|국가/구분||United States(US) Patent 등록|
|국제특허분류(IPC7판)||H05B-001/00 H05B-007/20 F28D-015/00|
|미국특허분류(USC)||219/209 ; 361/719 ; 165/104.33|
|발명자 / 주소|
|출원인 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 71 인용 특허 : 23|
An apparatus for cooling an integrated circuit device includes a sealed thermally insulated chamber containing the integrated circuit device. A cooling element is located in chamber and is in thermal contact with the integrated circuit device for cooling the device. The integrated circuit device is mounted in a socket having socket pins that extend through a heater board forming one side of the device to projecting exposed external end portions. A heating element in the form of a polymer thick film resistor is deposited on the heater board on the inside ...
[ We claim:] [1.] An apparatus for cooling an integrated circuit device having projecting connector pins, said apparatus comprising:a generally planar heater board having an array of openings formed therein;a socket mounted to said heater board for receiving and electrically coupling to the integrated circuit device, said socket including a base member and an array of elongated socket pins projecting from said base member through said openings in said heater board to exposed external ends, each of said socket pins defining a receptacle on said base membe...