초록 ▼

A circuit unit having an insulating substrate (1) on which a conductive, flat coil (3) is located. The coil (3) can consist of a plurality of coil layer sections (9, 17) separated by insulating layers (11). To interconnect the individual coil layer sections (9, 17) into a coil, at least one opening

A circuit unit having an insulating substrate (1) on which a conductive, flat coil (3) is located. The coil (3) can consist of a plurality of coil layer sections (9, 17) separated by insulating layers (11). To interconnect the individual coil layer sections (9, 17) into a coil, at least one opening (13) is provided in each of the insulating layers (11). The connection between the first coil ends (15, 19) of the coil (3) and an integrated circuit (7) or a module (23) containing the integrated circuit (7) can be formed solely by the coil ends (15, 19) and the connection points (27) of the integrated circuit (7) or the contacts (25) of the module (23) touching. The individual turns of the coil (3) can be disposed and dimensioned so as to permit embossing of the circuit unit without restriction within an area (37, 38) conforming with the standard.

대표청구항 ▼

[ We claim:] [1.] A chip card comprising:a card body including an insulating carrier substrate (1);at least one flat conductive coil (9,17) disposed on the substrate, the coil including first contact ends (15,19);an integrated circuit (7) having terminals (27) coupled to the coil first contact ends

[ We claim:] [1.] A chip card comprising:a card body including an insulating carrier substrate (1);at least one flat conductive coil (9,17) disposed on the substrate, the coil including first contact ends (15,19);an integrated circuit (7) having terminals (27) coupled to the coil first contact ends in a manner permitting electrical signals to be transmitted between the at least one coil and the integrated circuit;at least one electrically insulating layer (11) disposed on said insulating carrier substrate, said insulating layer including at least one through opening (13);said coil disposed on said substrate in at least two sections (9,17) that are displaced respectively closer and farther away from the substrate, with each section extending generally parallel with the insulating layer, each section including one of said first contact ends (15,19) and a second end (15a,19a);said at least one insulating layer extending between at least a portion of said coil sections with an electrical connection between coil sections extending through said at least one opening and said at least one insulating layer;said electrical connection comprising said second coils ends (15a, 19a) of said coil sections joined together through said opening, with the second end (19a) of the coil section (11) located farther away from the carrier substrate extending through the opening and engaging the second end (15a) of the coil section (9) located closer to the substrate.