초록 ▼

A non-zero temperature coefficient of offset (Tco) in a semiconductor device (5) is adjusted by reducing the amount of adhesive material used to secure a first structure to a second structure. An adhesive layer (14) used to secure a sensor die (11) to a constraint die (12) in a pressure sensor appli

A non-zero temperature coefficient of offset (Tco) in a semiconductor device (5) is adjusted by reducing the amount of adhesive material used to secure a first structure to a second structure. An adhesive layer (14) used to secure a sensor die (11) to a constraint die (12) in a pressure sensor application is reduced in thickness and/or formed so that adhesive material does not completely cover the constraint die (12). The Tco is further adjusted by reducing the amount and/or patterning the adhesive layer (18) used to secure the sensor (10) to its package (16).

대표청구항 ▼

[ We claim:] [1.] A method for adjusting a non-zero temperature coefficient of offset in a sensor having a sensor die, a base die having a mounting surface, and an adhesive layer securing the sensor die to the mounting surface of the base die, the method comprising the step of:forming the adhesive l

[ We claim:] [1.] A method for adjusting a non-zero temperature coefficient of offset in a sensor having a sensor die, a base die having a mounting surface, and an adhesive layer securing the sensor die to the mounting surface of the base die, the method comprising the step of:forming the adhesive layer on the mounting surface of the base die to a thickness less than 20 micrometers.