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Method of making unreacted metal/aluminum sputter target 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B22F-003/02
출원번호 US-0926375 (1997-09-09)
발명자 / 주소
  • Annavarapu Suresh
  • Ettlinger John
  • Sica Tony
출원인 / 주소
  • Materials Research Corporation
대리인 / 주소
    Wood, Herron & Evans L.L.P.
인용정보 피인용 횟수 : 40  인용 특허 : 7

초록

A high performance, high density sputtering target and a method of making. An aluminum and non-aluminum reactive metal powder blend is subjected to cold pressing under pressure, machining, evacuating, and hot pressing under pressure. The aluminum and non-aluminum metal react directly to yield a high

대표청구항

[ Having described the invention, what is claimed is:] [22.] A method of making a high performance, high density sputter target, comprising:blending a powder of substantially pure non-aluminum metal capable of reacting with aluminum and a powder of substantially pure aluminum metal to form a uniform

이 특허에 인용된 특허 (7)

  1. Ecer, Gunes M., Consolidation of a part from separate metallic components.
  2. Krause Robert F. (Valparaiso IN) Bularzik Joseph H. (Munster IN) Kokal Harold R. (Glenwood IL), High density metal components manufactured by powder metallurgy.
  3. Kobayashi Tomio (Miyagi JPX) Kano Shoichi (Miyagi JPX) Maniwa Osamu (Miyagi JPX) Konno Seiki (Miyagi JPX) Sato Heikichi (Miyagi JPX), Magnetic transducer head.
  4. Marx Daniel R. (West Caldwell NJ), Magneto-optical alloy sputter targets.
  5. Couper Malcolm (Siggenthal-Station CHX), Method for producing a heat-resistant aluminum-alloy workpiece having high transverse ductility which is manufactured fr.
  6. Couper Malcolm J. (Station Siggenthal CHX), Powder-metallurgical process for the production of a green pressed article of high strength and of low relative density.
  7. Korb Georg (Muhl/Reutte ATX), Process for the manufacture of a target for cathodic sputtering.

이 특허를 인용한 특허 (40)

  1. Carden,Robin A., Apparatus and method for fabricating high purity, high density metal matrix composite materials and the product thereof.
  2. Nagano, Shozo; Hargarter, Hinrich; Li, Jianxing; Buehler, Jane, Conductive integrated circuit metal alloy interconnections, electroplating anodes; metal alloys for use as a conductive interconnection in an integrated circuit; and physical vapor deposition targets.
  3. Kardokus Janine K. ; Wu Chi tse ; Parfeniuk Christopher L. ; Buehler Jane E., Copper sputtering target assembly and method of making same.
  4. Kardokus, Janine K.; Wu, Chi tse; Parfeniuk, Christopher L.; Buehler, Jane E., Copper sputtering target assembly and method of making same.
  5. Kardokus, Janine K.; Wu, Chi tse; Parfeniuk, Christopher L.; Buehler, Jane E., Copper-containing sputtering targets, and methods of forming copper-containing sputtering targets.
  6. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
  7. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
  8. Miller, Steven A.; Kumar, Prabhat; Wu, Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf, Fine grained, non banded, refractory metal sputtering targets with a uniformly random crystallographic orientation, method for making such film, and thin film based devices and products made therefrom.
  9. Abney, Stephen; Vesci, Anthony; Sommers, Joseph F.; Schweitzer, Marc O'Donnell; Dickerson, Scott; Tiller, Jennifer Watia, Flow-formed chamber component having a textured surface.
  10. Dary, Francois-Charles; Gaydos, Mark; Loewenthal, William; Miller, Steven A.; Rozak, Gary; Volchko, Scott Jeffrey; Zimmermann, Stefan; Stawovy, Michael Thomas, Large-area sputtering targets.
  11. Bhatnagar, Ashish; Murugesh, Laxman; Gopalakrishnan, Padma, Localized surface annealing of components for substrate processing chambers.
  12. Lo Chi-Fung ; Draper Darryl ; Gilman Paul S., Method of making high density sputtering targets.
  13. Rozak, Gary Alan; Gaydos, Mark E.; Hogan, Patrick Alan; Sun, Shuwei, Method of making molybdenum containing targets comprising molybdenum, titanium, and tantalum or chromium.
  14. Rozak, Gary Alan; Gaydos, Mark E.; Hogan, Patrick Alan; Sun, Shuwei, Method of making molybdenum-containing targets comprising three metal elements.
  15. Kardokus, Janine K.; Wu, Chi tse; Parfeniuk, Christopher L.; Buehler, Jane E., Methods of forming copper-containing sputtering targets.
  16. Miller, Steven A.; Shekhter, Leonid N.; Zimmermann, Stefan, Methods of joining metallic protective layers.
  17. Miller, Steven A.; Shekhter, Leonid N.; Zimmermann, Stefan, Methods of joining metallic protective layers.
  18. Gaydos, Mark E.; Kumar, Prabhat; Miller, Steve; Mills, Norman C.; Rozak, Gary; Wu, Rong-Chein Richard, Methods of making molybdenum titanium sputtering plates and targets.
  19. Gaydos, Mark; Kumar, Prabhat; Miller, Steven A.; Mills, Norman C.; Rozak, Gary; Wu, Rong-Chein Richard, Methods of making molybdenum titanium sputtering plates and targets.
  20. Volchko, Scott Jeffrey; Zimmermann, Stefan; Miller, Steven A.; Stawovy, Michael Thomas, Methods of manufacturing high-strength large-area sputtering targets.
  21. Loewenthal, William; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets.
  22. Miller, Steven A.; Dary, Francois-Charles; Gaydos, Mark; Rozak, Gary, Methods of manufacturing large-area sputtering targets by cold spray.
  23. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets using interlocking joints.
  24. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets using interlocking joints.
  25. Miller, Steven A.; Kumar, Prabhat; Wu, Rong-chein Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf, Methods of rejuvenating sputtering targets.
  26. Rozak, Gary Alan; Gaydos, Mark E.; Hogan, Patrick Alan; Sun, Shuwei, Molybdenum containing targets for touch screen device.
  27. Rozak, Gary Alan; Gaydos, Mark E., Multi-block sputtering target and associated methods and articles.
  28. Rozak, Gary Alan; Gaydos, Mark E., Multi-block sputtering target and associated methods and articles.
  29. Rozak, Gary Alan; Gaydos, Mark E; Michaluk, Christopher, Multi-block sputtering target with interface portions and associated methods and articles.
  30. Wilhartitz, Peter; Sch?nauer, Stefan; Polcik, Peter, Process for manufacturing an evaporation source.
  31. Shekhter, Leonid N.; Miller, Steven A.; Haywiser, Leah F.; Wu, Rong-Chein R., Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof.
  32. Scheible, Kathleen; Flanigan, Michael Allen; Yoshidome, Goichi; Allen, Adolph Miller; Pavloff, Cristopher M., Process kit and target for substrate processing chamber.
  33. Young, Donny; Ritchie, Alan Alexander; Hong, Ilyoung (Richard); Scheible, Kathleen A., Process kit components for titanium sputtering chamber.
  34. Pavloff, Cristopher Mark; Hong, Ilyoung, Process kit for substrate processing chamber.
  35. Allen, Adolph Miller; Yoon, Ki Hwan; Guo, Ted; Yang, Hong S.; Yu, Sang-Ho, Sputtering target having increased life and sputtering uniformity.
  36. Riker, Martin; Wang, Wei W., Substrate cleaning chamber and components.
  37. Miller, Keith A.; Lavitsky, Ilya, Support ring assembly.
  38. Bhatnagar, Ashish; Murugesh, Laxman; Gopalakrishnan, Padma, Surface annealing of components for substrate processing chambers.
  39. Ritchie, Alan Alexander; Young, Donny; Hong, Ilyoung (Richard); Scheible, Kathleen A.; Kelkar, Umesh, Target for sputtering chamber.
  40. Rozak, Gary Alan; Gaydos, Mark E.; Hogan, Patrick Alan; Sun, Shuwei, Touch screen device comprising Mo-based film layer and methods thereof.
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