초록 ▼

A substrate cleaning method includes the steps of supplying a cleaning fluid containing fine argon particles or fine carbon dioxide gas particles to a nozzle unit which is accommodated in a vacuum container and in which spray nozzle holes are arranged to blow the cleaning fluid toward a plurality of

A substrate cleaning method includes the steps of supplying a cleaning fluid containing fine argon particles or fine carbon dioxide gas particles to a nozzle unit which is accommodated in a vacuum container and in which spray nozzle holes are arranged to blow the cleaning fluid toward a plurality of spaces, where a plurality of cleaning target substrates are respectively arranged, from front and back sides simultaneously, discharging the fluid outside the vacuum container to maintain an interior of the vacuum container in vacuum, arranging and fixing the plurality of cleaning target substrates respectively in the plurality of spaces and cleaning the cleaning target substrates while vertically moving either one of the cleaning target substrates and the nozzle unit so that the cleaning target substrates and the nozzle unit vertically move relative to each other, and supplying a discharge fluid, which constantly discharges the cleaning fluid from the spaces, from above the cleaning target substrates. An apparatus for practicing this method is also disclosed.

대표청구항 ▼

[ What I claim is:] [1.] A substrate cleaning method comprising the steps of:supplying a cleaning fluid containing fine argon particles or fine carbon dioxide gas particles to a nozzle unit which is accommodated in a vacuum container and in which spray nozzle holes are arranged to blow said cleaning

[ What I claim is:] [1.] A substrate cleaning method comprising the steps of:supplying a cleaning fluid containing fine argon particles or fine carbon dioxide gas particles to a nozzle unit which is accommodated in a vacuum container and in which spray nozzle holes are arranged to blow said cleaning fluid toward a plurality of spaces, where a plurality of cleaning target substrates are respectively arranged, from front and back sides simultaneously;discharging said fluid outside said vacuum container to maintain an interior of said vacuum container in vacuum;arranging and fixing the plurality of cleaning target substrates respectively in said plurality of spaces and cleaning the cleaning target substrates while vertically moving either one of the cleaning target substrates and said nozzle unit so that the cleaning target substrates and said nozzle unit vertically move relative to each other; andsupplying a discharge fluid, which constantly discharges said cleaning fluid from said spaces, from above the cleaning target substrates.