초록 ▼

A constraining ring increases the modulus of an interconnect substrate to maintain flatness of the substrate. The constraining ring is made of materials selected to match the coefficient of thermal expansion of the substrate to that of the constraining ring. Circuit components including capacitors a

A constraining ring increases the modulus of an interconnect substrate to maintain flatness of the substrate. The constraining ring is made of materials selected to match the coefficient of thermal expansion of the substrate to that of the constraining ring. Circuit components including capacitors and resistors are formed on the constraining ring to provide enhanced electrical properties without adding to the size of the device.

대표청구항 ▼

[ What is claimed is:] [1.] A chip package comprising:an interconnect substrate having a coefficient of thermal expansion (CTE), a modulus of elasticity, first and second opposite surfaces, peripheral edges, and a central chip mounting area on the first surface;an adhesive layer; anda substantially

[ What is claimed is:] [1.] A chip package comprising:an interconnect substrate having a coefficient of thermal expansion (CTE), a modulus of elasticity, first and second opposite surfaces, peripheral edges, and a central chip mounting area on the first surface;an adhesive layer; anda substantially planar constraining ring having a CTE, a modulus of elasticity, first and second opposite surfaces, outer peripheral edges and a central opening, the substantially planar constraining ring being a laminate having at leastone conductive layer and at least one dielectric layer, andwherein the first surface of the substantially planar constraining ring is bonded, by the adhesive layer, to the first surface of the interconnect substrate such that the central opening of the substantially planar constraining ring is positioned over said central chip mounting area of the first surface of the interconnect substrate, andwherein the CTE of the interconnect substrate is within +/-20% of the CTE of the substantially planar constraining ring and the modulus of elasticity of the interconnect substrate differs from the modulus of elasticity of the substantially planar constraining ring.