초록 ▼

A reflow soldering apparatus includes a plurality of heating compartments connected in series for heating objects for soldering; transporting means for successively carrying the objects through the compartments; and at least first and second cooling compartments connected subsequent to the heating c

A reflow soldering apparatus includes a plurality of heating compartments connected in series for heating objects for soldering; transporting means for successively carrying the objects through the compartments; and at least first and second cooling compartments connected subsequent to the heating compartments for cooling the soldered objects. The first cooling compartment subjects the objects to a first, descending temperature gradient, and the second cooling compartment subjects the objects to a second, descending temperature gradient, wherein the second temperature gradient is steeper than the first temperature gradient. The objects are cooled in the first cooling chamber to a temperature below the solidification temperature of the solder.

대표청구항 ▼

[ I claim:] [1.] Reflow soldering apparatus for the preparation of printed circuit boards comprising:a plurality of heating compartments connected in series for heating printed circuit boards for soldering;transporting means for successively carrying the printed circuit boards for soldering through

[ I claim:] [1.] Reflow soldering apparatus for the preparation of printed circuit boards comprising:a plurality of heating compartments connected in series for heating printed circuit boards for soldering;transporting means for successively carrying the printed circuit boards for soldering through the compartments; andat least a first and a second cooling compartment connected subsequent to the heating compartments for cooling the soldered printed circuit boards,characterized in thatthe first cooling compartment has a first cooling circuit through which a first, cooled fluid is circulated, wherein the first cooling compartment is adapted to subject the soldered printed circuit boards to a first descending temperature gradient and wherein the first cooling circuit is an oil circuit;the second cooling compartment has a second cooling circuit through which a second, cooled fluid is circulated, wherein the second cooling compartment is adapted to subject the soldered printed circuit boards to a second descending temperature gradient; andthe second temperature gradient is steeper than the first temperature gradient.