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Heat sink assembly including flexible heat spreader sheet 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0988378 (1997-12-10)
우선권정보 JP-0334017 (1996-12-13)
발명자 / 주소
  • Kobayashi Takashi,JPX
  • Nonaka Takashi,JPX
출원인 / 주소
  • Mitsubishi Denki Kabushiki Kaisha, JPX
대리인 / 주소
    Leydig, Voit & Mayer
인용정보 피인용 횟수 : 40  인용 특허 : 3

초록

In a heat sink, a portable electronic apparatus using this heat sink, and a method for forming this heat sink, an abutting member is arranged on an inside surface of a casing and the casing and the abutting member are covered with a heat spreader sheet. The heat spreader sheet is made to abut agains

대표청구항

[ What is claimed is:] [1.] A heat sink assembly for transmitting heat generated in an exothermic device to a low temperature surface comprising:an exothermic device producing heat during operation;a circuit board on which the exothermic device is mounted;a low temperature member having opposed inte

이 특허에 인용된 특허 (3)

  1. Yokono Hitoshi (Toride JPX) Terabayashi Takao (Tokohama JPX) Kayaba Nobuo (Yokohama JPX) Daikoku Takahiro (Ushiku JPX) Kieda Shigekazu (Ishioka JPX) Kobayashi Fumiyuki (Sagamihara JPX) Zushi Shizuo (, Cooling arrangement for semiconductor devices and method of making the same.
  2. Allen Jonathan B. (Westfield NJ), Data over voice transmission arrangement.
  3. Penniman Mark B. (Austin TX) Skillman Peter N. (San Carlos CA) Lillios Tony J. (Palo Alto CA) Boyle Dennis J. (Palo Alto CA), Integrated circuit dual cooling paths and method for constructing same.

이 특허를 인용한 특허 (40)

  1. Zhan,Guodong; Kuntz,Joshua D.; Mukherjee,Amiya K., Anisotropic thermal and electrical applications of composites of ceramics and carbon nanotubes.
  2. Zhan, Guodong; Kuntz, Joshua D.; Mukherjee, Amiya K., Anisotropic thermal applications of composites of ceramics and carbon nanotubes.
  3. Bopp, Timothy F.; Kippes, Kyle W., Apparatus and method to retain an electronic component in a precise position during assembly manufacturing.
  4. Huang, Kung-Shiuh; Huang, Kuan-Tsae; Wu, June, Configurable heat conducting path for portable electronic device.
  5. Sen,Bidyut K.; Kirkman,Scott; Gektin,Vadim, Conformal heat spreader.
  6. Hughes, Phillip N.; Lipps, Robert J., Contact cooled electronic enclosure.
  7. Matsumoto, Subaru; Komori, Kou; Katayama, Daisuke; Otani, Katsumi, Cooling structure for electronic device.
  8. Wu, Kuo-Tai, Cover apparatus for dissipating heat and shielding electromagnetic interference.
  9. Linderman, Ryan, Double insulated heat spreader.
  10. Linderman, Ryan, Double insulated heat spreader.
  11. Chen, Jen-Chun; Cao, Xiao-Wen; Chang, He- Yi, EMI compartment shielding structure and fabricating method thereof.
  12. Petricek,Martin; Rothmayer,Thomas, Electronic device.
  13. Umehara, Hideaki, Electronic device and communication apparatus.
  14. Hsu, Chi Hsing, Electronic device with flexible heat spreader.
  15. Tan, Zeu-Chia, Electronic device with heat dissipation casing.
  16. Sarno, Claude; Moulin, Georges, Electronic module with high cooling power.
  17. Aapro,Teppo; Lasarov,Harri, Hand-held portable electronic device having a heat spreader.
  18. Tseng,Richard; Chen,Rong Che; Hsieh,Yih Jong; Lo,Chien Yi, Heat dissipating device for electronic component.
  19. Colin Fuller GB; Anthony Bristow GB; Stephen Cross GB; David Woodhouse GB; David Sturge GB, Heat dissipation in electrical apparatus.
  20. Wu,Chung Ju, Heat dissipation mechanism for electronic apparatus.
  21. Moore,David A.; Tracy,Mark; Hill,Kerry, Heat spreader with controlled Z-axis conductivity.
  22. Shirakami, Takashi; Yamazaki, Naoya; Iino, Kazuhiro; Tada, Yoshiaki; Ueda, Satoshi, Heat transfer mechanism, heat dissipation system, and communication apparatus.
  23. Fujiwara,Norio, Heat-radiating structure of electronic apparatus.
  24. Ford,Brian M.; Shives,Gary D.; Norley,Julian; Reynolds, III,Robert Anderson, Integral heat spreader.
  25. Ahmad, Mudasir; Narasimhan, Susheela, Methods and apparatus for cooling a circuit board component.
  26. Shanker, Bangalore J.; Zou, Yida; Camerlo, Sergio, Methods and apparatus for cooling a circuit board component using a heat pipe assembly.
  27. Takashi Kobayashi JP, Portable electrical apparatus with metal case having thermal insulation.
  28. Takashi Kobayashi JP, Portable electrical apparatus with metal case having thermal insulation.
  29. Pal, Debabrata, Power distribution panel having contactor with thermal management feature.
  30. Carlino,Harry J.; Shaak,Todd M.; Suryani,Martha; Maloney,Lloyd A., Shield, and printed circuit board and electrical apparatus employing the same.
  31. Baskaran, Rajashree; Ramanathan, Shriram; Morrow, Patrick R., Stacked wafer or die packaging with enhanced thermal and device performance.
  32. Zaffetti, Mark A.; Taddey, Edmund P., Structural assembly for cold plate cooling.
  33. Hayakawa, Haruo; Ono, Masahiro; Yamaguchi, Seiji; Uda, Yoshihiro; Shinchi, Kazuhiro; Tomekawa, Satoru; Nakanishi, Kiyoshi; Kubota, Kosuke; Katagiri, Atsushi; Kotani, Motohisa; Konishi, Kazuhiro; Nishimura, Eiji; Matsuki, Takeo, Substrate structure.
  34. Zhang, Lian; Heresztyn, Amaury J.; Liang, Frank F., Thermal blocker for mobile device skin hot spot management.
  35. Martin, Yves; Van Kessel, Theodore G, Thermal ground plane for cooling a computer.
  36. Martin, Yves; Van Kessel, Theodore G., Thermal ground plane for cooling a computer.
  37. Smalc,Martin David; Shives,Gary D.; Reynolds, III,Robert Anderson, Thermal solution for electronic devices.
  38. Smalc,Martin David; Shives,Gary D.; Reynolds, III,Robert Anderson, Thermal solution for portable electronic devices.
  39. Chen, Ko-Chun; Lin, Chiu-Lang, Use of a graphite heat-dissipation device including a plating metal layer.
  40. Chen, Ko-Chun; Lin, Chiu-Lang, Use of a graphite heat-dissipation device including a plating metal layer.
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