초록 ▼

An electronic system that may include an electronic card sub-module that is electrically connected to, and in fluid communication with, an electronic card module. The electronic card module can be mated with a motherboard and coupled to a manifold of a cooling system that provides a cooling fluid to

An electronic system that may include an electronic card sub-module that is electrically connected to, and in fluid communication with, an electronic card module. The electronic card module can be mated with a motherboard and coupled to a manifold of a cooling system that provides a cooling fluid to the modules. The cooling fluid can flow directly onto integrated circuits or integrated circuit packages located within the modules. Each module may have an electrical connector and a fluid connector that allows the sub-module to be plugged into the module, and the module to be plugged into the motherboard and manifold without using any tools or hardware.

대표청구항 ▼

[ What is claimed is:] [1.] An electronic assembly, comprising:a manifold;a motherboard;an electronic card module that can be electrically connected to said motherboard, and coupled to said manifold to provide fluid communication with said manifold; and,an electronic card sub-module that can be elec

[ What is claimed is:] [1.] An electronic assembly, comprising:a manifold;a motherboard;an electronic card module that can be electrically connected to said motherboard, and coupled to said manifold to provide fluid communication with said manifold; and,an electronic card sub-module that can be electrically connected to said electronic card module and coupled to said electronic card module to provide fluid communication with said manifold.