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Limited-volume apparatus and method for forming thin film aerogels on semiconductor substrates

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/316
출원번호 US-0746697 (1996-11-14)
발명자 / 주소
  • Masakara Alok
  • Ramos Teresa
  • Smith Douglas M.
출원인 / 주소
  • Texas Instruments Incorporated
대리인 / 주소
    Denker
인용정보 피인용 횟수 : 53  인용 특허 : 24

초록

An apparatus and method for forming thin film aerogels on semiconductor substrates is disclosed. It has been found that in order to produce defect.about.free nanoporous dielectrics with a controllable high porosity, it is preferable to substantially limit evaporation and condensation of pore fluid i

대표청구항

[ What is claimed is:] [1.] A method for post-deposition processing of a wet gel thin film deposited on a semiconductor substrate, said method comprising:determining a first temperature between 0 degrees C. and 200 degrees C.; andproviding a substrate having a wet gel thin film upon a surface, the w

이 특허에 인용된 특허 (24)

  1. Hench Larry L. (Gainesville FL) Orcel Gerard F. (Gainesville FL), Drying control chemical additives for rapid production of large sol-gel derived silicon, boron and sodium containing mon.
  2. Cogliati Guido (Rome ITX), Inorganic oxide aerogel microbeads of narrow pore diameter distribution and the method for their preparation.
  3. Gnade Bruce (Dallas TX) Cho Chih-Chen (Richardson TX) Levine Jules D. (Dallas TX), Low density, high porosity material as gate dielectric for field emission device.
  4. Gnade Bruce E. (Dallas TX) Cho Chih-Chen (Richardson TX) Smith Douglas M. (Albuquerque NM), Method for forming porous composites as a low dielectric constant layer with varying porosity distribution electronics a.
  5. Tillotson Thomas M. (Tracy CA) Poco John F. (Livermore CA) Hrubesh Lawrence W. (Pleasanton CA) Thomas Ian M. (Livermore CA), Method for producing metal oxide aerogels.
  6. Tillotson Thomas M. (Tracy CA) Poco John F. (Livermore CA) Hrubesh Lawrence W. (Pleasanton CA) Thomas Ian M. (Livermore CA), Method for producing metal oxide aerogels having densities less than 0.02 g/cc.
  7. Poco John F. (Livermore CA), Method of casting aerogels.
  8. Havemann Robert H. (Garland TX) Gnade Bruce E. (Dallas TX) Cho Chih-Chen (Richardson TX), Method of fabricating porous dielectric material with a passivation layer for electronics applications.
  9. Gnade Bruce E. (Dallas TX) Cho Chih-Chen (Richardson TX) Smith Douglas M. (Albuquerque NM), Method of making a semiconductor device using a low dielectric constant material.
  10. Havemann Robert H. (Garland TX) Jeng Shin-Puu (Plano TX) Gnade Bruce E. (Rowlett TX) Cho Chih-Chen (Richardson TX), Method of making an interconnect structure with an integrated low density dielectric.
  11. Nogues Jean-Luc (Gainesville FL) Balaban Canan (Gainesville FL) Moreshead William V. (Alachua FL), Method of making sol-gel monoliths.
  12. Mielke Manfred (Heidelberg DEX) Seybold Guenther (Neuhofen DEX), Moldings or sheets made from silica aerogels.
  13. Gnade Bruce E. (Dallas TX) Cho Chih-Chen (Richardson TX) Smith Douglas M. (Albuquerque NM), Porous composites as a low dielectric constant material for electronics applications.
  14. Cho Chi-Chen (Richardson TX) Gnade Bruce E. (Dallas TX) Smith Douglas M. (Albuquerque NM), Porous dielectric material with improved pore surface properties for electronics applications.
  15. Cho Chi-Chen (Richardson TX) Gnade Bruce E. (Dallas TX) Smith Douglas M. (Albuquerque NM), Porous dielectric material with improved pore surface properties for electronics applications.
  16. Jeng Shin-Puu (Plano TX), Porous insulator for line-to-line capacitance reduction.
  17. Beratan Howard R. (Richardson TX) Cho Chih-Chen (Richardson TX) Summerfelt Scott R. (Dallas TX), Porous thermal isolation mesas for hybrid uncooled infrared detectors.
  18. Weidenbach Guenter (Hanover DEX) Bonse Dirk (Arpke DEX), Preparation of water-insoluble enzyme compositions.
  19. Cogliati Guido (Rome ITX) Bezzi Giovanni (Bagnacavallo ITX), Process for preparing monoliths of aerogels of metal oxides.
  20. Hoshino Sumio (Yokohama JPX) Ito Masumi (Yokohama JPX) Kanamori Hiroo (Yokohama JPX), Process for producing thin glass film by sol-gel method.
  21. Yokogawa Hiroshi (Hirakata JPX) Yokoyama Masaru (Yao JPX) Takahama Koichi (Amagasaki JPX) Uegaki Yuriko (Hirakata JPX), Process of forming a hydrophobic aerogel.
  22. Blount David H. (6728 Del Cerro Blvd. San Diego CA 92120), Production of silica aerogels.
  23. Fujimoto Takamitsu (Amagasaki JPX) Kita Shuichi (Amagasaki JPX) Noda Atsuko (Amagasaki JPX) Koezuka Hiroshi (Amagasaki JPX), Resin-sealed semiconductor device.
  24. Marsh Gary B. (Pittstown NJ) Fanelli Anthony J. (Rockaway NJ) Armor John N. (Morris Plains NJ) Zambri Patrick M. (Montclair NJ), Spray-dried inorganic oxides from non-aqueous gels or solutions.

이 특허를 인용한 특허 (53)

  1. Douglas M. Smith ; Gregory P. Johnston ; William C. Ackerman ; Shin-Puu Jeng ; Bruce E. Gnade, Aerogel thin film formation from multi-solvent systems.
  2. Yokomizo,Kenji, Apparatus and method of securing a workpiece during high-pressure processing.
  3. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of a workpiece.
  4. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of multiple workpieces.
  5. Endisch, Denis H.; Drage, James S., Contact planarization using nanoporous silica materials.
  6. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.
  7. Arena Foster,Chantal J.; Awtrey,Allan Wendell; Ryza,Nicholas Alan; Schilling,Paul, Developing photoresist with supercritical fluid and developer.
  8. Arena-Foster, Chantal J.; Awtrey, Allan Wendell; Ryza, Nicholas Alan; Schilling, Paul, Developing photoresist with supercritical fluid and developer.
  9. Arena-Foster, Chantal J.; Awtrey, Allan Wendell; Ryza, Nicholas Alan; Schilling, Paul, Drying resist with a solvent bath and supercritical CO2.
  10. Sheydayi,Alexei; Sutton,Thomas, Gate valve for plus-atmospheric pressure semiconductor process vessels.
  11. Sutton, Thomas R.; Biberger, Maximilan A., High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism.
  12. Jones, William D., High pressure fourier transform infrared cell.
  13. Biberger, Maximilian A.; Layman, Frederick Paul; Sutton, Thomas Robert, High pressure processing chamber for semiconductor substrate.
  14. Biberger,Maximilian A.; Layman,Frederick Paul; Sutton,Thomas Robert, High pressure processing chamber for semiconductor substrate.
  15. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  16. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  17. Maskara Alok ; Ramos Teresa ; Smith Douglas M., Limited-volume apparatus for forming thin film aerogels on semiconductor substrates.
  18. Douglas M. Smith ; Gregory P. Johnston ; William C. Ackerman ; Richard A. Stoltz ; Alok Maskara ; Teresa Ramos ; Shin-Puu Jeng ; Bruce E. Gnade, Low volatility solvent-based method for forming thin film nanoporous aerogels on semiconductor substrates.
  19. Smith, Douglas M.; Johnston, Gregory P.; Ackerman, William C.; Stoltz, Richard A.; Maskara, Alok; Ramos, Teresa; Jeng, Shin-Puu; Gnade, Bruce E., Low volatility solvent-based method for forming thin film nanoporous aerogels on semiconductor substrates.
  20. Aizenberg, Joanna; Hatton, Benjamin, Low-temperature synthesis of silica.
  21. Sheydayi,Alexei, Method and apparatus for clamping a substrate in a high pressure processing system.
  22. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method and apparatus for supercritical processing of multiple workpieces.
  23. Matos, Jeffrey A.; Milde, Jr., Karl F., Method and apparatus for treating fuel to temporarily reduce its combustibility.
  24. Matos,Jeffrey A.; Milde, Jr.,Karl F., Method and apparatus for treating fuel to temporarily reduce its combustibility.
  25. Tamboli, Dnyanesh Chandrakant; Rao, Madhukar Bhaskara; O'Neill, Mark Leonard, Method and composition for restoring dielectric properties of porous dielectric materials.
  26. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.
  27. Parent,Wayne M., Method and system for determining flow conditions in a high pressure processing system.
  28. Parent, Wayne M.; Geshell, Dan R., Method and system for passivating a processing chamber.
  29. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.
  30. Pheng, Soo Choi; Chan, Lap; Yang, Wang Cui; Kong, Siew Yong; See, Alex, Method for forming a region of low dielectric constant nanoporous material using a microemulsion technique.
  31. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.
  32. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method for supercritical processing of multiple workpieces.
  33. Biberger, Maximilian A.; Schilling, Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
  34. Biberger,Maximilian A.; Schilling,Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
  35. Hillman,Joseph, Method of inhibiting copper corrosion during supercritical COcleaning.
  36. Toma,Dorel Ioan; Schilling,Paul, Method of passivating of low dielectric materials in wafer processing.
  37. Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.
  38. Schilling,Paul, Method of treating a composite spin-on glass/anti-reflective material prior to cleaning.
  39. Schilling,Paul, Method of treatment of porous dielectric films to reduce damage during cleaning.
  40. Smith Douglas M. ; Johnston Gregory P. ; Ackerman William C. ; Jeng Shin-Puu, Nanoporous dielectric thin film formation using a post-deposition catalyst.
  41. Sheydayi,Alexei, Non-contact shuttle valve for flow diversion in high pressure systems.
  42. Smith, Douglas M.; Ackerman, William C.; Stoltz, Richard A., Polyol-based method for forming thin film aerogels on semiconductor substrates.
  43. Sheydayi,Alexei, Pressure energized pressure vessel opening and closing device and method of providing therefor.
  44. Wuester,Christopher D., Process flow thermocouple.
  45. Mullee,William H.; de Leeuwe,Marc; Roberson, Jr.,Glenn A.; Palmer,Bentley J., Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process.
  46. Bertram, Ronald Thomas; Scott, Douglas Michael, Removal of contaminants from a fluid.
  47. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
  48. Gould, George L.; Schmidt, Kevin A.; Marlette, Christopher L.; Zaghi, Shahrooz, Solvent management methods for gel production.
  49. Gale,Glenn; Hillman,Joseph T.; Jacobson,Gunilla; Palmer,Bentley, System and method for processing a substrate using supercritical carbon dioxide processing.
  50. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.
  51. Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.
  52. Wu, Hui-Jung; Drage, James S., Use of multifunctional si-based oligomer/polymer for the surface modification of nanoporous silica films.
  53. Sheydayi,Alexei, Vacuum chuck utilizing sintered material and method of providing thereof.
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