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Electronic equipment 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0345444 (1999-07-01)
우선권정보 JP-0189121 (1998-07-03)
발명자 / 주소
  • Sugiyama Akira,JPX
  • Hoshino Tsutomu,JPX
  • Yoshida Shinichi,JPX
  • Joeng Tan Tjang,JPX
출원인 / 주소
  • Kabushiki Kaisha Toshiba, JPX
대리인 / 주소
    Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
인용정보 피인용 횟수 : 41  인용 특허 : 4

초록

The present invention aims to radiate heat efficiently from the inside of an equipment housing, with a simple structure. First and second through air passageways are formed at the sides of first to third equipment housings and the second through air passageway communicates with a recess air passagew

대표청구항

[ We claim:] [1.] Electronic equipment comprising:a plurality of equipment housings containing electronic circuit units and being tiered;first and second housing through air passageways provided respectively at both sides sandwiching the electronic circuit units of the plural equipment housings, the

이 특허에 인용된 특허 (4)

  1. Tajima Tsuneaki (Tokyo JPX) Matsuo Yohichi (Tokyo JPX), Air cooling equipment for electronic systems.
  2. Heitzig Claus-Peter (Germering DEX), Apparatus for the cooling of electronic assemblies or components.
  3. Jacoby Eliot G. (Glenside PA) Zaharchuk Walter S. (Macungie PA) Liss Zalman A. (Allentown PA) Darragh Denis P. (Allentown PA) Ngo Dat V. (Allentown PA), Modular multilevel electronic cabinet.
  4. Matsui Kiyoshi (Kawasaki JPX) Arai Katsuyuki (Kawasaki JPX) Shinbashi Sueo (Kawasaki JPX), Natural air cooled rack for vertically disposed printed boards.

이 특허를 인용한 특허 (41)

  1. McMahan, Lianne M.; Perry, Lou; Rao, Prasad; McKenna, Brian, Air removal unit.
  2. McMahan, Lianne M.; Perry, Lou; Rao, Prasad; McKenna, Brian, Air removal unit.
  3. VanGilder, James William; Healey, Christopher M.; Zhang, Xuanhang, Analysis of effect of transient events on temperature in a data center.
  4. Germagian, Mark; Prunier, John; Olsen, Martin, Assembly for extracting heat from a housing for electronic equipment.
  5. Gravell, Anthony R.; Barlow, Richard J., Balanced flow cooling.
  6. Bettridge,James M.; Ford,Thomas K.; Turek,James R., Cabinet for computer devices with air distribution device.
  7. Bettridge,James M.; Ford,Thomas K.; Turek,James R., Cabinet for computer devices with air distribution device.
  8. Cho, Shih-Huai; Yang, Wen-Hsiung, Channel diversion device and related heat dissipating system.
  9. Reynov, Boris; Kohn, Jack; Mowat, Euan F.; Siddhaye, Shreeram; Nitzan, Ben; Nagarajan, Mahesh, Chassis system with front cooling intake.
  10. Reynov, Boris; Kohn, Jack; Mowat, Euan F; Siddhaye, Shreeram; Nitzan, Ben; Nagarajan, Mahesh, Chassis system with front cooling intake.
  11. Reynov, Boris; Kohn, Jack; Mowat, Euan F; Siddhaye, Shreeram; Nitzan, Ben; Nagarajan, Mahesh, Chassis system with front cooling intake.
  12. Ross, Peter George; Frink, Darin Lee; Hamilton, James R.; Marr, Michael David, Compute node cooling with air fed through backplane.
  13. Ross, Peter George; Frink, Darin Lee; Hamilton, James R.; Marr, Michael David, Compute node cooling with air fed through backplane.
  14. R. Stephen Spinazzola ; Dennis L. Peltz, Computer rack heat extraction device.
  15. R. Stephen Spinazzola ; Dennis L. Peltz, Computer rack heat extraction device.
  16. Spinazzola, R. Stephen; Peltz, Dennis L., Computer rack heat extraction device.
  17. Spinazzola, R. Stephen; Peltz, Dennis L., Computer rack heat extraction device.
  18. Spinazzola, R. Stephen; Peltz, Dennis L., Computer room air flow method and apparatus.
  19. Spinazzola, R. Stephen; Peltz, Dennis L., Computer room air flow method and apparatus.
  20. Bestwick, Graham; Ritson, Nigel D; Garnett, Paul J; Wilson, Helenaur, Computer system cooling.
  21. Bryan, David Edward; Beall, Christopher Strickland; Frink, Darin Lee, Computer system with external bypass air plenum.
  22. Osborn, Jay K.; Wilson, Helenaur, Computing apparatus with cooling fan.
  23. Wolford,Robert Russell; Hardee,Donna Casteel; Foster, Sr.,Jimmy Grant; Keener,Don Steven, Cooling apparatus for vertically stacked printed circuit boards.
  24. Garnett, Paul J; Ritson, Nigel D, Cooling computer systems.
  25. Nishiyama,Shinichi; Morishita,Yasuji; Katakura,Yasuyuki; Okabe,Youji; Maeda,Tadaharu, Cooling structure for electronic devices.
  26. Ibori, Satoshi; Hamano, Koji; Mao, Jiangming; Kamezawa, Tomoya; Hirota, Masayuki; Hiraga, Masahiro, Electric power conversion system.
  27. French F. William ; Tilley Lisa D., Electronic cabinet door air mixing dam.
  28. Broome, John P., Equipment rack with integral HVAC and power distribution features.
  29. Johnson, Rollie R.; Rasmussen, Neil, Exhaust air removal system.
  30. Johnson, Rollie R.; Rassmussen, Neil, Exhaust air removal system.
  31. Blackmon, Jr., Robert R.; Hendrix, Mark; Low, Andy; Wear, Mark; Fair, James C., Flame suppression cabinet.
  32. Patel,Chandrakant D, Longitudinally cooled electronic assembly.
  33. Earl W. Boone, Method and system for cooling a card shelf.
  34. Rasmussen, Neil, Rack enclosure.
  35. Rasmussen, Neil; Germagian, Mark H.; Avelar, Victor P.; Donovan, James E., Rack enclosure.
  36. Rasmussen, Neil; Germagian, Mark H.; Avelar, Victor P.; Donovan, James Edward, Rack enclosure.
  37. Beitelmal,Abdlmonem H.; Patel,Chandrakant D.; Bash,Cullen E., Small form factor air jet cooling system.
  38. Tresh, Michael; Jackson, Brian; Bednarcik, Edward; Prunier, John; Olsen, Martin; Germagian, Mark, Systems and methods for closed loop heat containment with cold aisle isolation for data center cooling.
  39. Fleming, James N.; Goldsberry, Timothy; Shurhay, Mark; Hibner, Max W., Thermal ducting system.
  40. Baldwin, Jr.,Richard G., Vented and ducted sub-rack support member.
  41. Schwenk Hans-Martin,DEX ; Kempf Heinz,DEX ; Takats Peter,DEX, Ventilated housing.
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