초록 ▼

An in-line film deposition system is adapted so that film deposition processing on a substrate is completed through a number of film deposition processes, while the length of the system is not excessive. A carrier 3 which holds two substrates 1, with their planar surfaces set parallel to a transfer

An in-line film deposition system is adapted so that film deposition processing on a substrate is completed through a number of film deposition processes, while the length of the system is not excessive. A carrier 3 which holds two substrates 1, with their planar surfaces set parallel to a transfer direction, is sequentially transferred through a plurality of vacuum chambers 2 arranged along a polygonally-shaped transfer path 30. Film deposition processing is continuously carried out on the substrate 1 by processing means 4 that are arranged in the vacuum chambers 2 which form film deposition process chambers. A rotation mechanism for rotating the carrier 3 through a specified angle so as to direct the carrier 3 in a subsequent transferring direction is provided in those vacuum chambers which are located at turning points along the polygonal transfer path 30.

대표청구항 ▼

[ What is claimed is:] [1.] A method of film deposition in an apparatus having a plurality of vacuum chambers including a loading chamber, an unloading chamber, at least one processing chamber and at least one rotation chamber and a continuous looped line transfer path extending through the pluralit

[ What is claimed is:] [1.] A method of film deposition in an apparatus having a plurality of vacuum chambers including a loading chamber, an unloading chamber, at least one processing chamber and at least one rotation chamber and a continuous looped line transfer path extending through the plurality of vacuum chambers, the method comprising the steps of:loading a substrate on a carrier in the loading chamber;transferring the carrier and the substrate along the continuous looped line transfer path through the plurality of vacuum chambers such that the substrate and carrier pass only once through each of the vacuum chambers, and the substrate and carrier do not travel in reverse direction of travel throughout the rotation chamber;depositing a film on the substrate in the processing chamber;changing a direction of transfer of the carrier and the substrate in the rotation chamber with a rotation mechanism; andunloading the substrate in the unloading chamber.