초록 ▼

The present invention relates to injection mold hot runner control devices and more particularly to an injection molding control device which eliminates the conventional control cables to improve the quality of feedback signals received by the controller and the safety of the environment in which su

The present invention relates to injection mold hot runner control devices and more particularly to an injection molding control device which eliminates the conventional control cables to improve the quality of feedback signals received by the controller and the safety of the environment in which such systems are used. The present invention utilizes a signal processor to convert analog signals received from the mold temperature sensors into a digital feedback signal in the vicinity of the mold and to transmit such feedback signal to a receiver connected to a controller at a location remote from the mold. The mold controller processes the feedback signal and generates a corresponding control signal. The control signal is transmitted from the remotely located controller to the controlled device, typically the mold heaters. A single controller and a single mold signal processor may be used to be able to control numerous molds by utilizing signals on different lines or frequencies or in other means of signal differentiation known to those skilled in the art. The system of the present invention enables the injection mold user to eliminate the numerous problems, difficulties and repair costs of the prior art as well as enabling the user to gain an improved feedback loop that was not feasible under control systems of the prior art.

대표청구항 ▼

[ I claim:] [1.] An injection mold information transmitter apparatus, comprising:a) an injection mold;b) at least one sensor providing information from said injection mold;c) a thermally isolated enclosure;d) sensor input circuitry positioned within said thermally isolated enclosure and coupled to s

[ I claim:] [1.] An injection mold information transmitter apparatus, comprising:a) an injection mold;b) at least one sensor providing information from said injection mold;c) a thermally isolated enclosure;d) sensor input circuitry positioned within said thermally isolated enclosure and coupled to said injection mold sensor;e) an analog to digital signal converter located within said thermally isolated enclosure; andf) a controller located at a location remote from said thermally isolated enclosure, said controller arranged to receive digital signals from said converter based on the information from said sensors.