초록 ▼

A method and apparatus for visually inspecting and sorting semiconductor wafers and the individual microcircuits or chips thereon. The preferred embodiment employs a scanner to obtain a virtual reality image of the wafer and all chips are identified and sorted by applying high-speed image processing

A method and apparatus for visually inspecting and sorting semiconductor wafers and the individual microcircuits or chips thereon. The preferred embodiment employs a scanner to obtain a virtual reality image of the wafer and all chips are identified and sorted by applying high-speed image processing routines. The resulting wafer map provides unique image controlled chip coordinates making the chips identifiable even after the chips are diced apart. The wafer may contain different kinds of chips in irregular patterns. A gross-defect, visual inspection sorts out defective chips based on image completeness maximizing the yield and throughput. All inspections and identifications are performed on the virtual wafer or chip images scanned into a computer memory with full physical wafer correlation but without having to manipulate the wafer. The inspection time is, therefore, largely free due to overlapping it by regular transport operations.

대표청구항 ▼

[ We claim:] [1.] In a method for investigating electronic circuit devices for manufacturing defects, the steps of:(a) converting intuitive criteria used to investigate an electronic circuit device for manufacturing defects to specific numerical criteria;(b) programming a computer with said criteria

[ We claim:] [1.] In a method for investigating electronic circuit devices for manufacturing defects, the steps of:(a) converting intuitive criteria used to investigate an electronic circuit device for manufacturing defects to specific numerical criteria;(b) programming a computer with said criteria;(c) acquiring information in said programmed computer defining an electronic circuit device by scanning in an image of said device and operating on said virtual images rather than manipulating the physical device;(d) using said computer to apply said specific numerical criteria defined by said program to said information to identify regions of said electronic circuit device to be investigated, said information defining a manufacturing defect.