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Boron doping by decaborane 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-014/14
출원번호 US-0762853 (1996-12-06)
발명자 / 주소
  • Goto Kenichi,JPX
  • Kase Masataka,JPX
  • Matsuo Jiro,JPX
  • Yamada Isao,JPX
  • Takeuchi Daisuke,JPX
  • Toyoda Noriaki,JPX
  • Shimada Norihiro,JPX
출원인 / 주소
  • Japan Science and Technology Corporation, JPX
대리인 / 주소
    Armstrong, Westerman, Hattori, McLeland & Naughton
인용정보 피인용 횟수 : 41  인용 특허 : 7

초록

A method of manufacturing a semiconductor device comprising the steps of: ionizing decaborane; and implanting ionized decaborane into a silicon wafer. Solid decaborane can be vaporized in a reduced pressure atmosphere or by heating. A single decaborane molecule can provide 10 boron atoms while the a

대표청구항

[ What we claim is:] [1.] A method of implanting ions comprising the steps of:vaporizing solid decaborane (B.sub.10 H.sub.14) to generate vaporized decaborane molecules;ionizing the vaporized decaborane molecules to generate decaborane ions; andaccelerating the decaborane ions by electric field to i

이 특허에 인용된 특허 (7)

  1. Nishizawa Junichi (Miyagi JPX) Aoki Kenji (Tokyo JPX), Impurity doping method with adsorbed diffusion source.
  2. Sioshansi Piran (Bedford MA), Ion implanation of titanium workpieces without surface discoloration.
  3. Lagendijk Andre (Oceanside CA) Riahi Shantia (Vista CA), Ion implant using tetrafluoroborate.
  4. Sato Hiroya (Tenri JPX) Kinosada Toshiaki (Izumi JPX) Nakagawa Yasuhito (Nara JPX), Method for the production of a semiconductor device by implanting fluorocarbon ions.
  5. Young Andrew W. ; Smith Don D., Method of forming a dielectric film.
  6. Fukuda Hisashi (Tokyo JPX), Method of ion implantation.
  7. Saito Naoto (Tokyo JPX) Aoki Kenji (Tokyo JPX) Akamine Tadao (Tokyo JPX) Kojima Yoshikazu (Tokyo JPX) Takahashi Kunihiro (Tokyo JPX) Kinbara Masahiko (Tokyo JPX), Method of producing field effect transistor.

이 특허를 인용한 특허 (41)

  1. Lee, W. Davis; Tieger, Daniel R., Aromatic molecular carbon implantation processes.
  2. Yih-Feng Chyan ; Chung Leung, Bipolar semiconductor device and method of forming same having reduced transient enhanced diffusion.
  3. Koike, Kunihiko; Senoo, Takehiko; Yoshino, Yu; Azuma, Shuhei; Matsuo, Jiro; Seki, Toshio; Ninomiya, Satoshi, Cluster jet processing method, semiconductor element, microelectromechanical element, and optical component.
  4. Ray, Andrew M., Control of particles on semiconductor wafers when implanting boron hydrides.
  5. Horsky, Thomas N.; Milgate, III, Robert W., Controlling the flow of vapors sublimated from solids.
  6. Koezuka,Junichi; Suzuki,Naoki, Doping method and method of manufacturing field effect transistor.
  7. Nakamura, Osamu, Doping method, doping apparatus, and control system for doping apparatus.
  8. Nakamura,Osamu, Doping method, doping apparatus, and control system for doping apparatus.
  9. Thomas N. Horsky, Electron beam ion source with integral low-temperature vaporizer.
  10. Kirkpatrick,Allen R.; Kirkpatrick,Sean; Tabat,Martin D.; Tetreault,Thomas G.; Borland,John O.; Hautala,John J.; Skinner,Wesley J., Formation of doped regions and/or ultra-shallow junctions in semiconductor materials by gas-cluster ion irradiation.
  11. Borland,John O.; Hautala,John J.; Skinner,Wesley J., Formation of ultra-shallow junctions by gas-cluster ion irradiation.
  12. Horsky, Thomas N.; Jacobson, Dale C., Ion implantation device and a method of semiconductor manufacturing by the implantation of boron hydride cluster ions.
  13. Horsky, Thomas N.; Jacobson, Dale C., Ion implantation device and a method of semiconductor manufacturing by the implantation of boron hydride cluster ions.
  14. Horsky,Thomas N.; Jacobson,Dale C., Ion implantation device and a method of semiconductor manufacturing by the implantation of boron hydride cluster ions.
  15. England, Jonathan Gerald; Hatem, Christopher R.; Scheuer, Jay Thomas; Olson, Joseph C., Ion implantation device with a dual pumping mode and method thereof.
  16. Koezuka,Junichi; Shinoda,Hiroto, Ion implantation method and method for manufacturing semiconductor device.
  17. Koezuka,Junichi; Shinoda,Hiroto, Ion implantation method and method for manufacturing semiconductor device.
  18. Horsky, Thomas N.; Milgate, III, Robert W.; Sacco, Jr., George P.; Jacobson, Dale C.; Krull, Wade A., Method and apparatus for extending equipment uptime in ion implantation.
  19. Horsky, Thomas N.; Milgate, III, Robert W.; Sacco, Jr., George P.; Jacobson, Dale C.; Krull, Wade A., Method and apparatus for extending equipment uptime in ion implantation.
  20. Horsky, Thomas N.; Milgate, III, Robert W.; Sacco, Jr., George P.; Jacobson, Dale Conrad; Krull, Wade Allen, Method and apparatus for extracting ions from an ion source for use in ion implantation.
  21. Horsky, Thomas N.; Milgate, III, Robert W.; Sacco, Jr., George P.; Jacobson, Dale Conrad; Krull, Wade Allen, Method and apparatus for extracting ions from an ion source for use in ion implantation.
  22. Alexander S. Perel, Method and system for icosaborane implantation.
  23. Cook, Kevin S.; Manning, Dennis; McIntyre, Edward K.; Goldberg, Richard, Method for extending equipment uptime in ion implantation.
  24. Sohn, Yong-Sun; Joo, Sung-Jae, Method for fabricating semiconductor device with ultra-shallow super-steep-retrograde epi-channel by decaborane doping.
  25. Sasaki, Yuichiro; Mizuno, Bunji; Jin, Cheng Guo, Method for introducing impurities and apparatus for introducing impurities.
  26. Sasaki, Yuichiro; Mizuno, Bunji; Jin, Cheng-Guo, Method for introducing impurities and apparatus for introducing impurities.
  27. Sasaki, Yuichiro; Mizuno, Bunji; Jin, Cheng-Guo, Method for introducing impurities and apparatus for introducing impurities.
  28. Sasaki, Yuichiro; Mizuno, Bunji; Jin, Cheng-Guo, Method for introducing impurities and apparatus for introducing impurities.
  29. Sasaki, Yuichiro; Mizuno, Bunji; Jin, Cheng-Guo, Method for introduction impurities and apparatus for introducing impurities.
  30. Sasaki, Yuichiro; Jin, Cheng-Guo; Mizuno, Bunji, Method for making junction and processed material formed using the same.
  31. Tieger, Daniel R.; Splinter, Patrick R., Methods for implanting B22Hx and its ionized lower mass byproducts.
  32. Goldberg, Richard David, Monatomic boron ion source and method.
  33. Goldberg,Richard David, Monatomic boron ion source and method.
  34. Goldberg, Richard David, Monatomic dopant ion source and method.
  35. Hsiao, Tsai Fu; Chien, Chin Cheng; Huang, Kuo Tai, Salicide process utilizing a cluster ion implantation process.
  36. Krull, Wade A.; Jacobson, Dale C., Semiconductor device and method of fabricating a semiconductor device.
  37. Krull, Wade A; Jacobson, Dale C., Semiconductor device and method of fabricating a semiconductor device.
  38. Wu David ; Ju Dong-Hyuk, Semiconductor device and method of manufacturing a semiconductor device having an improved gate electrode profile.
  39. Lee, William Davis, Silaborane implantation processes.
  40. Arevalo, Edwin A.; Hatem, Christopher R.; Renau, Anthony; England, Jonathan Gerald, Techniques for forming shallow junctions.
  41. Vella, Michael C., Thermal regulation of an ion implantation system.
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