$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Piezoresistive pressure sensor with sculpted diaphragm

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01L-009/06
출원번호 US-0144118 (1998-08-31)
발명자 / 주소
  • Bryzek Janusz
  • Burns David W.
  • Cahill Sean S.
  • Nasiri Steven S.
  • Starr James B.
출원인 / 주소
  • Maxim Integrated Products, Inc.
대리인 / 주소
    Blakely, Sokoloff, Taylor & Zafman LLP
인용정보 피인용 횟수 : 44  인용 특허 : 65

초록

The present invention is a semiconductor pressure sensor. In one embodiment, the semiconductor pressure sensor includes a diaphragm having a first thickness and at least cone raised boss that is coupled to a first side of the diaphragm. The at least one raised boss increases the diaphragm thickness

대표청구항

[ What is claimed is:] [1.] A pressure sensor, comprising:a semiconductor diaphragm including a first side and a second side, and having a first thickness;a raised boss coupled to the first side of the diaphragm along an axis that divides the diaphragm into first and second portions, said raised bos

이 특허에 인용된 특허 (65)

  1. Kuisma Heikki (Helsinki FIX), Absolute pressure transducer.
  2. Bender Terrence D. (Hamel MN), Apparatus for mounting an absolute pressure sensor.
  3. Willcox Charles R. (Eden Prairie MN) Ley Kevin R. (Eagan MN) Petersen Eric P. (Minnetonka MN) Peitersen Larry A. (Chaska MN), Capacitive pressure sensor and reference with stress isolating pedestal.
  4. Donzier Eric P. (Blandy les Tours FRX) Rezgui Fadhel (Sceaux FRX), Diaphragm pressure sensor including anti-stock protection means and gradiomanometer incorporating such a sensor.
  5. Hocker G. Benjamin (5730 Covington Cir. Minnetonka MN 55345) Burns David W. (5537 1st Ave. South Minneapolis MN 55419) Akinwande Akintunde I. (9968 Nord Rd. Bloomington MN 55437) Horning Robert D. (4, Diaphragm-based-sensors.
  6. Bonne Ulrich (Hopkins MN) Maurer D. Joseph (Pearl City IL), Differential pressure sensor with stress reducing pressure balancing means.
  7. Di Giovanni Mario (Pacific Palisades CA), Displacement sensing transducer.
  8. Maudie Theresa (Phoenix AZ) Monk David J. (Mesa AZ), Electronic sensor assembly having metal interconnections isolated from adverse media.
  9. Bowman Ronald (Laguna Beach CA), Electrostatically bonded pressure transducers for corrosive fluids.
  10. Marshall James F. (St. Paul MN), Fabrication of semiconductor devices utilizing ion implantation.
  11. Glenn Max C. (Minnetonka MN) McMullen Raymond F. (Minnetonka MN), Flip-chip pressure transducer.
  12. Wamstad David B. (Roseville MN) Wilda Douglas W. (Ambler PA), Fluid pressure transmitter assembly.
  13. Hall ; II George R. (Euclid OH) White Jack M. (Novelty OH) Krechmery Roger L. (Mentor OH), Glass to metal seal.
  14. Kovacich John A. (Wauwatosa WI) Hoinsky Christopher C. (Huntington CT) Williams Donald G. (Sherman CT) Schiesser Robert A. (Ridgefield CT), Hermetic mounting system for a pressure transducer.
  15. Brown Clem H. (Scottsdale AZ) Wallace ; Jr. Daniel J. (Phoenix AZ) Velez Mario F. (Phoenix AZ), Hermetically sealed pressure sensor and method thereof.
  16. Lutz Mark A. (Minneapolis MN) Krueger William B. (Bloomington MN), High overpressure low range pressure sensor.
  17. Mathias Milton W. (El Paso CO), High performance glass to metal solder joint.
  18. Zias Arthur R. (Los Altos CA) Block Barry (Los Altos Hills CA) Mapes Kenneth W. (San Jose CA) Nystrom Norman L. (Sunnyvale CA) Cadwell Robert M. (Los Altos CA), High sensitivity miniature pressure transducer.
  19. Kurtz Anthony D. (Englewood NJ) Mallon Joseph R. (Alpine NJ), Integral transducer assemblies employing built-in pressure limiting.
  20. Lam Man K. (Colorado Springs CO) Mathias Milton W. (Colorado Springs CO), Low cost wet-to-wet pressure sensor package.
  21. Knecht Thomas A. (Eden Prairie MN) Romo Mark G. (Richfield MN), Media isolated differential pressure sensors.
  22. Adams Victor J. (Tempe AZ) Derrington Carl E. (East Greenbush NY), Membrane protected pressure sensor.
  23. Adams Victor J. (Tempe AZ), Method for forming a cast membrane protected pressure sensor.
  24. Hynecek Jaroslav (Bedford OH) Ko Wen H. (Cleveland Heights OH) Yon Eugene T. (Lyndhurst OH), Miniature pressure transducer for medical use and assembly method.
  25. Tobita Tomoyuki (Katsuta JPX) Yamamoto Yoshimi (Ibaraki JPX) Nagasu Akira (Ibaraki JPX) Aoki Ken\ichi (Katsuta JPX), Multi-function differential pressure sensor with thin stationary base.
  26. Cook James D. (1558 W. Harrison Ave. Freeport IL 61032) Drabowicz Albert W. (2847 Rte. 20 West Freeport IL 61032) Maurer D. Joseph (785 N. Silberman Rd. Pearl City IL 61062) Plagens Mark R. (1805 Nor, Offset pressure sensor.
  27. Kurtz Anthony D. (Teaneck NJ) Ned Alexander A. (Bloomingdale NJ), Piezoresistive accelerometer with enhanced performance.
  28. Maurer Dean J. (Freeport IL), Piezoresistive pressure transducer with a conductive elastomeric seal.
  29. Rosenberger Mark E. (Freeport IL), Piezoresistive pressure transducer with elastomeric seals.
  30. French Patrick J. (Yokosuka JPX) Shinohara Toshiro (Yokosuka JPX), Piezoresistive semiconductor device suitable for use in a pressure sensor.
  31. Guckel Henry (Madison WI) Sniegowski Jeffry (Oregon WI), Polysilicon resonating beam transducers and method of producing the same.
  32. Tobita Tomoyuki (Katsuta JPX) Sase Akira (Katsuta JPX), Pressure measuring sensor.
  33. Tominaga Tamotsu (Yokohama JPX) Mihara Teruyoshi (Yokohama JPX) Oguro Takeshi (Yokosuka JPX) Takeuchi Masami (Kokubunji JPX), Pressure sensor.
  34. Vowles David L. (Phoenix AZ) Brown Clem H. (Scottsdale AZ), Pressure sensor package for reducing stress-induced measurement error.
  35. Broden David A. (Chanhassen MN) Bischoff Brian J. (Eagan MN) Louwagie Bennett L. (Plymouth MN), Pressure sensor with high modules support.
  36. Brown Clem H. (Scottsdale AZ) Vowles David L. (Phoenix AZ), Pressure sensor with stress isolation platform hermetically sealed to protect sensor die.
  37. Glenn Max C. (Minnetonka MN) McMullen Raymond F. (Minnetonka MN) Wamstad David B. (Roseville MN), Pressure transducer.
  38. Karsmakers Mathijs Antonius (Eindhoven NL) Somers Gerardus Henricus Johannus (Eindhoven NL), Pressure transducer.
  39. Johnson Ralph H. (Plano TX) Brose ; II Ernest F. (Freeport IL), Pressure transducer with reduced offset signal.
  40. Knecht Thomas A. (Eden Prairie MN) Ruf James (Maple Grove MN) Schulte John P. (Eden Prairie MN), Pressure transducer with stress isolation for hard mounting.
  41. Johnson Ralph H. (Plano TX) Hines John R. (Richardson TX), Ribbed and bossed pressure transducer.
  42. Takahashi Minoru (Katsuta JPX) Tanigami Takahiko (Mito JPX) Uchiyama Kaoru (Katsuta JPX) Minorikawa Hitoshi (Mito JPX) Nishihara Motohisa (Katsuta JPX) Kawakami Kanji (Katsuta JPX) Suzuki Seiko (Hita, Semiconductor absolute pressure transducer assembly and method.
  43. Tobita Tomoyuki (Katsuta JPX) Sase Akira (Katsuta JPX) Yamamoto Yoshimi (Naka JPX) Shimada Satoshi (Hitachi JPX), Semiconductor pressure converting device.
  44. Frische Richard H. (Phoenix AZ), Semiconductor pressure sensor.
  45. Saigusa Tokuji (Tokyo JPX) Yamagata Michiaki (Tokyo JPX) Aga Toshio (Tokyo JPX), Semiconductor pressure sensor.
  46. Jerman John H. (Palo Alto CA), Semiconductor transducer or actuator utilizing corrugated supports.
  47. Jerman John H. (Palo Alto CA), Semiconductor transducer or actuator utilizing corrugated supports.
  48. Jerman John H. (Palo Alto CA), Semiconductor transducer or actuator utilizing corrugated supports.
  49. Rosvold ; Warren C., Semiconductor transducer packaged assembly.
  50. Kurtz Anthony D. (Englewood NJ) Mallon Joseph R. (Franklin Lakes NJ) Nunn Timothy A. (Ridgewood NJ), Semiconductor transducers employing flexure frames.
  51. Gragg ; Jr. John E. (Paradise Valley AZ), Silicon pressure sensor.
  52. Knecht Thomas A. (Chanhassen MN) Romo Mark G. (Eden Prairie MN), Silicon side by side coplanar pressure sensors.
  53. Loeppert Peter V. (Rolling Meadows IL) Graber Warren S. (Rolling Meadows IL), Silicon-on-silicon differential input sensors.
  54. Knecht Thomas A. (Chanhassen MN) Naumaan Ahmed (Bloomington MN) Rud ; Jr. Stanley E. (Eden Prairie MN), Solid state differential pressure sensor with overpressure stop and free edge construction.
  55. Youmans Albert P. (Cupertino CA), Solid state force transducer, support and method of making same.
  56. Wamstad David B. (Roseville MN), Stress sensitive semiconductor unit and housing means therefor.
  57. Marshall ; James F., Stress sensor apparatus.
  58. Hartlaub Jerome T. (New Brighton MN), Stress sensor diaphragms over recessed substrates.
  59. Frick Roger L. (Hackensack MN), Suspended diaphragm pressure sensor.
  60. Ramsey Jeffery E. (Newark CA) Bryzek Janusz (Fremont CA) Mallon ; Jr. Joseph R. (Fremont CA), Three part low cost sensor housing.
  61. Stephan Craig H. (Ann Arbor MI), Torsion beam accelerometer.
  62. Greenwood John C. (Harlow GB2), Transducer and method of making the same.
  63. Mallon Joseph R. (Franklin Lakes NJ) Kurtz Anthony D. (Englewood NJ), Transducer apparatus employing convoluted semiconductor diaphragms.
  64. Adams Victor J. (Tempe AZ), Unibody pressure transducer package.
  65. Sooriakumar K. (Scottsdale AZ) Monk David J. (Mesa AZ) Chan Wendy K. (Scottsdale AZ) Goldman Kenneth G. (Chandler AZ), Vertically integrated sensor structure and method.

이 특허를 인용한 특허 (44)

  1. Tan,Woei Wan; Ge,Pei; Tay,Eng Hock Francis; Phang,Jyh Siong, Capacitive pressure sensor with a cantilever member.
  2. Winkler, Bernhard; Zankl, Andreas; Pruegl, Klemens; Kolb, Stefan, Cavity structures for MEMS devices.
  3. Winkler, Bernhard; Zankl, Andreas; Pruegl, Klemens; Kolb, Stefan, Cavity structures for MEMS devices.
  4. Niblock, Trevor Graham Edward, Compact pressure-sensing device.
  5. Bryzek Janusz ; Burns David W. ; Nasiri Steven S. ; Cahill Sean S., Compensated semiconductor pressure sensor.
  6. Fornara, Pascal; Rivero, Christian, Device for detecting the thinning down of the substrate of an integrated circuit chip.
  7. August Richard J., Electronic component and method of manufacture.
  8. Petrova,Roumiana S.; Lim,Hee C., Flexible thin film pressure sensor.
  9. Chiou, Jen-Huang Albert; Chen, Shiuh-Hui Steven, Low pressure sensor device with high accuracy and high sensitivity.
  10. Kautzsch, Thoralf; Froehlich, Heiko; Vogt, Mirko; Stegemann, Maik, Method and structure for creating cavities with extreme aspect ratios.
  11. Kautzsch, Thoralf; Fröhlich, Heiko; Vogt, Mirko; Stegemann, Maik, Method and structure for creating cavities with extreme aspect ratios.
  12. Burchard, Bernd, Method for the production of micro-electromechanical semiconductor component.
  13. Schubert, Paul C., Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby.
  14. Shubert, Paul C., Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby.
  15. Behrendt, Andreas; Schreiber, Kai-Alexander; Sgouridis, Sokratis; Zgaga, Martin; Winkler, Bernhard, Methods for producing a cavity within a semiconductor substrate.
  16. Choi, Chang Auck; Je, Chang Han; Hwang, Gunn; Kim, Youn Tae; Jung, Sung Hae; Lee, Myung Lae; Lee, Sung Sik; Moon, Seok Hwan, Micro piezoresistive pressure sensor and manufacturing method thereof.
  17. Doelle, Michael, Micro-electromechanical semiconductor component.
  18. Doelle, Michael, Micro-electromechanical semiconductor component.
  19. Senf, Reinhard, Micro-electromechanical semiconductor component and method for the production thereof.
  20. Ten Have, Arnd, Micro-electromechanical semiconductor comprising stress measuring element and stiffening braces separating wall depressions.
  21. Zias,Art; Mauger,Phil; Cahill,Sean; Nystrom,Norm; Henning,Albert K., Micro-electromechanical sensor.
  22. Zias,Art; Mauger,Phil; Cahill,Sean; Nystrom,Norm; Henning,Albert K., Micro-electromechanical sensor.
  23. Ten Have, Arnd, Microelectromechanical semiconductor component that is sensitive to mechanical stresses, and comprises an ion implantation masking material defining a channel region.
  24. Jakobsen, Henrik, Micromechanical pressure sensing device.
  25. Jakobsen, Henrik, Micromechanical pressure sensing device.
  26. Burns,David W., Optical and electronic interface for optically coupled resonators.
  27. Burns,David W., Optically coupled resonant pressure sensor.
  28. Burns,David W., Optically coupled resonant pressure sensor and process.
  29. Burns, David W., Optically coupled resonator.
  30. Burns,David W., Optically coupled sealed-cavity resonator and process.
  31. Takeuchi, Junichi; Kinugawa, Takuya, Physical quantity sensor, altimeter, electronic apparatus, and moving object.
  32. Chiou, Jen-Huang Albert; Chen, Shiuh-Hui Steven, Piezoresistive pressure sensor device.
  33. Chiou, Jen-Huang Albert; Chen, Shiuh-Hui Steven, Pressure sensor device with anchors for die shrinkage and high sensitivity.
  34. Chiou, Jen-Huang Albert; Chen, Shiuh-Hui Steven, Pressure sensor device with high sensitivity and high accuracy.
  35. Haji-Sheikh, Michael J.; Morales, Gilberto, Pressure transducer with composite diaphragm.
  36. Haji-Sheikh, Michael J.; Morales, Gilberto, Pressure transducer with composite diaphragm.
  37. Ten Have, Arnd, Semiconductor component.
  38. Hattori,Seiji; Endo,Noboru, Semiconductor sensing device using different resistance types.
  39. Cook, James; Becke, Craig S.; Speldrich, Jamie, Sensor assembly.
  40. Ciminelli, Mario J., Strain gauge based sensor with improved linearity.
  41. Parness, Aaron; Carpenter, Kalind C.; Wiltsie, Nicholas, Terrain traversing device having a wheel with microhooks.
  42. Parness, Aaron; McKenzie, Clifford F., Terrain traversing device having a wheel with microhooks.
  43. Doering, Holger, Vertical membranes for pressure sensing applications.
  44. Kwa, Tom; Danielson, Don L., Weatherized direct-mount absolute pressure sensor.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트