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Heat exchange apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
출원번호 US-0090008 (1998-06-03)
발명자 / 주소
  • Batchelder John Samuel
인용정보 피인용 횟수 : 75  인용 특허 : 9

초록

An apparatus to transfer heat from a heat source to a heat absorber, the apparatus consisting of a thermally conductive rotor, a thermal transfer fluid, and a composite substrate with an internal cavity containing the thermally conductive rotor and the thermal transfer fluid. The surface of the comp

대표청구항

[ The invention claimed is:] [1.] An apparatus for transferring heat from a heat producing component to a heat absorbing component, comprising:a) a thermal transfer fluid;b) a composite substrate containing an interior cavity, the composite substrate having a surface, a first portion of the interior

이 특허에 인용된 특허 (9)

  1. Cheon Kioan, Cooling system for computer.
  2. Maling ; Jr. George C. (Poughkeepsie NY) Schmidt Roger R. (Poughkeepsie NY), Disk augmented heat transfer system.
  3. Tousignant Lew A. (Shoreview MN), Flexible thermal transfer apparatus for cooling electronic components.
  4. Niggemann Richard E. (Rockford IL), Heat exchanger apparatus for electrical components.
  5. Avery Randall N. (Bogart GA), Heat exchangers and electrical apparatus having heat exchangers.
  6. Nakayama Wataru (Kashiwa JPX) Nakajima Tadakatsu (Ibaraki JPX) Hirasawa Shigeki (Ibaraki JPX) Kohno Akiomi (Ibaraki JPX) Takenaka Takaji (Hatano JPX), Heat transfer apparatus.
  7. Iversen Arthur H. (Saratoga CA), Multi-chip module cooling.
  8. Hamilton Robin E. ; Kennedy Paul G. ; Vale Christopher R., Non-mechanical magnetic pump for liquid cooling.
  9. Wiech ; Jr. Raymond E. (San Diego CA), Substrate cooling.

이 특허를 인용한 특허 (75)

  1. Sanjay K. Roy, Active cold plate/heat sink.
  2. Hanson, George E., Active heat sink.
  3. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K., Adhesive applications using alkali silicate glass for electronics.
  4. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K.; Hillman, David D., Alkali silicate glass based coating and method for applying.
  5. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K.; Hillman, David D., Alkali silicate glass based coating and method for applying.
  6. Sampica, James D.; Barnidge, Tracy J.; Tchon, Joseph L.; Lower, Nathan P.; Wilcoxon, Ross K.; Dudley, Sandra S., Alkali silicate glass for displays.
  7. Lower, Nathan P.; Nemeth, Paul R.; Wilcoxon, Ross K., Antiglare treatment for glass.
  8. Porter, George K.; Wolf, Seth B.; Albrecht, Charles W., Atomizer.
  9. Hoover,David S.; Petkie,Ronald R., CVD diamond enhanced microprocessor cooling system.
  10. Lopatinsky,Edward L.; Schaefer,Dan K.; Rosenfeld,Saveliy T.; Fedoseyev,Lev A., Cooler for electronic devices.
  11. Breier,Anton; Kamagata,Hidetoshi, Cooling apparatus.
  12. Ghoshal, Uttam; Miner, Andrew Carl, Cooling of electronics by electrically conducting fluids.
  13. Ghoshal,Uttam; Miner,Andrew Carl, Cooling of electronics by electrically conducting fluids.
  14. Eriksen, André Sloth, Cooling system for a computer system.
  15. Eriksen, André Sloth, Cooling system for a computer system.
  16. Eriksen, André Sloth, Cooling system for a computer system.
  17. Eriksen, André Sloth, Cooling system for a computer system.
  18. Eriksen, André Sloth, Cooling system for a computer system.
  19. Ghoshal,Uttam, Counterflow thermoelectric configuration employing thermal transfer fluid in closed cycle.
  20. Ranish, Joseph M.; Brillhart, Paul, Dome cooling using compliant material.
  21. Foster, Sr.,Jimmy Grant; June,Michael Sean; Makley,Albert Vincent; Matteson,Jason Aaron, Dual impeller push-pull axial fan.
  22. Foster, Sr.,Jimmy Grant; June,Michael Sean; Makley,Albert Vincent; Matteson,Jason Aaron, Dual impeller push-pull axial fan heat sink.
  23. Foster, Sr.,Jimmy Grant; June,Michael Sean; Makley,Albert Vincent; Matteson,Jason Aaron, Dual impeller push-pull axial fan heat sink.
  24. Foster, Sr.,Jimmy Grant; June,Michael Sean; Makley,Albert Vincent; Matteson,Jason Aaron, Dual impeller push-pull axial fan sink.
  25. Holahan, Maurice F.; Kline, Eric V.; Krystek, Paul N.; Rasmussen, Michael R.; Sinha, Arvind K.; Zins, Stephen M., Dual magnetically coupled rotor heat exchanger.
  26. Bird, John; Larson, Ralph I.; North, Lyne Dor?; Bussiere, Paul; Allen, Amy, Electronics cooling subassembly.
  27. Lower, Nathan P.; Wilcoxon, Ross K.; Wooldridge, James R.; Dlouhy, David W., Fabrication process for a flexible, thin thermal spreader.
  28. Porter, George K.; Wolf, Seth B.; Albrecht, Charles W., Flow controller.
  29. Wotring Blaine C., Folded fin heat sink and a heat exchanger employing the heat sink.
  30. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P.; Wyckoff, Nathaniel P.; Hamilton, Brandon C., Glass thick film embedded passive material.
  31. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P.; Wyckoff, Nathaniel P.; Hamilton, Brandon C., Glass thick film embedded passive material.
  32. Okochi Takaki,JPX ; Yamaguchi Hiroo,JPX ; Hayashi Takayuki,JPX ; Kafuku Kazuaki,JPX, Heat generating element cooling unit with louvers.
  33. Miyahara Masaharu,JPX ; Suga Kenji,JPX ; Tada Hisao,JPX ; Tate Sumio,JPX ; Sugimoto Kazuhiko,JPX, Heat sink unit for cooling a plurality of exothermic units, and electronic apparatus comprising the same.
  34. Bhatti,Mohinder Singh; Reyzin,Ilya; Joshi,Shrikant Mukund, High performance thermosiphon with internally enhanced condensation.
  35. Roy,Sanjay K., Impeller driven active heat sink.
  36. Morris, Terrel L.; Belady, Christian L, Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump.
  37. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P., Integrated circuit protection and ruggedization coatings and methods.
  38. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P., Integrated circuit protection and ruggedization coatings and methods.
  39. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K., Integrated circuit tampering protection and reverse engineering prevention coatings and methods.
  40. Wu, Bo Jiu; Zhang, Jia Ju; Wu, Zhong Ming, Integrated fluid cooling system for electronic components.
  41. Symons,Robert S., Integrated liquid cooling device for electronic components.
  42. Symons,Robert S., Integrated liquid cooling device with immersed electronic components.
  43. Ouyang, Chien, Magneto-hydrodynamic hot spot cooling heat sink.
  44. Porter, George K.; Wolf, Seth B.; Albrecht, Charles W., Manifolded fluid delivery system.
  45. Wilcoxon, Ross K.; Lower, Nathan P.; Wooldridge, James R.; Dlouhy, David W.; Strzelczyk, Anthony J., Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid.
  46. Wyatt, William Gerald; Schwartz, Gary J., Method and apparatus for cooling a circuit component.
  47. Wyatt,William Gerald; Schwartz,Gary J., Method and apparatus for cooling a circuit component.
  48. Wyatt, William Gerald; Schwartz, Gary J., Method and apparatus for cooling a portable computer.
  49. Wyatt,William Gerald; Schwartz,Gary J., Method and apparatus for cooling a portable computer.
  50. Boone, Alan P.; Lower, Nathan P.; Wilcoxon, Ross K., Method for providing near-hermetically coated integrated circuit assemblies.
  51. Boone, Alan P.; Lower, Nathan P.; Wilcoxon, Ross K., Method for providing near-hermetically coated integrated circuit assemblies.
  52. Wilcoxon, Ross K.; Lower, Nathan P.; Boone, Alan P., Method for providing near-hermetically coated, thermally protected integrated circuit assemblies.
  53. Lower, Nathan P.; Brower, David M.; Wilcoxon, Ross K., Method of reinforcing a hermetic seal of a module.
  54. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Parallel thermoelectric heat exchange systems.
  55. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Physically separated hot side and cold side heat sinks in a thermoelectric refrigeration system.
  56. Bingler, Douglas J., Pump system for use in a heat exchange application.
  57. Singer, Frank; Schwarz, Thomas; Steegmüller, Ulrich; Schulz, Roland, Semiconductor laser device.
  58. Lower, Nathan P.; Wilcoxon, Ross K.; Yao, Qizhou; Dlouhy, David W.; Chihak, John A., System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling.
  59. Cripe, David W.; McCoy, Bryan S.; Lower, Nathan P.; Wilcoxon, Ross K., System and method for proportional cooling with liquid metal.
  60. Ghoshal,Uttam, System employing temporal integration of thermoelectric action.
  61. Stanley, Marshall; Barus, Daniel, Systems and methods for operating a thermoelectric module to increase efficiency.
  62. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Systems and methods to mitigate heat leak back in a thermoelectric refrigeration system.
  63. Thrailkill, John E., Thermal dissipator utilizing laminar thermal transfer member.
  64. Balian,Charles; Bergerson,Steven E.; Currier,Gregg C., Thermal interface material with low melting alloy.
  65. Wilcoxon, Ross K.; Dlouhy, David W.; Lower, Nathan P.; Wooldridge, James R., Thermal spreader assembly with flexible liquid cooling loop having rigid tubing sections and flexible tubing sections.
  66. Lee, Yong Nak, Thermo electric heat transfer system.
  67. Ghoshal,Uttam, Thermoelectric configuration employing thermal transfer fluid flow(s) with recuperator.
  68. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Thermoelectric heat exchange system comprising cascaded cold side heat sinks.
  69. June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek; Edwards, Jesse W., Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance.
  70. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Thermoelectric refrigeration system control scheme for high efficiency performance.
  71. Lower, Nathan P.; Wilcoxon, Ross K.; Wooldridge, James R., Thin, solid-state mechanism for pumping electrically conductive liquids in a flexible thermal spreader.
  72. Mizuno, Osamu; Murakami, Yutaka; Enshu, Hisayuki; Aikoh, Hideki; Nakamura, Tohru, Transducer-supporting structure.
  73. Mizuno,Osamu; Murakami,Yutaka; Enshu,Hisayuki; Aikoh,Hideki; Nakamura,Tohru, Transducer-supporting structure.
  74. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Two-phase heat exchanger mounting.
  75. Ranish, Joseph M.; Brillhart, Paul, Window cooling using compliant material.
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