초록 ▼

A chip card for the contactless transmission of electric signals to a terminal includes a card body in which a coupling element having conductor tracks and contact connections, and a semiconductor chip having an electronic circuit associated with the coupling element, are constructed in an integrate

A chip card for the contactless transmission of electric signals to a terminal includes a card body in which a coupling element having conductor tracks and contact connections, and a semiconductor chip having an electronic circuit associated with the coupling element, are constructed in an integrated manner. The semiconductor chip is provided on its surface with contact elements for electrical connection of the electronic circuit and the contact connections of the coupling element. A carrier made of an electrically insulating material supports at least part of the conductor tracks and the contact connections of the coupling element. The carrier is provided with an aperture in the vicinity of the contact connections of the coupling element, for receiving the semiconductor chip.

대표청구항 ▼

[ We claim:] [1.] A chip card for the contactless transmission of electric signals to a terminal, comprising:a card body having an integrated coupling element with conductor tracks and contact connections and an integrated semiconductor chip with a surface, given dimensions and an electronic circuit

[ We claim:] [1.] A chip card for the contactless transmission of electric signals to a terminal, comprising:a card body having an integrated coupling element with conductor tracks and contact connections and an integrated semiconductor chip with a surface, given dimensions and an electronic circuit associated with said coupling element;contact elements disposed on said surface of said semiconductor chip for electrical connection of said electronic circuit and said contact connections of said coupling element;a carrier of an electrically insulating material supporting at least a part of said conductor tracks and said contact connections of said coupling element; andsaid carrier having an aperture formed therein in the vicinity of said contact connections of said coupling element, said aperture corresponding to said given dimensions for receiving said semiconductor chip, and said conductor tracks of said coupling element led across said aperture.