초록 ▼

A low cost radio frequency identification tag is provided for attaching to and identifying objects such as, for example, a passenger's luggage. The tag is programmed to contain information such as the origin, destination, and name of a passenger accompanying the luggage. This information is programm

A low cost radio frequency identification tag is provided for attaching to and identifying objects such as, for example, a passenger's luggage. The tag is programmed to contain information such as the origin, destination, and name of a passenger accompanying the luggage. This information is programmed into the tag at the time when the customer checks his or her luggage at a terminal. The tag includes an integrated circuit with all radio and data functions incorporated onto this integrated circuit, and an antenna for radio communication. The integrated circuit in the tag is suitably powered from the incident radio frequency energy provided by a interrogator while the tag is located in the radiation pattern of this interrogator. The luggage tag is assembled inexpensively by packaging the integrated circuit between paper or plastic substrates on which printed identifying information is also added at the point of check-in at the terminal. Also, a wire loop antenna may be placed between the substrates such that it contacts the integrated circuit at two points, for forming a complete electrical circuit.

대표청구항 ▼

[ We claim:] [1.] A method of assembly for a radio frequency identification tag having an integrated circuit and a loop antenna embedded in the tag, the method comprising the steps of:providing a supply of substrate material;forming an antenna on the substrate material, said antenna including a firs

[ We claim:] [1.] A method of assembly for a radio frequency identification tag having an integrated circuit and a loop antenna embedded in the tag, the method comprising the steps of:providing a supply of substrate material;forming an antenna on the substrate material, said antenna including a first pair of conducting pads;selectively applying a conductive epoxy onto the substrate material;positioning the integrated circuit on the substrate material so that a second pair of conducting pads on said integrated circuit are positioned in contact alignment with said first pair of conducting pads for said antenna; andcuring the conducting epoxy for forming an attachment between the first pair of conducting pads on the antenna and the second pair of conducting pads on the integrated circuit.