초록 ▼

An apparatus for monitoring parts bonded by a bonder such as an RF bonder having tunable electrodes for delivering respective variable amounts of RF energy to respective portions of the bonded part includes a plurality of thermometers, at least one thermometer for each electrode, for measuring respe

An apparatus for monitoring parts bonded by a bonder such as an RF bonder having tunable electrodes for delivering respective variable amounts of RF energy to respective portions of the bonded part includes a plurality of thermometers, at least one thermometer for each electrode, for measuring respective surface temperatures of the bonded part. The apparatus also includes an electronic digital computer that records and displays effects of tuning the electrodes and circuitry for interfacing the computer to the thermometers. The computer receives and processes temperature measurements generated by the thermometers and information on a dwell time of the bonded part in a nest with no power, the electrodes' temperatures, an ambient temperature, and a geometry of the bonded part, and the computer uses this information to determine the effects of tuning the electrodes.

대표청구항 ▼

[ What is claimed is:] [1.] An apparatus for monitoring a part bonded by a bonder that has delivered a variable amount of energy to respective portions of the bonded part, comprising:a plurality of thermometers to be used at the respective portions of the bonded part, at least one thermometer for ea

[ What is claimed is:] [1.] An apparatus for monitoring a part bonded by a bonder that has delivered a variable amount of energy to respective portions of the bonded part, comprising:a plurality of thermometers to be used at the respective portions of the bonded part, at least one thermometer for each portion, for measuring respective temperatures of the bonded part;an electronic computer, wherein the computer records and displays effects of varying the amount of energy delivered; andcircuiltry for interfacing the computer to the thermometers;wherein the computer receives and processes temperature measurements generated by the thermometers and information on a dwell time of the bonded part in a cooling nest with no power, the bonder's temperature, an ambient temperature, and a geometry of the bonded part; and the computer uses the temperature measurements and information for monitoring the effects of varying the amount of energy delivered by the bonder and processes information on the bonder's operating and environmental conditions.