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Temperature control apparatus for sample susceptor 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23F-001/02
출원번호 US-0935913 (1997-09-23)
우선권정보 JP-0303898 (1996-10-29)
발명자 / 주소
  • Hatta Masataka,JPX
출원인 / 주소
  • Tokyo Electron Limited, JPX
대리인 / 주소
    Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
인용정보 피인용 횟수 : 27  인용 특허 : 14

초록

A temperature control apparatus for a sample susceptor has a cooling unit for cooling a sample susceptor on which a wafer W is mounted, an electric heater for heating the sample susceptor, a temperature detecting unit for detecting the temperature of the sample susceptor, and a temperature adjusting

대표청구항

[ I claim:] [1.] A temperature control apparatus, comprising:a susceptor for mounting a sample thereon, said susceptor having a plurality of gas flow paths, said gas flow paths allowing low-temperature air for cooling to pass therethrough, said gas flow paths having a common low-temperature air rece

이 특허에 인용된 특허 (14)

  1. Kyung Hyun-Su,KRX ; Choi Won-Song,KRX ; Lee Hueng-Jik,KRX ; Kim Sek-Young,KRX ; Shin Jung-Ho,KRX ; Choi Chang-Hwan,KRX, Apparatus for thermal treatment of thin wafers.
  2. Bristow Duncan J. (Sarnia CAX) Saunders Raymond W. (Enniskillen Township CAX), Critical temperature control with vortex cooling.
  3. Miyata Eiji (Fuchu) Sugiyama Masahiko (Nirasaki) Kohno Masahiko (Yamanashi) Hatta Masataka (Yamanashi JPX), Electric probing-test machine having a cooling system.
  4. Mizuno Shigeru,JPX ; Watanabe Kazuhito,JPX ; Yoshimura Takanori,JPX ; Takahashi Nobuyuki,JPX, Heater for CVD apparatus.
  5. Schmidt Bryan D. (San Antonio TX), Method and apparatus for thermally insulating a wafer support.
  6. Hendrickson Ruth Ann ; Hofmeister Christopher ; Muka Richard S., Method for heating or cooling wafers.
  7. Kazama Kouichi (Yamanashi-ken JPX) Komino Mitsuaki (Tokyo JPX) Ishikawa Kenji (Sagamihara JPX) Ueda Yoichi (Yokohama JPX), Method of controlling temperature of susceptor.
  8. Tunkel Lev ; Krasovitski Boris,ILX ; Foster Rorbert L., Non-freezing vortex tube.
  9. Tepman Avi (Cupertino CA) Grunes Howard (Santa Cruz CA) Andrews Dana (Mountain View CA), Physical vapor deposition clamping mechanism and heater/cooler.
  10. deBoer Wiebe B.,NLX ; Ozias Albert E., Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment.
  11. Eager George (Cambridge MA) Selverstone Pater (Cambridge MA), Temperature control for device under test.
  12. Heimanson Dorian ; Omstead Thomas R., Temperature controlled chuck for vacuum processing.
  13. Jelinek Vaclav (River Edge NJ), Wafer heating chuck with dual zone backplane heating and segmented clamping member.
  14. Wagner Rudolf (Fontnas CHX) Hirscher Hans (Bad Ragaz CHX), Workpiece carrier with suction slot for a disk-shaped workpiece.

이 특허를 인용한 특허 (27)

  1. Shih, Ching-Hsing; Chuang, His-Shen; Chung, Cheng-Fang, Apparatus and method for cooling a semiconductor substrate.
  2. Ricci, Anthony; Ullal, Saurabh; Kang, Michael; Busche, Matthew, Apparatus and method for temperature control of a semiconductor substrate support.
  3. Strang,Eric J.; Johnson,Wayne L., Apparatus for active temperature control of susceptors.
  4. Cunning, Hugh; Williams, Graham; Odedra, Rajesh; Kanjolia, Ravi, Bubbler for the transportation of substances by a carrier gas.
  5. Hatta, Masataka, Cooling device operating method and inspection apparatus.
  6. Orr,Troy J., Heat exchanger apparatus for a recirculation loop and related methods and systems.
  7. Cousineau, Shawn M.; Kelso, Robert D.; Lopez, Robert R., Heat exchanger having sloped deflection surface for directing refrigerant.
  8. Thayer,John Gilbert; Ernst,Donald M., Heat pipe evaporator with porous valve.
  9. Thayer,John Gilbert; Ernst,Donald M., Heat pipe evaporator with porous valve.
  10. Thayer,John Gilbert; Ernst,Donald M., Heat pipe with chilled liquid condenser system for burn-in testing.
  11. Strang, Eric J.; Johnson, Wayne L., Method and apparatus for active temperature control of susceptors.
  12. Needham, Wayne M., Method and apparatus for controlling the power and heat output in a device testing system.
  13. Chae, Yong Kee; Choi, Soo Young, Method of dynamic temperature control during microcrystalline SI growth.
  14. Cho Thomas K. ; Ishikawa Tetsuya, Pedestal with a thermally controlled platen.
  15. Cho, Thomas K.; Ishikawa, Tetsuya, Pedestal with a thermally controlled platen.
  16. Sugiyama,Masahiko; Inoue,Yoshinori, Prober and probe testing method for temperature-controlling object to be tested.
  17. Sugiyama,Masahiko; Inoue,Yoshinori, Prober and probe testing method for temperature-controlling object to be tested.
  18. Kanjolia, Ravi; Platts, Chris; Nguyen, Nam; Wilkinson, Mark, Solid precursor delivery assemblies and related methods.
  19. Yen, Chun-Hsiang; Dee-Noor, Barak; Gronau, Yuval; Hagai, Ronen; Vinnitsky, Efim; Madmon, Yohanan, System and method for setting a temperature of an object within a chamber.
  20. Namose, Isamu, Temperature adjustment apparatus.
  21. Kamakura, Mitsutoshi; Andou, Kouichi; Mititsuji, Yasunori, Temperature characteristic inspection device.
  22. Hong, Sung Jae, Temperature control method of chemical vapor deposition device.
  23. Paul A. Getchel ; Kenneth M. Cole, Sr. ; Henry A. Lyden, Temperature control system for a workpiece chuck.
  24. Cousineau, Shawn M.; Kelso, Robert D.; Olsen, Douglas S.; Stura, David, Temperature-controlled chuck with recovery of circulating temperature control fluid.
  25. Costello, Simon; Pham, Tuyen Paul, Temperature-controlled semiconductor wafer chuck system.
  26. Lessig, Ken; Cronk, Kevin; O'Malley, Brian; Swain, Matt; Sundaram, Ramesh, Vortex-based temperature control system and method.
  27. Takahama,Toru, Working system for circuit boards.
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