초록 ▼

A method of dispensing encapsulant material on a wire bonded die comprises dispensing a series of discrete, single-point droplets and a series of continuous beads within an area bounded by a dam. The encapsulant material spreads out from the droplets and the continuous beads to form an encapsulating

A method of dispensing encapsulant material on a wire bonded die comprises dispensing a series of discrete, single-point droplets and a series of continuous beads within an area bounded by a dam. The encapsulant material spreads out from the droplets and the continuous beads to form an encapsulating layer over the wire bonded die in an area defined by the dam.

대표청구항 ▼

[ Having described the invention, We claim:] [1.] A method of encapsulating a wire bonded die mounted on a carrier substrate, said carrier substrate and wire bonded die having a dam extending about said wire bonded die, comprising the steps of:sequentially dispensing liquid encapsulant material in a

[ Having described the invention, We claim:] [1.] A method of encapsulating a wire bonded die mounted on a carrier substrate, said carrier substrate and wire bonded die having a dam extending about said wire bonded die, comprising the steps of:sequentially dispensing liquid encapsulant material in a predetermined two-dimensional pattern in a plane generally parallel to said wire bonded die and within an area bounded by said dam from a single dispensing outlet, said pattern including a plurality of discrete, single-point dispensing locations; andallowing said liquid encapsulant material to spread out and coalesce to form a generally uniform encapsulating layer over said wire bonded die and within said dam.