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Cooling apparatus for high-temperature medium by boiling and condensing refrigerant 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0082206 (1998-05-20)
우선권정보 JP-0139570 (1997-05-29)
발명자 / 주소
  • Terao Tadayoshi,JPX
  • Kobayashi Kazuo,JPX
  • Tanaka Hiroshi,JPX
  • Kawaguchi Kiyoshi,JPX
출원인 / 주소
  • Denso Corporation, JPX
대리인 / 주소
    Harness, Dickey & Pierce, PLC
인용정보 피인용 횟수 : 70  인용 특허 : 12

초록

In a cooling apparatus, a radiating part mounted on a refrigerant tank is made by stacking refrigerant tubes and fins alternately. A first header and a second header are provided at the ends of the refrigerant tubes. When the cooling apparatus is used in a vertical attitude, the first header is posi

대표청구항

[ What is claimed is:] [1.] A cooling apparatus for cooling a heat-emitting body by means of heat transport effected by boiling and condensing refrigerant, comprising:a refrigerant tank containing liquid refrigerant;a condensing vessel having a refrigerant tube into which vapor refrigerant boiled by

이 특허에 인용된 특허 (12)

  1. Berenholz Jack (Lexington MA) Bowman John K. (Brighton MA), Air cooled heat exchanger for multi-chip assemblies.
  2. Kadota Shigeru,JPX ; Furukawa Takashi,JPX ; Kawaguchi Kiyoshi,JPX ; Suzuki Masahiko,JPX ; Yamada Kenji,JPX, Cooling apparatus using boiling and condensing refrigerant.
  3. Osakabe Hiroyuki (Chita-gun JPX) Kawaguchi Kiyoshi (Toyota JPX) Suzuki Masahiko (Hoi-gun JPX), Cooling apparatus using boiling and condensing refrigerant.
  4. Osakabe Hiroyuki,JPX ; Furukawa Takashi,JPX ; Kawaguchi Kiyoshi,JPX ; Suzuki Masahiko,JPX ; Suzuki Manji,JPX, Cooling apparatus using boiling and condensing refrigerant.
  5. Osakabe Hiroyuki,JPX ; Kawaguchi Kiyoshi,JPX ; Suzuki Masahiko,JPX, Cooling apparatus using boiling and condensing refrigerant.
  6. Osakabe Hiroyuki,JPX ; Kawaguchi Kiyoshi,JPX ; Suzuki Masahiko,JPX ; Matsui Kazuma,JPX, Cooling apparatus using boiling and condensing refrigerant.
  7. Osakabe Hiroyuki,JPX ; Kawaguchi Kiyoshi,JPX ; Suzuki Masahiko,JPX ; Sugito Hajime,JPX ; Kobayashi Kazuo,JPX ; Kadota Shigeru,JPX, Cooling apparatus using boiling and condensing refrigerant.
  8. Ohashi Shigeo,JPX ; Hatada Toshio,JPX ; Tanaka Shinji,JPX, Cooling unit for electronic equipment.
  9. Tajima Makoto (Tokyo JPX), Electronic component cooling unit.
  10. Tajima Makoto,JPX, Electronic component cooling unit.
  11. Larson Ralph I. (Bolton MA) Phillips Richard J. (Alachua FL), Two-phase component cooler.
  12. Larson Ralph I. ; Phillips Richard L., Two-phase thermal bag component cooler.

이 특허를 인용한 특허 (70)

  1. Chen,Howard; Liu,Hsichang; Hsu,Louis; Mok,Lawrence, Apparatuses for dissipating heat from semiconductor devices.
  2. Kamula, Petri, Arrangement in a liquid cooler.
  3. Suzuki, Kazutaka, Boiling and condensing apparatus.
  4. Osakabe, Hiroyuki; Sugito, Hajime, Boiling and cooling apparatus.
  5. Yoshiyuki Okamoto JP, Boiling cooling system that exchanges heat between higher-temperature fluid and lower-temperature fluid.
  6. Suzuki, Kazuaki; Sato, Shigemasa; Idei, Akio, Boiling refrigerant type cooling system.
  7. Suzuki, Kazuaki; Sato, Shigemasa; Idei, Akio, Boiling refrigerant type cooling system.
  8. Ghosh, Debashis; Bhatti, Mohinder Singh; Reyzin, Ilya, Compact thermosiphon with enhanced condenser for electronics cooling.
  9. Tuomola, Juha, Cooling apparatus.
  10. Osakabe, Hiroyuki, Cooling apparatus boiling and condensing refrigerant.
  11. Sugito, Hajime, Cooling apparatus boiling and condensing refrigerant.
  12. Ohara, Takahide, Cooling apparatus boiling and condensing refrigerant with a refrigerant vapor passage having a large cross sectional area.
  13. Ohara, Takahide, Cooling apparatus boiling and condensing refrigerant with a refrigerant vapor passage having a larger cross sectional area.
  14. Tanaka, Hiroshi; Ohara, Takahide; Suzuki, Kazutaka; Kunikata, Yuhei; Yamaguchi, Hiroo, Cooling device.
  15. Tanaka, Hiroshi; Ohara, Takahide; Suzuki, Kazutaka; Kunikata, Yuhei; Yamaguchi, Hiroo, Cooling device.
  16. Hiroshi Tanaka JP; Tadayoshi Terao JP; Eitaro Tanaka JP; Takahide Ohara JP; Kiyoshi Kawaguchi JP, Cooling device boiling and condensing refrigerant.
  17. Sugito, Hajime; Tanaka, Hiroshi; Ohara, Takahide, Cooling device boiling and condensing refrigerant.
  18. Sugito,Hajime; Tanaka,Hiroshi, Cooling device boiling and condensing refrigerant.
  19. Toyoda, Hiroyuki; Nakajima, Tadakatsu; Kondo, Yoshihiro; Sasaki, Shigeyuki; Idei, Akio; Satoh, Shigemasa, Cooling system and electronic apparatus applying the same therein.
  20. Miyazaki, Ryuuji; Suzuki, Masumi; Hirano, Minoru, Cooling unit.
  21. Miyazaki, Ryuuji; Suzuki, Masumi; Hirano, Minoru, Cooling unit.
  22. Miyazaki,Ryuuji; Suzuki,Masumi; Hirano,Minoru, Cooling unit.
  23. Wang, Ching-Feng, Counter flow heat exchanger with integrated fins and tubes.
  24. DiGiacomo Giulio ; Iruvanti Sushumna ; Womac David J., Direct chip-cooling through liquid vaporization heat exchange.
  25. Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Electronic apparatus.
  26. Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Electronic apparatus.
  27. Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Electronic apparatus including liquid cooling unit.
  28. Dessiatoun, Serguei V.; Ivakhnenko, Igor, Enhanced heat transfer structure with heat transfer members of variable density.
  29. Agostini, Bruno; Yesin, Berk, Evaporator for a cooling circuit.
  30. Kuo Ching-Sung,TWX, Heat dissipating device.
  31. Agostini, Bruno; Agostini, Francesco, Heat exchanger.
  32. Agostini, Bruno; Torresin, Daniele; Agostini, Francesco; Habert, Mathieu, Heat exchanger.
  33. Valenzuela,Javier A.; Jasinski,Thomas J., Heat exchanger.
  34. Yesin, Berk; Agostini, Bruno, Heat exchanger.
  35. Unger, Michael, Heat exchanger with recessed fins.
  36. Wang, Evelyn N.; Brisson, John G.; Jacobson, Stuart A.; Lang, Jeffrey H.; McCarthy, Matthew, Heat exchangers and related methods.
  37. Kuo, Ching-Sung, Heat-dissipating device for electronic components.
  38. Wang, Chin-Wen, Hydronic pump type heat radiator.
  39. Chen Shiaw-Jong S. ; Hooey Roger J. ; Radke Robert E., Integrated active cooling device for board mounted electric components.
  40. Yang, Chih-Hao; Tung, Chao-Nien; Hou, Chuen-Shu; Liu, Tay-Jian, Integrated cooling system for electronic components.
  41. Ghosh, Debashis; Bhatti, Mohinder Singh, Integrated liquid cooled heat sink for electronic components.
  42. Lee,Hsieh Kun; Chen,Chun Chi; Zhang,Jianjun, Integrated liquid cooling system for electrical components.
  43. Lee,Hsieh Kun; Lai,Cheng Tien; Zhou,Shi Wen, Integrated liquid cooling system for electrical components.
  44. Lee,Hsieh Kun; Lai,Cheng Tien; Zhou,Zhi Yong, Integrated liquid cooling system for electrical components.
  45. Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Liquid cooling unit and heat exchanger therefor.
  46. Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Liquid cooling unit and heat receiver therefor.
  47. Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Liquid cooling unit and heat receiver therefor.
  48. Wang, Ching-Feng, Loop heat pipe modularized heat exchanger.
  49. Sun, Chien-Hung, Loop heat pipe structure with liquid and vapor separation.
  50. Reyzin,Ilya; Bhatti,Mohinder Singh; Joshi,Shrikant Mukund, Low profile thermosiphon.
  51. Yazawa, Kazuaki; Bar-Cohen, Avram, Method and apparatus for converting dissipated heat to work energy.
  52. Zuo,Jon; Dubble,Ernest H.; Ernst,Donald M., Modular heat sink.
  53. Agostini, Bruno, Multi-row thermosyphon heat exchanger.
  54. Huang Bin-Juine,TWX, Network-type heat pipe device.
  55. Valenzuela, Javier A., Normal-flow heat exchanger.
  56. Valenzuela, Javier A., Normal-flow heat exchanger.
  57. Valenzuela,Javier A., Normal-flow heat exchanger.
  58. Reyzin, Ilya; Bhatti, Mohinder Singh; Joshi, Shrikant Mukund; Ghosh, Debashis, Orientation insensitive thermosiphon assembly for cooling electronic components.
  59. Joshi, Yogendra; Murthy, Sunil S.; Nakayama, Wataru, Orientation-independent thermosyphon heat spreader.
  60. Sakamoto, Hitoshi; Yoshikawa, Minoru; Inaba, Kenichi; Hashiguchi, Takeya, Phase change cooler and electronic equipment provided with same.
  61. Lin, Shu-Ju, Radiation apparatus.
  62. Ushijima, Koichi, Semiconductor power module.
  63. DiPaolo, Frank E., Spiral copper tube and aluminum fin thermosyphon heat exchanger.
  64. Zhang, Chunbo; Gu, Yuandong; Kristoffersen, Martin; Kulacki, Francis A.; Krafthefer, Brian C., System and method that dissipate heat from an electronic device.
  65. Zhang, Chunbo; Gu, Yuandong; Kristoffersen, Martin; Kulacki, Francis A.; Krafthefer, Brian C., System and method that dissipate heat from an electronic device.
  66. Reyzin, Ilya; Bhatti, Mohinder Singh; Ghosh, Debashis; Joshi, Shrikant Mukund, Thermosiphon for electronics cooling with high performance boiling and condensing surfaces.
  67. Bhatti,Mohinder Singh; Reyzin,Ilya; Joshi,Shrikant Mukund, Thermosiphon for laptop computer.
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