초록 ▼

A method of making a wiping connection between a male connector and a female connector in a single layer of a flexible polymeric dielectric film substrate having a thickness of less than 0.012 inches is disclosed. A laser directs a beam towards the substrate cutting a smooth pattern through the subs

A method of making a wiping connection between a male connector and a female connector in a single layer of a flexible polymeric dielectric film substrate having a thickness of less than 0.012 inches is disclosed. A laser directs a beam towards the substrate cutting a smooth pattern through the substrate to define a passage extending through the substrate and providing at least one resilient foldable flap normally closing the passage through the substrate. Next an electrically conductive material is coated on the flexible polymeric dielectric film substrate including a circuit trace providing an electrical contact land area surrounding the pattern extending over the foldable flap to form the female connector. The male connector is then inserted into the female connector through the flexible polymeric dielectric film substrate at the pattern, deflecting the foldable flap and conductive coating into wiping electrical and mechanical engagement with the male connector to secure the male connector to the substrate in electrical contact with the trace circuit.

대표청구항 ▼

[ What is claimed is:] [1.] A method of manufacturing a female electrical connector in a single layer of a flexible polymeric dielectric film substrate of a flexible circuit ready for mechanically securing a male connector directly to the flexible polymeric dielectric film substrate in electrical co

[ What is claimed is:] [1.] A method of manufacturing a female electrical connector in a single layer of a flexible polymeric dielectric film substrate of a flexible circuit ready for mechanically securing a male connector directly to the flexible polymeric dielectric film substrate in electrical contacting relation with a circuit trace, the method comprising the steps of:directing a laser beam towards the flexible polymeric dielectric film substrate, cutting a smooth pattern through the flexible polymeric dielectric film substrate defining a passage through the flexible polymeric dielectric film substrate, and providing at least one resilient foldable flap positioned to normally close the passage, andcoating an electrically conductive material on the flexible polymeric dielectric film substrate providing the circuit trace and providing an electrical contact land area surrounding the pattern extending over the foldable flap and permitting the foldable flap and electrical contact land area to deflect to receive the male connector in wiping engagement therewith.