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Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24D-011/00
출원번호 US-0258504 (1999-02-26)
발명자 / 주소
  • Birang Manoocher
  • Gleason Allan
  • Guthrie William L.
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Fish & Richardson
인용정보 피인용 횟수 : 127  인용 특허 : 9

초록 ▼

The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second

대표청구항 ▼

[ What is claimed is:] [1.] A polishing pad for a chemical mechanical polishing apparatus, comprising:an article having a polishing surface;an aperture formed in the article; anda substantially transparent plug including a first section with a first dimension and a second section with a second, diff

이 특허에 인용된 특허 (9)

  1. Birang Manoocher ; Gleason Allan ; Guthrie William L., Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus.
    상세보기
  2. Lustig Naftali E. (Croton-on-Hudson NY) Saenger Katherine L. (Ossining NY) Tong Ho-Ming (Yorktown Heights NY), In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing.
    상세보기
  3. Koos Daniel A. (Boise ID) Meikle Scott (Boise ID), Optical end point detection methods in semiconductor planarizing polishing processes.
    상세보기
  4. Tuttle Mark E. (Boise ID), Polishing pad.
    상세보기
  5. Tuttle Mark E. (Boise ID), Polishing pad with controlled abrasion rate.
    상세보기
  6. Tuttle Mark E. (Boise ID), Polishing pad with uniform abrasion.
    상세보기
  7. Roberts John V. H. (Newark DE), Polishing pads.
    상세보기
  8. Yu Chris C. (Austin TX), Polishing pads used to chemical-mechanical polish a semiconductor substrate.
    상세보기
  9. Allen Franklin L. (Sherman TX) Smith William L. (Howe TX) Debner Thomas G. (Howe TX) Olmstead Dennis L. (Sherman TX), Semiconductor polishing pad.
    상세보기

이 특허를 인용한 특허 (127)

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  2. Elledge, Jason B., APPARATUS FOR IN-SITU OPTICAL ENDPOINTING ON WEB-FORMAT PLANARIZING MACHINES IN MECHANICAL OR CHEMICAL-MECHANICAL PLANARIZATION OF MICROELECTRONIC-DEVICE SUBSTRATE ASSEMBLIES AND METHODS FOR MAKING A.
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  127. Lehman, Kurt; Chen, Charles; Allen, Ronald L.; Shinagawa, Robert; Sethuraman, Anantha; Bevis, Christopher F.; Trikas, Thanassis; Chen, Haiguang; Meng, Ching Ling, Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad.
    상세보기

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