초록 ▼

A power supply module package suitable for both high packaged power density and cost effective manufacture. In an exemplary embodiment, the power supply module includes: (1) at least one printed circuit board containing conductors for interconnecting components of the power supply, (2) a thermally c

A power supply module package suitable for both high packaged power density and cost effective manufacture. In an exemplary embodiment, the power supply module includes: (1) at least one printed circuit board containing conductors for interconnecting components of the power supply, (2) a thermally conductive baseplate or case operable for transferring heat generated inside the module to the outside environment, wherein the external package dimensions are of a sufficiently small size to allow the user the greatest flexibility in the design of the overall circuit assembly, (3) at least one power magnetic device operable for providing electrical isolation between the input and the output of the power module, and (4) a set of electrical leads to facilitate communication and power flow between the module and circuitry being powered. The present invention provides a highly compact, thermally conductive package for a power supply module (perhaps a DC/DC converter) that is cost effective, readily manufacturable, durable, and easily mounted to a circuit card, allowing the power module to, for example, form a portion of a distributed power architecture.

대표청구항 ▼

[ What is claimed is:] [1.] A power supply module having an input and an output, comprising:a circuit board containing conductors for interconnecting electrical components of said power supply module;a thermally conductive case having a substantially flat and rectangular base with an integral electr

[ What is claimed is:] [1.] A power supply module having an input and an output, comprising:a circuit board containing conductors for interconnecting electrical components of said power supply module;a thermally conductive case having a substantially flat and rectangular base with an integral electrically insulating layer, said base forming first and second short sides and first and second long sides, said flat base located substantially in parallel with said circuit board, said thermally conductive case forming a reservoir receiving said circuit board therein;a power semiconductor device mounted in a space between said circuit board and said thermally conductive case and in electrical communication with said circuit board, wherein said power semiconductor device has a body connected in thermal communication with said thermally conductive case;a power magnetic device in electrical communication with said power semiconductor device, said power magnetic device operable for transferring electrical power between said input and said output of said power supply module;a set of at least three input electrical leads and a set of at least five output electrical leads extending from said power supply module, said input and output leads operable to couple said power supply module to a printed circuit card;wherein said input leads are arranged in a row substantially parallel to said first short side of said base, said input leads comprising at least the functions V.sub.IN (+), V.sub.IN (-), and ENABLE, and said output leads are arranged in a row substantially parallel to said second short side of said base, said output leads comprising at least the functions V.sub.OUT (-), V.sub.OUT (-), SENSE(+), SENSE(-), and TRIM.