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Recovery of coolant and abrasive grains used in slicing semiconductor wafers 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B01D-021/01
출원번호 US-0801927 (1997-02-14)
우선권정보 JP-0033567 (1996-02-21)
발명자 / 주소
  • Toyama Kohei,JPX
  • Kiuchi Etsuo,JPX
  • Hayakawa Kazuo,JPX
  • Kaburagi Shingo,JPX
  • Ashida Akio,JPX
  • Ito Takara,JPX
  • Noami Kuniaki,JPX
출원인 / 주소
  • Hitachi Zosen Metal Works Co., Ltd., JPX
대리인 / 주소
    Nikaido, Marmelstein, Murray & Oram LLP
인용정보 피인용 횟수 : 19  인용 특허 : 9

초록

A system for reusing water soluble slurry waste fluid wherein separated available abrasive grains and extracted water soluble coolant are reused. This system is capable of reducing a disposal cost due to a reduction of a load to a waste water disposal plant by effectively reusing water soluble slurr

대표청구항

[ What is claimed is:] [1.] A process for reusing water soluble slurry waste fluid used when semiconductor ingots are sliced with a wire saw slicing apparatus, which comprises the steps of:(a) decreasing viscosity of water soluble slurry waste fluid(b) separating the water soluble slurry waste fluid

이 특허에 인용된 특허 (9)

  1. Blankers Joel D. (Kentwood MI) Tan Archie (Roswell GA), Abrasive water jet catch tank media transporting means.
  2. Becker Roger T. (Kalamazoo MI), Coolant reclamation unit.
  3. Allen ; Eddy, Filtration process for separating particles from liquid coolants in lens grinding devices.
  4. Hayashi Yoshihiro (Tokyo JPX) Yabe Kouichi (Yokohama JPX) Mizuniwa Tetsuo (Yokosuka JPX), Method for recovering abrasive particles.
  5. Trischuk Ronald W. (Northborough MA) Garg Ajay K. (Northborough MA) Khaund Arup K. (Northborough MA), Reclamation of abrasive grain.
  6. Dankoff Joseph Daniel (P.O. Box 19 ; R.D. 5 Latrobe PA 15650) Snyder David Kent (1167 Ridgeview Drive Latrobe PA 15650), Reclamation of components from grinding swarf.
  7. Holman ; Jr. James L. (Rolla MO) Neumeier Leander A. (Rolla MO), Recovery of metals from grinding sludges.
  8. Benson Dan T. (Joplin MO), System for separating abrasive material from a fluid used in fluid jet cutting.
  9. Krillic Hobart M. (South Holland IL) Leary Edward F. (Western Springs IL), Treatment of industrial grinding and cutting lubricants.

이 특허를 인용한 특허 (19)

  1. Takahashi, Atsushi; Nagai, Yuuki; Maezawa, Akihiro, Abrasive material regeneration method and regenerated abrasive material.
  2. Morris, Samuel J; Zamora Morris, Glenna V, Fluid lubricant and material shavings recapture system for a cutting operation.
  3. Smith, Craig Roland; White, David A., Fluid waster diversion system.
  4. Osuda, Hiroshi; Matoba, Toru; Fukuizumi, Masataka, Method and apparatus for reuse of abrasive fluid used in the manufacture of semiconductors.
  5. Osuda,Hiroshi; Matoba,Toru; Fukuizumi,Masataka, Method and apparatus for reuse of abrasive fluid used in the manufacture of semiconductors.
  6. Dalitz, Lothar; Berndt, Rolf, Method and system for manufacturing wafer-like slices from a substrate material.
  7. Eisner, Peter; Malberg, Andreas; Menner, Michael; Borcherding, Axel, Method for separating a machining suspension into fractions.
  8. Takahashi, Atsushi; Nagai, Yuuki; Maezawa, Akihiro, Method for separating polishing material and regenerated polishing material.
  9. Zavattari Carlo,ITX ; Fragiacomo Guido,ITX, Method for the separation, regeneration and reuse of an exhausted glycol-based slurry.
  10. Berndt, Rolf; Ruth, Jochen, Method for treating spent abrasive slurry.
  11. Eisner, Peter; Menner, Michael, Methods for fractionating a machining suspension using destabilization and separation steps.
  12. Pancaldi, Fabio; Gallocchio, Vanni, Plant and method for the treatment of the recovery cooling fluid in mechanical processing plants.
  13. Fragiacomo, Guido, Process and apparatus for treating exhausted abrasive slurries for the recovery of their reusable components.
  14. Baldwin, Philip N.; Beatty, Raymond E.; Day, James E.; Guy, Gary J., Process for rapid colloidal suspension removal.
  15. Raghavan, Chidambaram; Coker, Tanner; Thomas, Ann; O'Connor, James M.; Olsen, John H., Reducing small colloidal particle concentrations in feed and/or byproduct fluids in the context of waterjet processing.
  16. Raghavan, Chidambaram; Coker, Tanner; Thomas, Scott; O'Connor, James M.; Olsen, John H., Reducing small colloidal particle concentrations in feed and/or byproduct fluids in the context of waterjet processing.
  17. Hiroshi Oishi JP; Keiichiro Asakawa JP; Junichi Matsuzaki JP; Akio Ashida JP, Slurry useful for wire-saw slicing and evaluation of slurry.
  18. Gaudet, Gregory; Grumbine, Steven; Naguib, Nevin; Batllo, Francois, Wire saw slurry recycling process.
  19. Grumbine, Steven; Naguib Sant, Nevin, Wiresaw cutting method.
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