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Multi-oxidizer precursor for chemical mechanical polishing 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C09K-013/00
출원번호 US-0890778 (1997-07-11)
발명자 / 주소
  • Kaufman Vlasta Brusic
  • Wang Shumin
출원인 / 주소
  • Cabot Corporation
인용정보 피인용 횟수 : 27  인용 특허 : 24

초록 ▼

A chemical mechanical polishing slurry precursor comprising urea, a second oxidizer, an organic acid, and an abrasive, and a method for using the chemical mechanical polishing slurry precursor to prepare a chemical mechanical polishing slurry with a first oxidizer and thereafter using the slurry to

대표청구항

[ What we claim is:] [1.] A chemical mechanical polishing composition precursor comprising urea; from about 1.0 to about 9.0 wt % alumina, from about 0.2 to about 10.0 wt % ammonium persulfate and from about 0.5 to about 5.0 wt % succinic acid.

이 특허에 인용된 특허 (24)

  1. Prencipe Michael (East Windsor NJ) Drago Vincent (Staten Island NY), Abrasive tooth whitening dentifrice of improved stability.
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  2. Tollini Dennis R. (12 Palmdale Dr. Williamsville NY 14221), Bandage for replaceable dressing and method of fabrication thereof.
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  3. Beyer Klaus D. (Poughkeepsie NY) Guthrie William L. (Poughkeepsie NY) Makarewicz Stanley R. (New Windsor NY) Mendel Eric (Poughkeepsie NY) Patrick William J. (Newburgh NY) Perry Kathleen A. (Lagrange, Chem-mech polishing method for producing coplanar metal/insulator films on a substrate.
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  4. Danielson Donald D. (Aloha OR) Feller Allen D. (Portland OR) Cadien Kenneth C. (Portland OR), Chemical mechanical polishing slurry delivery and mixing system.
    상세보기
  5. Neville Matthew (Champaign IL) Fluck David J. (Pesotum IL) Hung Cheng-Hung (Champaign IL) Lucarelli Michael A. (Mattoon IL) Scherber Debra L. (Orangevale CA), Chemical mechanical polishing slurry for metal layers.
    상세보기
  6. Brancaleoni Gregory (Newark DE) Cook Lee M. (Steelville PA), Compositions and methods for polishing.
    상세보기
  7. Brancaleoni Gregory (Newark DE) Cook Lee M. (Steelville PA), Compositions and methods for polishing.
    상세보기
  8. Sandhu Gurtej (Boise ID) Elliott Richard L. (Boise ID) Doan Trung T. (Boise ID) Larsen Jody D. (Boise ID), IC mechanical planarization process incorporating two slurry compositions for faster material removal times.
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  9. Michaud Mark D. (Bristol CT), Metal surface refinement using dense alumina-based media.
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  10. Chow Melanie M. (Poughquag NY) Cronin John E. (Milton VT) Guthrie William L. (Hopewell Junction NY) Kaanta Carter W. (Essex Junction VT) Luther Barbara (Devon PA) Patrick William J. (Newburgh NY) Per, Method for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive line.
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  11. Beyer Klaus D. (Poughkeepsie NY) Makris James S. (Wappingers Falls NY) Mendel Eric (Poughkeepsie NY) Nummy Karen A. (Newburgh NY) Ogura Seiki (Hopewell Junction NY) Riseman Jacob (Poughkeepsie NY) Ro, Method for removing protuberances at the surface of a semiconductor wafer using a chem-mech polishing technique.
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  12. Yu Chris C. (Boise ID) Doan Trung T. (Boise ID) Laulusa Alan E. (Boise ID), Method of chemical mechanical polishing aluminum containing metal layers and slurry for chemical mechanical polishing.
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  13. Doan Trung T. (Boise ID), Method of etching back of tungsten layers on semiconductor wafers, and solution therefore.
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  14. Sandhu Gurtej S. (Boise ID), Method of performing a field implant subsequent to field oxide fabrication by utilizing selective tungsten deposition to.
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  15. Avanzino Steven C. (Cupertino CA) Haskell Jacob D. (Palo Alto CA), Method of planarization of topologies in integrated circuit structures.
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  16. Rostoker Michael D. (San Jose CA) Pasch Nicholas F. (Pacifica CA), Methods of cleaning semiconductor substrates after polishing.
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  17. Kodama Hitoshi (Aichi-ken JPX) Iwasa Shoji (Aichi-ken JPX), Polishing composition.
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  18. Cadien Kenneth C. (Portland OR) Feller Daniel A. (Portland OR), Slurries for chemical mechanical polishing.
    상세보기
  19. Yu Chris C. (Boise ID) Doan Trung T. (Boise ID), Slurries for chemical mechanically polishing copper containing metal layers.
    상세보기
  20. Medellin Daniel (Buena Park CA), Stress-free chemo-mechanical polishing agent for II-VI compound semiconductor single crystals and method of polishing.
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  21. Medellin Daniel (Buena Park CA), Stress-free chemo-mechanical polishing agent for II-VI compound semiconductor single crystals and method of polishing.
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  22. Yu Chris C. (Boise ID) Doan Trung T. (Boise ID), Two-step chemical mechanical polishing process for producing flush and protruding tungsten plugs.
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  23. Cote William J. (Essex Junction VT) Kaanta Carter W. (Colchester VT) Leach Michael A. (Winooski VT) Paulsen James K. (Jericho VT), Via-filling and planarization technique.
    상세보기
  24. Cote William J. (Essex Junction VT) Leach Michael A. (Bristol VT), Wafer flood polishing.
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이 특허를 인용한 특허 (27)

  1. Wang, Yuchun; Bajaj, Rajeev; Redeker, Fred C., Additives to CMP slurry to polish dielectric films.
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  2. Agranov, Gennadiy A.; Karasev, Igor, Backside silicon wafer design reducing image artifacts from infrared radiation.
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  3. Sun, Tao; Medsker, Robert, CMP composition comprising surfactant.
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  4. Vlasta Brusic Kaufman ; Rodney C. Kistler ; Shumin Wang, Chemical mechanical polishing slurry useful for copper substrates.
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  5. Andreas,Michael T., Chemical-mechanical polishing methods.
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  6. Andreas,Michael T., Chemical-mechanical polishing methods.
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  7. Luo, Qiuliang; Shen, James, Composition and method for polishing semiconductors.
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  8. Levy, Ehud, Compositions and methods for controlling microorganism growth in water processing systems.
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  9. Brusic, Vlasta; Thompson, Christopher; Dysard, Jeffrey, Compositions for polishing aluminum/copper and titanium in damascene structures.
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  10. Brusic, Vlasta; Zhou, Renjie; Feeney, Paul; Thompson, Christopher, Compositions for polishing aluminum/copper and titanium in damascene structures.
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  11. Sun, Lizhong; Li, Shijian, Electrochemically assisted chemical polish.
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  12. Lee, Jui-Kun; Yu, Chris C.; Mikolas, David G., Global planarization method.
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  13. Shimazu, Yoshitomo; Kido, Takanori; Uotani, Nobuo, LSI device polishing composition and method for producing LSI device.
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  14. Shimazu, Yoshitomo; Kido, Takanori; Uotani, Nobuo, LSI device polishing composition and method for producing LSI device.
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  15. Levy, Ehud; Barranco, Matthew D.; Tazi, Mohammed, Method for granulating powders.
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  16. Busta, Heinz H.; Steckenrider, J. Scott, Method of forming a current controlling device.
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  17. Yau, Wai-Fan; Cheung, David; Chopra, Nasreen Gazala; Lu, Yung-Cheng; Mandal, Robert; Moghadam, Farhad, Method of improving moisture resistance of low dielectric constant films.
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  18. Levy, Ehud, Nanocrystal-containing filtration media.
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  19. Oshima, Yoshiaki, Polishing composition.
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  20. Wang, Shumin; Grumbine, Steven K.; Streinz, Christopher C.; Hoglund, Eric W. G., Polishing composition for metal CMP.
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  21. Wang, Shumin; Grumbine, Steven K.; Streinz, Christopher C.; Hoglund, Eric W. G., Polishing composition for metal CMP.
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  22. Palanisamy Chinnathambi, Selvaraj; Siriwardane, Haresh, Polishing composition for nickel-phosphorous-coated memory disks.
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  23. Andreas, Michael T., Polishing methods.
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  24. Yu, Chris C.; Brusic, Vlasta, Process for fabricating optical switches.
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  25. Sun, Lizhong; Tsai, Stan D; Li, Shijian; White, John M, Solution to metal re-deposition during substrate planarization.
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  26. Levy,Ehud, Transition metal oxide-aluminosilicate purification media.
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  27. Brusic, Vlasta; Jenkins, Richard Jon; Thompson, Christopher C., Use of CMP for aluminum mirror and solar cell fabrication.
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