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Flip chip circuit arrangement with redistribution layer that minimizes crosstalk 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/552
출원번호 US-0157631 (1998-09-21)
발명자 / 주소
  • Shenoy Jayarama N.
  • Findley Paul
출원인 / 주소
  • VLSI Technology, Inc.
대리인 / 주소
    Wood, Herron & Evans, L.L.P.
인용정보 피인용 횟수 : 138  인용 특허 : 6

초록

A circuit arrangement for a flip chip utilizes fixed potential shield traces between various signal traces in a redistribution layer to decrease coupling impedances and crosstalk within the layer. In particular, by orienting a fixed potential shield trace between a pair of signal traces and/or betwe

대표청구항

[ What is claimed is:] [1.] A circuit arrangement for a flip chip, comprising:(a) a logic circuit including a plurality of input/output (I/O) ports and disposed in at least one logic circuit layer; and(b) a redistribution circuit arrangement disposed in a redistribution layer, the redistribution cir

이 특허에 인용된 특허 (6)

  1. Kamada Chiyoshi (Kokubunji JPX), High frequency signal transmission line structure having shielding conductor unit.
  2. Jacobs Scott L. (Chester VA) Nihal Perwaiz (Hopewell Junction NY) Ozmat Burhan (Peekskill NY) Schnurmann Henri D. (Monsey NY), High performance integrated circuit packaging structure.
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  4. Saitoo Ryuichi (Ithaca NY) Saitoo Osamu (Tokyo JPX) Ikeda Takahide (Tokorozawa JPX) Hirao Mitsuru (Tohkai JPX) Hiraishi Atsushi (Hitachi JPX), Semiconductor circuit device having a plurality of SRAM type memory cell arrangement.
  5. Sun Shih-Wei (Austin TX) Kosa Yasunobu (Austin TX) Yeargain John R. (Austin TX), Structure for shielding conductors.
  6. Suski Edward D. (Lake Forest CA), Thin, flexible, stripline flex cable having two shielding ground planes formed as grids having mutually offset grid patt.

이 특허를 인용한 특허 (138)

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