초록 ▼

Method for implementing a multi-phase plastic package for electronic components, and packaged electronic components produced according to the method. The principles of the present invention contemplate electrostatically depositing an exceptionally uniform coating on electronic components, especially

Method for implementing a multi-phase plastic package for electronic components, and packaged electronic components produced according to the method. The principles of the present invention contemplate electrostatically depositing an exceptionally uniform coating on electronic components, especially microchips, and more especially still, on integrated circuits prior to the encapsulation of the electronic components into plastic-packaged components. The coating, for instance applied to a completed leadframe assembly, including die and wire bonds, serves two purposes. It improves adhesion of the molding compound forming the package, thereby reducing the chances for delamination of the package. The coating also isolates the relatively fragile wire bonds, including their attachment points to the chip and the bonding pads and the leads, from chemical and metallurgical attack by the flame retardant found in many molding compounds.

대표청구항 ▼

[ We claim:] [1.] A method for packaging an electronic, the device including at least one electrical lead, the method comprising the steps of:electrostatically applying a coating material to the electronic device and at least a portion of the lead, wherein the step of electrostatically applying a co

[ We claim:] [1.] A method for packaging an electronic, the device including at least one electrical lead, the method comprising the steps of:electrostatically applying a coating material to the electronic device and at least a portion of the lead, wherein the step of electrostatically applying a coating material comprises the steps of:electrically connecting the at least one electrical lead to a first polarity: andcharging the coating material to a second polarity;masking part of the at least one electrical lead after electrostatically applying the coating material and before curing the coating material;curing the coating material, wherein the step of curing the coating material does not cure the masked part of the at least one electrical lead, so that part of the electrostatically applied coating covering part of the at least one electrical lead is uncured;removing the uncured part of the electrostatically applied coating; andforming a plastic package about, and in intimate contact with, at least a portion of the coating material.