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Method and apparatus of monitoring polishing pad wear during processing 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-049/00
출원번호 US-0969148 (1997-11-10)
발명자 / 주소
  • Fisher
  • Jr. Thomas R.
  • Jaso Mark A.
  • Stevens
  • Jr. Leonard C.
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    DeLio & Peterson, LLCCurcio
인용정보 피인용 횟수 : 38  인용 특허 : 13

초록 ▼

A method and apparatus for monitoring polishing pad wear during processing is developed to extend the pad's useful life, and maintain pad uniformity. This is accomplished in the present invention by measuring and monitoring the diminished pad thickness using a non-intrusive measurement system, and c

대표청구항 ▼

[ Thus, having described the invention, what is claimed is:] [1.] A method for monitoring a polishing pad of a chemical-mechanical polishing tool, said pad having an initial thickness uniformity, and adjusting pad conditioning operational parameters comprising the steps of:a) providing a non-intrusi

이 특허에 인용된 특허 (13)

  1. Yu Chris C. (Boise ID), Acoustical method and system for detecting and controlling chemical-mechanical polishing (CMP) depths into layers of con.
    상세보기
  2. Birang Manoocher, Apparatus and method for detecting surface roughness in a chemical polishing pad conditioning process.
    상세보기
  3. Allen Robert F. ; Holzapfel Paul ; Bartels Anthony L. ; Lin Warren, Apparatus for the in-process detection of workpieces in a CMP environment.
    상세보기
  4. Bartels Anthony L. ; Allen Robert F. ; Holzapfel Paul ; Lin Warren, Apparatus for the in-process detection of workpieces with a monochromatic light source.
    상세보기
  5. Yu Chris C. (Boise ID) Sandhu Gurtej S. (Boise ID), Chemical mechanical planarization (CMP) of a semiconductor wafer using acoustical waves for in-situ end point detection.
    상세보기
  6. Chen Lai-Juh,TWX, Chemical-mechanical polish (CMP) pad conditioner.
    상세보기
  7. Meikle Scott (Boise ID) Doan Trung T. (Boise ID), Chemical-mechanical polishing techniques and methods of end point detection in chemical-mechanical polishing processes.
    상세보기
  8. Schultz Laurence D. (Boise ID), Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer.
    상세보기
  9. Winebarger Paul (Austin TX), Method for polishing a substrate.
    상세보기
  10. Koos Daniel A. (Boise ID) Meikle Scott (Boise ID), Optical end point detection methods in semiconductor planarizing polishing processes.
    상세보기
  11. Yano Hiroyuki (Wappingers Falls NY) Okumura Katsuya (Poughkeepsie NY), Pad condition and polishing rate monitor using fluorescence.
    상세보기
  12. Kobayashi Thomas S. (Austin TX), Process for polishing and analyzing a layer over a patterned semiconductor substrate.
    상세보기
  13. Kriz Ronald D. (Boulder CO), Systems for monitoring changes in elastic stiffness in composite materials.
    상세보기

이 특허를 인용한 특허 (38)

  1. Richardson O. Adebanjo ; William Graham Easter ; Alvaro Maury SG; Frank Miceli ; Jose Omar Rodriguez, Apparatus and method for in-situ measurement of polishing pad thickness loss.
    상세보기
  2. Matsuzaki, Toru, CMP apparatus and method of polishing wafer using CMP.
    상세보기
  3. Manens, Antoine P.; Hsu, Wei-Yung; M'Saad, Hichem, CMP pad thickness and profile monitoring system.
    상세보기
  4. Kaushal, Tony S.; Dam, Chuong Quang; Hu, Yongqi, Chemical mechanical polishing endpoinat detection.
    상세보기
  5. Muldowney, Gregory P.; Palaparthi, Ravichandra V., Chemical mechanical polishing method.
    상세보기
  6. William H. Ma ; Adam D. Ticknor, Chemical-mechanical polishing pad conditioner.
    상세보기
  7. Chang, Shou-Sung; Chen, Hung Chih; Tsai, Stan D; Wang, Yuchun, Closed loop control of pad profile based on metrology feedback.
    상세보기
  8. Dhandapani, Sivakumar; Qian, Jun; Cocca, Christopher D.; Fung, Jason G.; Chang, Shou-Sung; Garretson, Charles C.; Menk, Gregory E.; Tsai, Stan D., Closed-loop control for improved polishing pad profiles.
    상세보기
  9. Obeng,Yaw S.; Thomas,Peter A.; Kelly,Patrick J., Compacted polishing pads for improved chemical mechanical polishing longevity.
    상세보기
  10. Joslyn, Michael J., Device and method for collecting and measuring chemical samples on pad surface in CMP.
    상세보기
  11. Joslyn, Michael J., Device and method for collecting and measuring chemical samples pad surface in CMP.
    상세보기
  12. Cheng, Rico; Peng, Kang-Yung; Lai, Kevin, Dual wafer-loss sensor and water-resistant sensor holder.
    상세보기
  13. Elledge,Jason B, In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging.
    상세보기
  14. Elledge,Jason B, In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging.
    상세보기
  15. Elledge,Jason B., In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging.
    상세보기
  16. Tada, Mitsuo; Suto, Yasunari, Measuring apparatus.
    상세보기
  17. Tada, Mitsuo; Suto, Yasunari, Measuring apparatus.
    상세보기
  18. Obeng, Yaw S., Measuring the surface properties of polishing pads using ultrasonic reflectance.
    상세보기
  19. Yu, Chen-Hua; Jang, Syun-Ming, Method and apparatus for chemical/mechanical planarization (CMP) of a semiconductor substrate having shallow trench isolation.
    상세보기
  20. Hsu-Pin Wang ; Qing Liu, Method and apparatus for detecting micro-scratches in semiconductor wafers during polishing process.
    상세보기
  21. Kimura, Norio; Ishii, You; Nishi, Toyomi; Kawamoto, Takayoshi; Sakurai, Takeshi, Method and apparatus for dressing polishing cloth.
    상세보기
  22. Shin,Sung Ho, Method and apparatus for measuring abrasion amount and pad friction force of polishing pad using thickness change of slurry film.
    상세보기
  23. Shin,Sung Ho, Method and apparatus for measuring abrasion amount and pad friction force of polishing pad using thickness change of slurry film.
    상세보기
  24. Gitis, Norm; Meyman, Aleksandr; Vinogradov, Michael; Faynberg, Mikhail; Dorfman, Vlad, Method and apparatus for monitoring polishing plate condition.
    상세보기
  25. Hunter,Reginald, Method and apparatus to provide for automated process verification and hierarchical substrate examination.
    상세보기
  26. Hu, Tien-Chen; Twu, Jin-Churng; Lu, Chen-Fa, Method for a copper CMP endpoint detection system.
    상세보기
  27. Arcayan, Rigel G.; Pineda-Garcia, Jose M.; Burleson, Michael K., Method for achieving a desired semiconductor wafer surface profile via selective polishing pad conditioning.
    상세보기
  28. Jun, Chung-Sam; Kim, Kye-Weon; Yang, Yu-Sin; Kim, Hyo-Hoo, Method for inspecting a polishing pad in a semiconductor manufacturing process, an apparatus for performing the method, and a polishing device adopting the apparatus.
    상세보기
  29. Chen, Sheng-Hsiung, Method of wafer edge damage inspection.
    상세보기
  30. Berman,Michael; Reder,Steven; Trattles,Matthew R., Method to monitor pad wear in CMP processing.
    상세보기
  31. Sung, Chien-Min, Methods for enhancing chemical mechanical polishing pad processes.
    상세보기
  32. Sung, Chien-Min; Pai, Yang-Liang, Pad conditioner dresser.
    상세보기
  33. Moriyama,Shigeo; Ishida,Yoshihiro; Kugaya,Takashi; Ootsuki,Shigeo; Katagiri,Soichi; Nishimura,Sadayuki; Kawai,Ryosei; Yasui,Kan, Polishing apparatus and method for producing semiconductors using the apparatus.
    상세보기
  34. Kosuge, Ryuichi; Sone, Tadakazu, Polishing apparatus and wear detection method.
    상세보기
  35. Daniel L. Fran.cedilla.a ; Raymond Khoury ; Jose M. Ocasio ; Uldis A. Ziemins, Real-time method for profiling and conditioning chemical-mechanical polishing pads.
    상세보기
  36. Arcayan Rigel G. ; Pineda-Garcia Jose M. ; Burleson Michael K., System and method for achieving a desired semiconductor wafer surface profile via selective polishing pad conditioning.
    상세보기
  37. Lai, Jiun-Yu; Tsai, Ying-Hsiu; Chang, Wei-Chen; Chiou, Yi-Ching, System and method for polishing substrate.
    상세보기
  38. Meloni Mark A., Ultrasonic methods and apparatus for the in-situ detection of workpiece loss.
    상세보기

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