초록 ▼

One-component hot-curing structural adhesives based on liquid rubbers, which may optionally contain functional groups, solid rubbers, thermoplastic polymer powders and sulfur and also vulcanization accelerators are suitable for bonding metal parts. Tensile shear strengths of more than 15 MPa and hig

One-component hot-curing structural adhesives based on liquid rubbers, which may optionally contain functional groups, solid rubbers, thermoplastic polymer powders and sulfur and also vulcanization accelerators are suitable for bonding metal parts. Tensile shear strengths of more than 15 MPa and high breaking elongations of more than 15% can be obtained. These adhesives are substantially free from low molecular weight epoxy resins and are particularly suitable for use in white-shell assembly in the car industry.

대표청구항 ▼

[ What is claimed is:] [1.] A one-component adhesive composition substantially free of epoxy resin and consisting essentially of:(a) at least one liquid rubber having a molecular, weight below 20,000 present in an amount of between 5% and 50% by weight,(b) at least one thermoplastic polymer powder h

[ What is claimed is:] [1.] A one-component adhesive composition substantially free of epoxy resin and consisting essentially of:(a) at least one liquid rubber having a molecular, weight below 20,000 present in an amount of between 5% and 50% by weight,(b) at least one thermoplastic polymer powder having an average particle size below 1 mm present in an amount of between 2% and 20% by weight, said thermoplastic polymer powder being selected from the group consisting of vinyl acetate homopolymers, vinyl acetate copolymers, ethylene/vinyl acetate copolymers, vinyl chloride homopolymers, vinyl chloride copolymers, styrene homopolymers, styrene/methacrylic acid copolymer (meth)acrylate homopolymers, (meth)acrylate copolymers, polyvinyl acetals, and mixtures thereof,(c) a vulcanization system for said composition comprised of a vulcanizing agent selected from the group consisting of elemental sulfur, thiuram disulfides, organic peroxides, polyfunctional amines, quinones, p-benzoquinone dioxime, p-nitrosobenzene, dinitrosobenzene and mixtures thereof,(d) at least one filler present in an amount of between 10% and 70% by weight, all weights being based on the weight of said composition; d composition being curable at a temperature of between 80.degree. C. and 240.degree. C., and when cured, having a breaking elongation according to DIN 53504 of more than about 15% and a tensile shear strength of at least 9.4 mPa and forming a permanent adhesive bond to a metal surface.