$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Cooling body having lugs 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-003/12
출원번호 US-0894988 (1997-09-04)
우선권정보 DE-0000166 (1996-01-04)
국제출원번호 PCT/EP97/00002 (1997-01-02)
§371/§102 date 19970904 (19970904)
국제공개번호 WO-9725741 (1997-07-17)
발명자 / 주소
  • Becker Klaus,DEX
  • Staiger Wolfgang,DEX
  • Jung Matthias,DEX
  • Heinemeyer Peter,DEX
출원인 / 주소
  • Daimler - Benz Aktiengesellschaft, DEX
대리인 / 주소
    VenableSpencer
인용정보 피인용 횟수 : 42  인용 특허 : 6

초록

The invention relates to a cooling body comprising a heat-conducting insulator and having lugs that are attached in the interior of the cooling body.

대표청구항

[ We claim:] [1.] A cylindrical cooling body comprising an upper part, a lower part and lugs that are attached with material-to-material bonding to at least one inside surface of the upper and lower parts, said lugs projecting into a cooling medium and being separated by channels, the cooling medium

이 특허에 인용된 특허 (6)

  1. Moore, Richard M., Aerodynamically enhanced heat sink.
  2. Messina Gaetano P. (Hopewell Junction NY) Brewster Robert A. (Poughkeepsie NY) Kara Theodore J. (Poughkeepsie NY) Song Seaho (Highland NY), Apparatus for cooling integrated circuit chips.
  3. Klein Erwin (Heddesheim DEX) Henke Arno (Gorxheimertal DEX) Zink Hans (Heddesheim DEX), Cooling container for cooling a semiconductor element.
  4. Wargo Alec (1058 Rubber Ave. Naugatuck CT 06770), Device for cooling semi-conductors.
  5. Nelson Richard D. (Austin TX) Gupta Omkarnath R. (Englewood CO), End fed liquid heat exchanger for an electronic component.
  6. Tuckerman David B. (Stanford CA) Pease Roger F. W. (Stanford CA), Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing co.

이 특허를 인용한 특허 (42)

  1. Brewer,Richard Grant; Upadhya,Girish; Zhou,Peng; McMaster,Mark; Tsao,Paul, Apparatus and method of efficient fluid delivery for cooling a heat producing device.
  2. Kenny,Thomas; McMaster,Mark; Lovette,James, Apparatus and method of forming channels in a heat-exchanging device.
  3. Nilson, Robert; Griffiths, Stewart, Axially tapered and bilayer microchannels for evaporative coolling devices.
  4. Datta, Madhav; McMaster, Mark, Bonded metal and ceramic plates for thermal management of optical and electronic devices.
  5. Tamura, Masayoshi; Haga, Seiji; Kikuchi, Yosuke, Cooler and cooling device.
  6. Mueller, Marcus, Cooler for electrical and/ or electronic components, linked to present cooling needs.
  7. Kent, Fred E., Cooling apparatus for comestible products.
  8. Koga, Kiyotaka; Takenaka, Masayuki, Cooling apparatus for electric motor control unit.
  9. Kawaura, Masanori; Matsui, Hirohito; Yoshida, Tadafumi, Cooling fin structure.
  10. Cosley,Michael R.; Fischer,Richard L., Cooling system for densely packed electronic components.
  11. Correa, Adrian; Lin, Tien Chih (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
  12. Correa, Adrian; Lin, Tien-Chieh (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
  13. Takenaka,Masayuki; Kutsuna,Naruhiko; Yamaguchi,Kozo, Drive device.
  14. Takenaka, Masayuki; Kutsuna, Naruhiko; Yamaguchi, Kozo, Drive unit and inverter with cooling technique.
  15. Cannell, Michael J.; Cooley, Roger; Garman, Richard W.; Green, Geoffrey; Harrison, Peter N.; Walters, Joseph D., Fluid-cooled heat sink with turbulence-enhancing support pins.
  16. Munch, Mark; Werner, Douglas E., Gimballed attachment for multiple heat exchangers.
  17. Yeh, Lan Kai; Lin, Che Wei; Tsai, Ming Jye; Chen, Shao Wen; Shyu, Jin Cherng, Heat dissipating apparatus having micro-structure layer and method of fabricating the same.
  18. Yeh,Lan Kai; Lin,Che Wei; Tsai,Ming Jye; Chen,Shao Wen; Shyu,Jin Cherng, Heat dissipating apparatus having micro-structure layer and method of fabricating the same.
  19. Spokoiny, Michael; Kerner, James M.; Lux, Craig J.; Maurus, James M., Heat dissipating device.
  20. Van Dine Pieter ; Thaxton Edgar S. ; Smith James S. ; Linkinhoker Jeffrey, Heat transfer cold plate arrangement.
  21. Ramm, Robert James; Liu, Wenjun; Campbell, Colin, Heatsink with internal cavity for liquid cooling.
  22. White, Robert Alvin, In the rate of energy transfer across boundaries.
  23. Hom, James; Upadhya, Girish; Werner, Douglas E.; Munch, Mark; Tsao, Paul; Conway, Bruce; Zhou, Peng; Brewer, Richard, Integrated liquid to air conduction module.
  24. Upadhya,Girish; Kenny,Thomas W.; Zhou,Peng; Munch,Mark; Shook,James Gill; Goodson,Kenneth; Corbin,David, Interwoven manifolds for pressure drop reduction in microchannel heat exchangers.
  25. Calaman, Douglas P.; Connors, Matthew J., Liquid cooled heat exchanger with enhanced flow.
  26. Goodson,Kenneth; Kenny,Thomas; Zhou,Peng; Upadhya,Girish; Munch,Mark; McMaster,Mark; Horn,James, Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device.
  27. Upadhya,Girish; Brewer,Richard Grant; McMaster,Mark, Method and apparatus for controlling freezing nucleation and propagation.
  28. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,Dave; McMaster,Mark; Lovette,James, Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device.
  29. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,David, Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device.
  30. Yeh, Lan-Kai; Lin, Che-Wei; Tsai, Ming-Jye; Chen, Shao-Wen; Shyu, Jin-Cherng, Method of fabricating heat dissipating apparatus.
  31. Datta, Madhav; McMaster, Mark; Brewer, Rick; Zhou, Peng; Tsao, Paul; Upadhaya, Girish; Munch, Mark, Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system.
  32. Brewer, Richard Grant; Chow, Norman; Hom, James, Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers.
  33. Datta, Madhav; Leong, Brandon; McMaster, Mark, Microheat exchanger for laser diode cooling.
  34. Lovette,James; Zhou,Peng; Shook,James Gill, Multi-level microchannel heat exchangers.
  35. Upadhya, Girish; Herms, Richard; Zhou, Peng; Goodson, Kenneth; Hom, James, Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange.
  36. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  37. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  38. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  39. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  40. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  41. Cosley, Michael R.; Fischer, Richard L.; Thiesen, Jack H.; Willen, Gary S., Small scale chip cooler assembly.
  42. Zhou,Peng; Goodson,Kenneth; Suntiago,Juan, Vapor escape microchannel heat exchanger.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로