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Thermosetting resin compositions containing maleimide and/or vinyl compounds 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C08F-022/240
출원번호 US-0460495 (1995-06-02)
발명자 / 주소
  • Dershem Stephen M.
  • Patterson Dennis B.
  • Osuna
  • Jr. Jose A.
출원인 / 주소
  • Dexter Corporation
대리인 / 주소
    Gray Cary Ware & Freidenrich LLPReiter
인용정보 피인용 횟수 : 55  인용 특허 : 19

초록

In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stabl

대표청구항

[ That which is claimed is:] [1.] A die-attach paste comprising:in the range of about 10 to 80 weight percent of a thermosetting resin composition, andin the range of about 20 to 90 weight percent of a conductive filler, wherein said thermosetting resin composition comprises:a) a liquid maleimide,b)

이 특허에 인용된 특허 (19)

  1. De Koning Adrianus J. (Sh Vlaardingen NLX), Bismaleimide compositions.
  2. Yanacek James A. (Midland MI) Donald Robert J. (Midland MI) Murphy Christopher S. (Troy MI), Color balanced rubber-reinforced plastic.
  3. Jamison William L. (Fishers IN) Moscicki Andrzej (Lodz PLX), Conductor-filled thermosetting resin.
  4. Bastiaansen Cornelius W. M. (Maastricht NLX), Continuous products made of thermosettable monomers.
  5. Klemarczyk Philip (Collinsville CT), Curable siloxane maleimide composition.
  6. Cranston John A. (Huntsville AL) MacArthur Doug E. (New Market AL), Foam, Foam-resin composite and method of making a foam-resin composite.
  7. Guilbert Curtis R. (St. Paul MN) Fialla Peter (Wiener Neudorf ATX), High-temperature resistant electrically insulating coating powder.
  8. Ketley Celia H. (Beverly MA), Low temperature single step curing polyimide adhesive.
  9. Rossi Robert D. (Levittown PA) Ray-Chaudhuri Dilip K. (Bridgewater NJ), Maleated siloxane derivatives.
  10. Martin, Eugene C.; De Fusco, Albert A., Method of synthesizing the bismaleimide of dimer diamine via cyclodehydration.
  11. Shimoto Tadanori (Tokyo JPX) Matsui Koji (Tokyo JPX), Multilayer printed circuit board.
  12. Kray William D. (San Bernadino CA), Photopatternable polyimide compositions and method for making.
  13. Domeier Linda A. (Somerville NJ), Prepregable resin composition and composite.
  14. Kourtides Demetrius A. (San Jose CA) Parker John A. (Los Altos CA), Process for the manufacture of low density bis-maleimide-carbon microballoon composites.
  15. Nagasaki Hideo (Osaka JPX) Takemoto Yasuzi (Sakai JPX), Rubber composition with bismaleimides.
  16. Maly Neil A. (Tallmadge OH) D\Sidocky Richard M. (Ravenna OH) Lukich Lewis T. (Akron OH), Rubber vulcanization system containing bis-(2,5-polythio-1,3,4-thiadiazole), bismaleimide and sulfenamide.
  17. Muse Joel (Hudson OH) Sandstrom Paul H. (Tallmadge OH) Wideman Lawson G. (Tallmadge OH), Sulfur vulcanized rubber compounds containing silica and aromatic bismaleimide.
  18. Fuchs Harald (Carlsberg DEX) Licht Ulrike (Mannheim DEX) Schrepp Wolfgang (Heidelberg DEX), Ultrathin thermostable bismaleimide films and production thereof.
  19. Wilson ; Jr. Thomas H. (St. Paul MN) Pocius Alphonsus V. (Maplewood MN), Water-compatible coating composition.

이 특허를 인용한 특허 (55)

  1. Osama M. Musa ; Colin McLean GB; Mark Bonneau ; Nikola A. Nikolic, Adhesion promoters containing silane, carbamate or urea, and donor or acceptor functionality.
  2. Jaeger, Richard E., Adhesive compositions containing organic spacers and methods for use thereof.
  3. Attarwala, Shabbir; Zhu, Qinyan; Levandoski, Susan Lamtruong, Adhesive compositions free of metallic catalyst.
  4. Attarwala,Shabbir; Zhu,Qinyan; Levandoski,Susan Lamtruong, Adhesive compositions free of metallic catalyst.
  5. Dershem, Stephen M, Amide-extended crosslinking compounds and methods for use thereof.
  6. Dershem, Stephen M.; Mizori, Farhad G., Amide-extended crosslinking compounds and methods for use thereof.
  7. Larson, Eric G.; Connell, Glen, Anisotropic conductive adhesives.
  8. Dershem, Stephen M, Anti-bleed compounds, compositions and methods for use thereof.
  9. Forray, Deborah Derfelt; Liu, Puwei; delos Santos, Benedicto, B-stageable die attach adhesives.
  10. Forray,Deborah Derfelt; Liu,Puwei; Santos,Benedicto delos, B-stageable die attach adhesives.
  11. Dershem, Stephen M.; Liu, Puwei; Mizori, Farhad G., Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof.
  12. Dershem, Stephen M.; Liu, Puwei; Mizori, Farhad G., Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof.
  13. Musa Osama M., Compounds with electron donor and electron acceptor functionality.
  14. Yang,Kang; Liu,Puwei, Conductive ink compositions.
  15. Mizori, Farhad G; Dershem, Stephen M, Curable composition with rubber-like properties.
  16. Musa,Osama M.; Herr,Donald E.; Nikolic,Nikola A., Curable electron donor compositions.
  17. Musa, Osama M.; Herr, Donald E.; Nikolic, Nikola A., Curable electron donor compounds.
  18. Musa Osama M., Curable hybrid electron donor compounds containing vinyl ether.
  19. Dershem, Stephen M, Curatives for epoxy compositions.
  20. Dershem, Stephen M, Curing agents for epoxy resins.
  21. Dershem, Stephen M., Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof.
  22. Dershem, Stephen M, Di-cinnamyl compounds and methods for use thereof.
  23. Musa, Osama M.; Herr, Donald E., Die attach adhesives with vinyl ether and carbamate or urea functionality.
  24. Liu,Puwei; Dershem,Stephen M.; Neff,Benjamin; Villegas,Maria, Free radically polymerizable coupling agents.
  25. Dershem, Stephen M.; Mizori, Farhad G., Free-radical curable polyesters and methods for use thereof.
  26. Dershem, Stephen M.; Mizori, Farhad G., Free-radical curable polyesters and methods for use thereof.
  27. Dershem,Stephen M.; Mizori,Farhad G., Free-radical curable polyesters and methods for use thereof.
  28. Dershem, Stephen M., Functionalized styrene oligomers and polymers.
  29. Dershem, Stephen M.; Mizori, Farhad G, Hetero-functional compounds and methods for use thereof.
  30. Dershem, Stephen M, Hydrolytically resistant thermoset monomers.
  31. Mizori, Farhad G., Imide-linked maleimide and polymaleimide compounds.
  32. Mizori, Farhad G; Dershem, Stephen M, Imide-linked maleimide and polymaleimide compounds.
  33. Mizori,Farhad G.; Dershem,Stephen M., Imide-linked maleimide and polymaleimide compounds.
  34. Santos, Benedicto delos; Huneke, James T.; Liu, Puwei; Yang, Kang; Ji, Qing, Interlayer dielectric and pre-applied die attach adhesive materials.
  35. delos Santos,Benedicto; Huneke,James T.; Liu,Puwei; Yang,Kang; Ji,Qing, Interlayer dielectric and pre-applied die attach adhesive materials.
  36. Dershem, Stephen M, Low shrinkage polyester thermosetting resins.
  37. Larson, Eric G.; Zenner, Robert L. D.; Murray, Cameron T.; Sura, Ravi K., Low temperature bonding electronic adhesives.
  38. Dershem, Stephen M., Low temperature curing acrylate and maleimide based formulations and methods for use thereof.
  39. Dershem, Stephen, Maleimide compositions and methods for use thereof.
  40. Dershem, Stephen M, Maleimide-functional monomers in amorphous form.
  41. Dershem, Stephen M; Mizori, Farhad G; Huneke, James T, Materials and methods for stress reduction in semiconductor wafer passivation layers.
  42. Dershem, Stephen M; Mizori, Farhad G; Huneke, James T, Materials and methods for stress reduction in semiconductor wafer passivation layers.
  43. Dershem, Stephen, Modified calcium carbonate-filled adhesive compositions and methods for use thereof.
  44. Dershem, Stephen M., Monomers derived from pentacyclopentadecane dimethanol.
  45. Dershem, Stephen M., Olefin oligomers containing pendant maleimide groups.
  46. Jiang, Tongbi; Connell, Mike; Li, Li; Hollingshead, Curtis, Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate.
  47. Okubo, Hikaru; Tanaka, Nobuki; Watanabe, Itaru, Resin composition and semiconductor device produced by using the same.
  48. Okubo, Hikaru; Tanaka, Nobuki; Watanabe, Itaru, Resin composition and semiconductor device produced by using the same.
  49. Okubo, Hikaru; Tanaka, Nobuki; Watanabe, Itaru, Resin composition and semiconductor device produced by using the same.
  50. Dershem, Stephen M., Siloxane monomers and methods for use thereof.
  51. Dershem, Stephen M, Soluble metal salts for use as conductivity promoters.
  52. Dershem, Stephen M, Thermoplastic elastomer with acyloxyphenyl hard block segment.
  53. Dershem, Stephen M.; Hoang, Gina; Lu, Melin, Thermosetting adhesive compositions.
  54. Dershem, Stephen M., Thermosetting hyperbranched compositions and methods for use thereof.
  55. Jiang,Tongbi; Connell,Mike; Li,Li; Hollingshead,Curtis, Treatment of a ground semiconductor die to improve adhesive bonding to a substrate.
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