the display area. A cavity comprises a pair of substrates enclosing the cavity and patterned spacers wafer bonded to the substrates to form and maintain a uniform thickness of the cavity.
[ We claim:] [1.] A method for forming a substantially uniform cavity between a pair of substrates comprising the steps of:patterning a border on at least one of the substrates to define an area within the cavity;patterning spacers on at least one of the substrates within the area defined by the border to maintain a substantially constant separation between the substrates;positioning the substrates for wafer bonding the substrates to the border and to the spacers; andwafer bonding the substrates to the border and to the spacers,wherein the border compris...