초록 ▼

A method of and an apparatus for molding resin to seal electronic parts are adapted to use molding units to seal with molded resin materials electronic parts that are mounted on lead frames. Additional molding units are detachably mounted with respect to an already provided first molding unit in the

A method of and an apparatus for molding resin to seal electronic parts are adapted to use molding units to seal with molded resin materials electronic parts that are mounted on lead frames. Additional molding units are detachably mounted with respect to an already provided first molding unit in the molding apparatus, so that the number of the molding units can be arbitrarily adjusted. In this manner, the method and apparatus can be easily reconfigured or rearranged to be adapted to mass production or small production runs of the same or different types of molded parts. By simultaneously carrying out various process steps, the overall process time is reduced.

대표청구항 ▼

[ What is claimed is:] [1.] An apparatus for molding resin to seal electronic parts, comprising:a first molding unit having a mold, resin material supply pots arranged in said mold, resin pressurizing plungers provided on said pots, cavities provided in mold surfaces of said mold, and resin passages

[ What is claimed is:] [1.] An apparatus for molding resin to seal electronic parts, comprising:a first molding unit having a mold, resin material supply pots arranged in said mold, resin pressurizing plungers provided on said pots, cavities provided in mold surfaces of said mold, and resin passages arranged between said pots and said cavities;means for supplying unsealed lead frames having electronic parts mounted thereon and resin tablets into said molding unit;means for taking out said electronic parts from said molding unit to the exterior after said electronic parts have been sealed; andadditional ones of said molding unit that are detachably mountable with respect to said first molding unit, thereby freely and selectively increasing or decreasing the number of said molding units mounted together in said apparatus.