초록 ▼

A thermoelectric conversion module including a honeycomb structural body 3 made of an electrically insulating material, N type and P type semiconductor elements 1 and 2 inserted into through holes formed in the honeycomb structural body 3, electrically insulating filler members 4 filled in spaces be

A thermoelectric conversion module including a honeycomb structural body 3 made of an electrically insulating material, N type and P type semiconductor elements 1 and 2 inserted into through holes formed in the honeycomb structural body 3, electrically insulating filler members 4 filled in spaces between the semiconductor elements and inner walls of the through holes such that the semiconductor elements are fixed in position within respective through holes, and electrodes 7 connecting end surfaces of the semiconductor elements on polished end surfaces of the honeycomb structural body such that N type and P type semiconductor elements are alternately connected in series. According to the invention, the electrically insulating filler members are made of an inorganic adhesive of alkali metal silicate or sol-gel glass. Since undesired heat dissipation and heat transfer through adjacent semiconductor elements can be prevented and undesired oxidation and dissipation of the semiconductor elements during a usage can be effectively removed, a high output power can be attained stably for a long life time when the thermoelectric conversion module according to the invention is used in an electric power generating system using an exhausted heat. The higher and lower temperature side surfaces of the module can be shaped into any desired configuration.

대표청구항 ▼

[ What is claimed is:] [14.] A method of manufacturing a thermoelectric conversion module comprising the steps of:preparing a honeycomb structural body made of an electrically insulating material, having mutually opposing first and second end surfaces and having formed therein through holes extendin

[ What is claimed is:] [14.] A method of manufacturing a thermoelectric conversion module comprising the steps of:preparing a honeycomb structural body made of an electrically insulating material, having mutually opposing first and second end surfaces and having formed therein through holes extending from the first end surface to the second end surfaces, alternating one or more through holes being classified into a first group and the remaining through holes being classified into a second group;inserting N type semiconductor elements into the through holes belonging to the first group and P type semiconductor elements into the through holes belonging to the second group;filling spaces formed between semiconductor elements and inner walls of the through holes with an electrically insulating filling material made of an inorganic adhesive of alkali metal silicate or a sol-gel glass;drying and solidifying the electrically insulating filling material filled in the spaces to form electrically insulating filler members to obtain a module core;polishing at least one end surface of the module core; andconnecting alternating N type semiconductor elements or element groups and P type semiconductor elements or element groups in series by means of electrodes on said first and second end surfaces of the honeycomb structural body.