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Manufacture of thin-film magnetic heads 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-049/10
출원번호 US-0996935 (1997-12-23)
발명자 / 주소
  • Cheprasov Sergei
  • Grosslight Gordon J.
출원인 / 주소
  • Speedfam Corporation
대리인 / 주소
    Fitch, Even, Tabin & Flannery
인용정보 피인용 횟수 : 29  인용 특허 : 46

초록

Improved manufacture of thin-film magnetic heads includes a piezoelectric driven actuator for bending row tools used in the mass manufacture of magnetic heads. The actuator is independent of the row tool and includes a lever arm which structurally deflects when driven by the piezoelectric element, c

대표청구항

[ What is claimed is:] [7.] A row tool for carrying a plurality of spaced-apart workpieces joined side-by-side to form a linear row and for applying aligning forces to the row during a surfacing operation, comprising:an elongated mounting bar having a bottom portion between opposed ends said bottom

이 특허에 인용된 특허 (46)

  1. Bischoff Peter G. (Cupertino CA) Cole Robert A. (Newark CA), Adjustable transfer tool for lapping magnetic head sliders.
  2. Matthews Hugh B. (Boxboro MA), Air bearing head displacement sensor and positioner.
  3. Sawada Shigetomo (Kawasaki JPX) Asanai Yoshimichi (Kawasaki JPX) Tanaka Yoshio (Kawasaki JPX) Yashiro Kikuo (Kawasaki JPX), Apparatus and method for producing magnetic head sliders.
  4. Cole Robert A. (Newark CA), Automated system for controlling taper length during the lapping of air bearing surface of magnetic heads.
  5. Cole Robert A. (Newark CA), Automated system for lapping air bearing surface of magnetic heads.
  6. Heaston Gaylord E. (Beloit WI) Farazandeh Edward A. (Aurora IL), Automatic double disc grinder control cycle.
  7. Yagi Takayuki (Machida JPX) Hirai Yutaka (Tokyo JPX) Takamatsu Osamu (Atsugi JPX) Nakayama Masaru (Atsugi JPX) Kasanuki Yuji (Machida JPX) Shimada Yasuhiro (Atsugi JPX) Yamamoto Keisuke (Yamato JPX) , Cantilever probe and apparatus using the same.
  8. Feierabend Louis B. (Boulder CO) Luhrs Otto R. (Boulder CO), Contouring magnetic head surfaces.
  9. Yanagisawa Masahiro (Tokyo JPX), Data storage apparatus with head displacement sensor.
  10. Church Mark A. ; DeSouches Alain Michael, Deposition process windage calibration.
  11. Bukhman Yefim (Scottsdale AZ), Distributed polishing head.
  12. Dupuis David J. (Westminster MA) Kindler David J. (Concord MA) Smith Alan B. (Lincoln MA), Electrical access for electrical lapping guides.
  13. Smith Alan B. (Lincoln MA), Electrical guide for tight tolerance machining.
  14. Smith Alan B. (Lincoln MA), Electrical guide for tight tolerance machining.
  15. Suzuki Masahiko (Nagoya JPX), Energy efficient ink jet print head.
  16. Azarian Michael H. (Cupertino CA) Baldwinson Michael A. (Cupertino CA) Gutowski David T. (Santa Cruz CA) Hamilton Harold J. (Santa Clara CA) Hennessy James P. (Campbell CA) Parcher Mark W. (Fremont C, Interactive method for lapping transducers.
  17. Yumoto Kenji (Miyota-machi JPX), Jig for headpiece aggregate machining and method for manufacturing a thin film magnetic head.
  18. Chang Mike Y. (San Jose CA) Church Mark A. (Los Gatos CA) Salo Michael P. (San Jose CA), Lapping control system for magnetic transducers.
  19. Church Mark A. (Los Gatos CA) Deshpande Annayya P. (San Jose CA) Desouches Alain M. (Santa Cruz CA) Pal George S. (Saratoga CA) Salo Michael P. (San Jose CA) Ullah Muhammad I. (Morgan Hill CA), Lapping control system for magnetic transducers.
  20. Kindler David J. (Concord MA) Dupuis David J. (Westminster MA), Lapping fixture for disk sliders.
  21. Biskeborn Robert G. (Hollister CA) Inouye Carol Y. (San Jose CA) Seagle David J. (Morgan Hill CA) Wallash Albert J. (Morgan Hill CA) Barr Robert O. (San Jose CA) Garfunkel Glen A. (Palo Alto CA) Lewi, Lapping process for minimizing shorts and element recession at magnetic head air bearing surface.
  22. Kasukabe Susumu (Yokohama JPX) Takagi Ryuichi (Tokyo JPX), Manufacturing method of a probe head for semiconductor LSI inspection apparatus.
  23. Church Mark A. (Los Gatos CA), Method and apparatus for controlling the throat height of batch fabricated thin film magnetic transducers.
  24. Sandstrom Torbjrn E. (Mlnlycke SEX), Method and apparatus for exposure of substrates.
  25. Kusuda Tatsufumi (Kyoto JPX) Kouno Motohiro (Kyoto JPX) Nakatani Ikuyoshi (Kyoto JPX) Hirae Sadao (Kyoto JPX), Method and apparatus for measuring insulation film thickness of semiconductor wafer.
  26. Hennenfent Douglas J. (New Hope MN) Holmstrand Allan L. (Bloomington MN) Kracke Alan G. (Minnetonka MN), Method for attaching a workpiece to a workpiece carrier.
  27. Mowry Gregory S. (Burnsville MN) Gorka Phillip E. (Burnsville MN) Strayer Brian D. (Minneapolis MN) Kracke Alan G. (Minnetonka MN), Method of lapping MR. sensors.
  28. Zammit Robert P. (Tucson AZ), Method of lapping magnetic recording heads.
  29. Lam Chung-Fai (San Jose CA) Yong Yew-Nam (Fremont CA), Multi-adjustable row transfer tool.
  30. Hirae Sadao (Kyoto JPX) Matsubara Hideaki (Kyoto JPX) Kouno Motohiro (Kyoto JPX) Sakai Takamasa (Kyoto JPX), Non-destructive measuring sensor for semiconductor wafer and method of manufacturing the same.
  31. Nishimura Tetsuhiko (Zama JPX) Chida Yukio (Tokyo JPX) Choda Takahiro (Sagamihara JPX), Piezoelectric ceramic composition for actuator.
  32. Nishimura Tetsuhiko (Zama JPX) Chida Yukio (Tokyo JPX) Oguri Yasuo (Tokyo JPX), Piezoelectric ceramic composition for actuator.
  33. Nishimura Tetsuhiko (Machida JPX) Basu Swapan K. (Tokyo JPX) Chida Yukio (Tokyo JPX) Oguri Yasuo (Tokyo JPX) Inoue Shoko (Yokohama JPX), Piezoelectric ceramic composition for actuators.
  34. Scranton Robert A. (South Salem NY), Planar and cylindrical oscillating pneumatodynamic bearings.
  35. Lackey Stanley A. (5144 Commerce Ave. #A Moorpark CA 93021) Grosslight Gordon (5144 Commerce Ave. #A Moorpark CA 93021), Row tool.
  36. Lackey Stanley (5144 Commerce Ave. ; Unit A Moorpark CA 93021) Lackey Lauren (5144 Commerce Ave. ; Unit A Moorpark CA 93021) Grosslight Gordon (5144 Commerce Ave. ; Unit A Moorpark CA 93021), Row tool balance and bow correction apparatus.
  37. Ruiz Miguel A. (Arvada CO), Scalable method of fabricating thin-film sliders.
  38. Harada Takeshi (Toride JPX) Kanamaru Masatoshi (Chiyoda JPX) Hosogane Atsushi (Chiyoda JPX) Kohno Akiomi (Tomobe JPX) Mori Kenji (Tsuchiura JPX), Slider unit controllably actuated at a surface of a moving information recording medium.
  39. Hussinger Keith R. (Westboro MA) Mallary Michael L. (Berlin MA), Thin film head slider fabrication process.
  40. Church Mark A. (San Jose CA) Deshpande Annayya P. (San Jose CA) Desouches Alain M. (Santa Cruz CA), Thin film magnetic head fabrication method.
  41. Tang George H. (San Jose CA), Throat height control during lapping of magnetic heads.
  42. Church Mark A. (San Jose CA) Desouches Alain M. (Santa Cruz CA) Krebs Richard E. (San Jose CA), Ultimate inductive head integrated lapping system.
  43. Church Mark A. (San Jose CA) Desouches Alain M. (Santa Cruz CA) Krebs Richard E. (San Jose CA), Ultimate inductive head integrated lapping system.
  44. Mello Frank C. (Zeeland MI) Wyslotsky Ihor (Chicago IL), Vacuum seal station for a vacuum packaging machine.
  45. Hennenfent Douglas J. (New Hope MN) Holmstrand Allan L. (Bloomington MN) Kracke Alan G. (Minnetonka MN), Workpiece carrier.
  46. Huber Anton (Burghausen DEX) Weiss Robert (Winhoring DEX), Workpiece holder for rotary grinding machines for grinding semiconductor wafers, and method of positioning the workpiece.

이 특허를 인용한 특허 (29)

  1. Damon Vincent Williams, Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing.
  2. Williams, Damon Vincent, Apparatus for controlling retaining ring and wafer head tilt for chemical mechanical polishing.
  3. Boutaghou, Zine-Eddine, Apparatus for finishing a magnetic slider.
  4. Saldana, Miguel A.; Williams, Damon Vincent, Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head.
  5. Ladislav Rudolf Pust ; Brenda Anne Everitt, Composite lapping monitor resistor.
  6. Hao,Shanlin; Berkowitz,Jeffery K.; Goglia,Peter R., Head performance based nano-machining process control for stripe forming of advanced sliders.
  7. Anderson, Bruce; Liu, Dongming; Erickson, Edward M.; Hao, Shanlin, Interface assembly for lapping control feedback.
  8. Sudo Koji,JPX ; Yanagida Yoshiaki,JPX ; Sugiyama Tomokazu,JPX, Lapping apparatus and lapping method.
  9. Shindou, Hiroshi; Sasaki, Masahiro; Ogawa, Akio; Abe, Tetsuo; Kouzu, Masaki; Yamaguchi, Masao, Machining apparatus for workpiece and method therefor.
  10. Shindou, Hiroshi; Sasaki, Masahiro; Ogawa, Akio; Abe, Tetsuo; Kouzu, Masaki; Yamaguchi, Masao, Machining apparatus for workpiece and method therefor.
  11. Tohta,Kazushige; Shindo,Hiroshi; Ogawa,Akio; Fukuroi,Osamu; Fujii,Takashi, Magnetic head grinding device and method.
  12. Shindou, Hiroshi; Sasaki, Masahiro; Ogawa, Akio; Abe, Tetsuo; Kouzu, Masaki; Yamaguchi, Masao, Magnetic head polishing device and method thereof.
  13. Sone, Shunsuke; Yanagida, Yoshiaki; Nishioka, Teruaki; Suto, Koji, Method and apparatus for polishing, and lapping jig.
  14. Sone, Shunsuke; Yanagida, Yoshiaki; Nishioka, Teruaki; Suto, Koji; Sugiyama, Tomokazu, Method and apparatus for polishing, and lapping jig.
  15. Anderson, II, Robert L.; Charatan, Robert, Method of and platen for controlling removal rate characteristics in chemical mechanical planarization.
  16. Williams, Damon Vincent, Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing.
  17. Owczarz, Alek; Boyd, John; Kistler, Rod, Methods using active retainer rings for improving edge performance in CMP applications.
  18. Lytle, Tracy, Minimal force air bearing for lapping tool.
  19. Boggs Karl E. ; Davis Kenneth M. ; Landers William F. ; Lofaro Michael F. ; Ticknor Adam D. ; Fiege Ronald D., Piezo-actuated CMP carrier.
  20. Dai,Qing; Lu,Jennifer Qing; McKean,Dennis Richard; Row,Eun; Zheng,Li, Planarization method for a structure having a first surface for etching and a second surface.
  21. Dai, Qing; Lu, Jennifer Qing; McKean, Dennis Richard; Row, Eun; Zheng, Li, Planarization process for thin film surfaces.
  22. Owczarz, Alek; Boyd, John; Kistler, Rod, Platen design for improving edge performance in CMP applications.
  23. Saldana,Miguel A.; Williams,Damon Vincent, Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head.
  24. Abe, Tetsuo; Ogawa, Akio; Hasebe, Tsugihiro; Shindou, Hiroshi; Fukuroi, Osamu, Polishing apparatus for magnetic head and method therefor.
  25. Masaki Kozu JP; Masahiro Sasaki JP, Processing jig.
  26. Katrina A. Mikhaylich ; John M. Boyd, Sacrificial retaining ring CMP system and methods for implementing the same.
  27. Saldana, Miguel A.; Boyd, John M.; Gotkis, Yehiel; Owczarz, Aleksander A., Subaperture chemical mechanical polishing system.
  28. Beckle, Karl Frank; Chaw, Michael William; Koch, Richard H.; Thurber, Mark Clinton; Valdes, Bruno Alejandro, System and method for rounding disk drive slider corners and/or edges using a flexible slider fixture, an abrasive element, and support elements to control slider orientation.
  29. Davis, Damaris; Gee, Glenn P.; Smith, Darrick T.; Sougrati, Hicham M., Within-row wedge angle control for magnetic recording read-write heads.
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