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Apparatus for indexing and affixing components to a substrate 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-010/08
  • F27D-003/12
  • F27B-009/06
  • B65G-043/10
출원번호 US-0905667 (1997-08-04)
발명자 / 주소
  • Neiconi Ovidiu
  • Becher Christopher Lee
  • Mangold Richard Lee
  • Keane Christopher John
출원인 / 주소
  • Motorola, Inc.
인용정보 피인용 횟수 : 29  인용 특허 : 10

초록

An apparatus (400) used for indexing and affixing components to a substrate includes a vacuum conveyor and a controller (816) for controlling operation of the apparatus (400). The conveyor includes pallets (102), first and second tracks (414, 416), first and second motors (502, 503), a vacuum source

대표청구항

[ What is claimed is:] [1.] An apparatus, comprising:a vacuum conveyor, comprising:a plurality of pallets for carrying a substrate;first and second linearly slidable tracks for guiding the plurality of pallets, wherein the first linearly slidable track is positioned above the second linearly slidabl

이 특허에 인용된 특허 (10)

  1. Stumpf Gnter O. (Hhenweg 13 7421 Mehrstetten ; Kr. Mnsingen DEX), Arrangement in a cutting apparatus for engaging and retaining a web-like material, particularly superposed material webs.
  2. Tsunabuchi Masashi (Tokyo JPX) Takeshita Taihei (Tokyo JPX) Ishikura Tadanori (Tokyo JPX) Takashima Akifumi (Tokyo JPX), Automatic reflow soldering apparatus.
  3. Panitz Janda K. G. (Edgewood NM) Jellison James L. (Albuquerque NM) Staley David J. (Los Lunas NM), Dry soldering with hot filament produced atomic hydrogen.
  4. Inoue Toshiaki (Tokyo JPX), Free flow conveyor.
  5. Takamori Hideyuki (Kumamoto JPX) Satoh Takami (Kumamoto JPX), Heat treatment device.
  6. Haas ; Sr. Franz (Vienna) Haas ; Jr. Franz (Leobendorf) Haas Johann (Klosterneuburg ATX), Interstage wafer block accumulation.
  7. Heller David (Basking Ridge NJ) Neville James (Springfield NJ), Method for transporting an article through process housing while minimizing a loss of a controlled atmosphere therefrom.
  8. Kondo Kenshi (Tokyo JPX), Printed circuit board soldering apparatus.
  9. Nakagawa Susumu (Kobe JPX) Hayashi Nobuhiro (Uji JPX) Nakagawa Hiroshi (Toyonaka JPX), Transport arrangement for movable members.
  10. Risley Robert F. ; Barkely Paul E. ; Lawless Gordon S., Vacuum conveyor.

이 특허를 인용한 특허 (29)

  1. Theriault, Martin; Boyce, Kristen; Rabia, Stephane, Apparatus and method for maintaining a dry atmosphere to prevent moisture absorption and allow demoisturization of electronic components.
  2. Canella, Robert L.; Ibarra, Tony T., Apparatus and method using rotational indexing for laser marking IC packages carried in trays.
  3. Steffen, Volker; Rodefeld, Dietrich, Apparatus for coating objects.
  4. Theriault, Martin; Rabia, Stephane; Uner, Jason, Apparatus for placing components on printed circuit boards.
  5. Hamada, Hiroaki; Takatori, Isao, Assembly/transport apparatus.
  6. Jackson James G.,CAX ; Hannebauer James B.,CAX, Circulating paddle positioning fence with flexible track.
  7. Clerkx, Eduard Renier Francisca; Dullemeijer, Ernst; Dings, Franciscus Cornelius, Conveyor assembly and method for conveying a substrate carrier.
  8. Schmidt Heinz,DEX, Conveyor lift and divert device with minimum overall height.
  9. Suhara, Shinsuke, Fragile-board supporting method, circuit-board supporting device, and electric-circuit manufacturing method.
  10. Rehm, Johannes, Heating device.
  11. Canella Robert L. ; Ibarra Tony T., Laser marking station with enclosure and method of operation.
  12. Canella,Robert L.; Ibarra,Tony T., Laser marking system for dice carried in trays and method of operation.
  13. Robert L. Canella ; Tony T. Ibarra, Laser marking system for dice carried in trays and method of operation.
  14. Bastacky Jeremy A. ; Reilly Robert, Method and apparatus for holding a printed circuit board during assembly.
  15. Canella, Robert L., Method of efficiently laser marking singulated semiconductor devices.
  16. Tandy,William D.; Street,Bret K., Methods for marking a bare semiconductor die including applying a tape having energy-markable properties.
  17. Tandy,William D.; Street,Bret K., Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape.
  18. Waki, Tatsunori; Hamada, Hiroaki, Overhead conveyor apparatus.
  19. Pfeiffer,Michael W; Johnson,Eric D., Precision conveyor.
  20. Heyer Fritz,DEX ; Roth Peter,DEX, Process and arrangement for heat treatment of two-dimensional objects.
  21. Canella Robert L. ; Ibarra Tony T., Self-aligning tray carrier apparatus with tilt feature.
  22. Ellens,Dan, Skillet power system.
  23. Arata Tsurusaki JP, Soldering method and apparatus.
  24. Bowie, Neil D.; Nan, Chang An, System and method to automate transport of electronic devices on an assembly line for testing.
  25. Cheung, Dason; Sotelo, Simon Medina; Avelar, Enrique; Lopez, Omar Garcia, Universal radio frequency shield removal.
  26. Cheung, Dason; Sotelo, Simon Medina; Avelar, Enrique; Lopez, Omar Garcia, Universal radio frequency shield removal.
  27. Micciche, Brian S.; Dingle, Brad M., Vacuum assisted walking beam apparatus.
  28. Connell, Michael E.; Jiang, Tongbi, Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive.
  29. Connell,Michael E.; Jiang,Tongbi, Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive.
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