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Apparatus for producing semiconductors and other devices and cleaning apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08B-003/02
출원번호 US-0040897 (1998-03-18)
우선권정보 JP-0064018 (1997-03-18)
발명자 / 주소
  • Eui-Yeol Oh,KRX
출원인 / 주소
  • Frontec Incorporated, JPX
대리인 / 주소
    Brinks Hofer Gilson & Lione
인용정보 피인용 횟수 : 36  인용 특허 : 21

초록

Provided is an apparatus for producing semiconductor and other devices, which can improve the quality of deposited films and increase the yield of produced devices in comparison with the conventional apparatus. The apparatus of the invention comprises a plurality of dry treatment chambers (7a, 7b, 7

대표청구항

[ What is claimed is:] [1.] An apparatus for producing semiconductors and other device, comprising:(a) an atmospherically sealed first place in which there are provided a plurality of dry treatment chambers for conducting dry treatment on objects and a transfer room interconnecting said dry treatmen

이 특허에 인용된 특허 (21)

  1. Ushijima Mitsuru (Tama JPX) Akimoto Masami (Kikuyo JPX), Apparatus for coating a photo-resist film and/or developing it after being exposed.
  2. Thompson Raymon F. (Lakeside MT) Owczarz Aleksander (Kalispell MT), Centrifugal wafer carrier cleaning apparatus.
  3. Jackson David P. (Saugus CA), Dense phase gas photochemical process for substrate treatment.
  4. Matsukawa Hiroyuki (Kumamoto JPX) Yonemizu Akira (Kumamoto JPX) Matsushita Michiaki (Yatsushiro JPX) Fujimoto Akihiro (Kumamoto JPX) Takekuma Takashi (Yamaga JPX) Yaegashi Hidetami (Kokubunji JPX) Fu, Double-sided substrate cleaning apparatus.
  5. Yamanaka Koji,JPX ; Imaoka Takashi,JPX ; Futatsuki Takashi,JPX ; Yamashita Yukinari,JPX, Equipment and process for producing high-purity water.
  6. Kitajima Hiroshi,JPX ; Shiramizu Yoshimi,JPX, Generation of electrolytically active water and wet process of a semiconductor substrate.
  7. Omi Tadahiro (Miyagi JPX) Shimada Makoto (Tokyo JPX) Sawamoto Isao (Kanagawa JPX), Method and apparatus for sterilization of and treatment with ozonized water.
  8. Clark R. Scot (Fallbrook CA) Hoffman Joe G. (Oceanside CA) Davison John B. (Mission Viejo CA) Jones Alan W. (San Clemente CA) Jones ; Jr. Allen H. (Carlsbad CA) Persichini David W. (Oceanside CA) Yua, Method and apparatus for the continuous on-site chemical reprocessing of ultrapure liquids used in semiconductor wafer c.
  9. Aoki Hidemitsu (Tokyo JPX) Nakajima Tsutomu (Tokyo JPX), Method and apparatus for wet treatment of solid surfaces.
  10. Shimamune Takayuki (Tokyo JPX) Nakamatsu Shuji (Kanagawa JPX) Sawamoto Isao (Kanagawa JPX) Nishiki Yoshinori (Kanagawa JPX), Method for electrolyzing water.
  11. Mashimo Noriyoshi (Tokyo JPX) Okumura Katsuya (Yokohama JPX), Method of cleaning semiconductor wafers using mixer containing a bundle of gas permeable hollow yarns.
  12. Sakai Mitsuhiro,JPX ; Nomura Masafumi,JPX ; Tsunoda Kazuaki,JPX, Processing apparatus and processing method.
  13. Burkman Don C. (Excelsior MN) Schumacher David D. (Plymouth MN) Peterson Charlie A. (Waconia MN), Rinsing in acid processing of substrates.
  14. Ohmori Masashi (Itami JPX) Tanaka Hiroshi (Itami JPX) Nishimoto Akira (Itami JPX) Sasai Hiroshi (Itami JPX) Fujino Naohiko (Amagasaki JPX) Kotoh Satoru (Amagasaki JPX), Semiconductor cleaning apparatus and wafer cassette.
  15. Ohmori Masashi (Itami JPX) Tanaka Hiroshi (Itami JPX) Nishimoto Akira (Itami JPX) Sasai Hiroshi (Itami JPX) Fujino Naohiko (Amagasaki JPX) Kotoh Satoru (Amagasaki JPX), Semiconductor cleaning apparatus and wafer cassette.
  16. Owczarz Aleksander (Kalispell MT), Semiconductor processor liquid spray system with additive blending.
  17. Matsumura Yoshio (Hikone JPX) Shimaji Katsumi (Hikone JPX), Substrate processing apparatus.
  18. Tanaka Hiroshi (Kurume JPX) Nishi Mitsuo (Kurume JPX) Mizoguchi Ryuichi (Kumamoto JPX) Kamikawa Yuuji (Uto JPX), Transfer apparatus.
  19. Han Suk Bin,KRX, Wafer wet treating apparatus.
  20. Kitajima Hiroshi (Tokyo JPX) Aoki Hidemitsu (Tokyo JPX) Hamano Haruto (Tokyo JPX) Morita Makoto (Tokyo JPX) Shiramizu Yoshimi (Tokyo JPX) Nakamori Masaharu (Tokyo JPX) Watanabe Kaori (Tokyo JPX) Seo , Wet processing apparatus having individual reactivating feedback paths for anode and cathode water.
  21. Ohmi Tadahiro,JPX, Wet station, and method of and apparatus for wet cleaning using said wet station.

이 특허를 인용한 특허 (36)

  1. Yokomizo,Kenji, Apparatus and method of securing a workpiece during high-pressure processing.
  2. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of a workpiece.
  3. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of multiple workpieces.
  4. Tadahiro Ohmi JP; Toshihiro Il JP; Kenji Mori JP; Toshikazu Abe JP; Hirosi Arakawa JP; Takahisa Nitta JP, Cleaning method.
  5. Nakatou, Isamu, Cleaning processing method and cleaning processing apparatus.
  6. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.
  7. Sheydayi,Alexei; Sutton,Thomas, Gate valve for plus-atmospheric pressure semiconductor process vessels.
  8. Sutton, Thomas R.; Biberger, Maximilan A., High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism.
  9. Jones, William D., High pressure fourier transform infrared cell.
  10. Biberger, Maximilian A.; Layman, Frederick Paul; Sutton, Thomas Robert, High pressure processing chamber for semiconductor substrate.
  11. Biberger,Maximilian A.; Layman,Frederick Paul; Sutton,Thomas Robert, High pressure processing chamber for semiconductor substrate.
  12. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  13. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  14. Sheydayi,Alexei, Method and apparatus for clamping a substrate in a high pressure processing system.
  15. Nguyen, Thomas D., Method and apparatus for reducing He backside faults during wafer processing.
  16. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method and apparatus for supercritical processing of multiple workpieces.
  17. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.
  18. Parent,Wayne M., Method and system for determining flow conditions in a high pressure processing system.
  19. Parent, Wayne M.; Geshell, Dan R., Method and system for passivating a processing chamber.
  20. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.
  21. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.
  22. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method for supercritical processing of multiple workpieces.
  23. Nagamura Yoshikazu,JPX ; Yoshioka Nobuyuki,JPX ; Yamanaka Koji,JPX ; Kusuhara Masaki,JPX, Method of and apparatus for washing photomask and washing solution for photomask.
  24. Nagamura,Yoshikazu; Yoshioka,Nobuyuki; Yamanaka,Koji; Usui,Hozumi, Method of and apparatus for washing photomask and washing solution for photomask.
  25. Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.
  26. Sheydayi,Alexei, Non-contact shuttle valve for flow diversion in high pressure systems.
  27. Rosko, Michael Scot; Jonte, Patrick B.; DeVries, Adam M.; Thomas, Kurt J.; Sawaski, Joel D., Ozone distribution in a faucet.
  28. Sheydayi,Alexei, Pressure energized pressure vessel opening and closing device and method of providing therefor.
  29. Wuester,Christopher D., Process flow thermocouple.
  30. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
  31. Matsuno, Kousaku; Iga, Masao, Substrate treatment process and apparatus.
  32. Matsuno,Kousaku; Iga,Masao, Substrate treatment process and apparatus.
  33. Gale,Glenn; Hillman,Joseph T.; Jacobson,Gunilla; Palmer,Bentley, System and method for processing a substrate using supercritical carbon dioxide processing.
  34. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.
  35. Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.
  36. Sheydayi,Alexei, Vacuum chuck utilizing sintered material and method of providing thereof.
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