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Method and apparatus for cooling an integrated circuit device

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05B-001/00
  • H05B-007/20
  • F28D-015/00
출원번호 US-0020766 (1998-02-09)
발명자 / 주소
  • Wall Charles B.
  • Peeples Johnston W.
  • Craps Terry
  • DiGiacomo Robert
출원인 / 주소
  • Kryotech, Inc.
대리인 / 주소
    Womble Carlyle Sandridge & Rice, PLLC
인용정보 피인용 횟수 : 71  인용 특허 : 23

초록

An apparatus for cooling an integrated circuit device includes a sealed thermally insulated chamber containing the integrated circuit device. A cooling element is located in chamber and is in thermal contact with the integrated circuit device for cooling the device. The integrated circuit device is

대표청구항

[ We claim:] [1.] An apparatus for cooling an integrated circuit device having projecting connector pins, said apparatus comprising:a generally planar heater board having an array of openings formed therein;a socket mounted to said heater board for receiving and electrically coupling to the integrat

이 특허에 인용된 특허 (23)

  1. Hazen William A. (Hopkinton MA), Apparatus for cooling circuits.
  2. Hilbrink Johan O. (Cincinnati OH), Apparatus for cooling electronic devices.
  3. Porter Warren W. (Escondido CA), Apparatus for preventing the formation of condensation on sub-cooled integrated circuit devices.
  4. Cabaniss Frank W. (Columbia SC), Circuit and method for determining the operating performance of an integrated circuit.
  5. Conley Larry R. (Fountain Valley CA), Circuit board with weldable terminals.
  6. Villani Angelo (Shrewsbury MA), Clip-on heat sink.
  7. Higgins Robert W. (San Jose CA), Compact replaceable temperature control module.
  8. Fang Shou-Mean (Union City CA) Horsma David A. (Palo Alto CA) Peronnet Guillaume (Palo Alto CA) Fahey Timothy E. (Williamsport PA) Au Andrew N. (Fremont CA) Carlomagno William D. (Redwood City CA), Composite circuit protection devices.
  9. Porter Warren W. (Escandido CA), Computer component cooling system with local evaporation of refrigerant.
  10. Porter Warren W. (Escondido CA), Electrically-operated heat exchanger release mechanism.
  11. Porter Warren W. (Escondido CA) Wall ; III Charles B. (Irmo SC), Focused CPU air cooling system including high efficiency heat exchanger.
  12. Porter Warren W. (Escondido CA), High frequency/low temperature electronic socket pin.
  13. Sutrina Thomas A. (Rockford IL), Integral heat sink interface.
  14. Meyer ; IV George A. (Conestoga PA) Toth Jerome E. (Hatboro PA) Longsderff Richard W. (Lancaster PA), Integrated circuit cooling apparatus.
  15. Hilbrink Johan O. (Cincinnati OH), Method of making a cooling package for a semiconductor chip.
  16. Sakemi Shoji (Fukuoka JPX) Wada Yoshiyuki (Onojo JPX), Method of mounting an electronic part with bumps on a circuit board.
  17. Haj-Ali-Ahmadi Javad (Austin TX) Frankeny Jerome A. (Taylor TX) Frankeny Richard F. (Austin TX) Habich Adolph B. (Georgetown TX) Hermann Karl (Austin TX) Hunt Ronald E. (Georgetown TX), Modular test oven.
  18. Del Monte Lou A. (Minnetonka MN), Temperature control of solid state circuit chips.
  19. Tustaniwskyj Jerry Ihor ; Babcock James Wittman, Temperature control system for an electronic device in which device temperature is estimated from heater temperature and.
  20. Tustaniwskyj Jerry Ihor ; Babcock James Wittman, Temperature control system for an electronic device which achieves a quick response by interposing a heater between the.
  21. Lin Wei T. (No. 20 ; Sec. 5 ; 3rd Fl. ; Cheng Teh Rd. Taipei TWX), Thermoelectric couple device.
  22. Kessler Rolf (Merzhausen DEX), Thermoelectric heating or cooling device.
  23. Kornfeld Bruce E. (San Diego CA) Alexander Arthur R. (Valley Center CA), Three dimensional die packaging in multi-chip modules.

이 특허를 인용한 특허 (71)

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  4. Aoki, Russell S.; Crocker, Michael T.; Carter, Daniel P., Chamber sealing valve.
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  7. Hershberger, Jeffrey Gerard; Hill, Richard F.; Smythe, Robert Michael; Sutsko, Michael G., Circuit assemblies including thermoelectric modules.
  8. Hershberger, Jeffrey Gerard; Hill, Richard F.; Smythe, Robert Michael; Sutsko, Michael G., Circuit assemblies including thermoelectric modules.
  9. Manole, Dan M., Compact refrigeration system and power supply unit including dynamic insulation.
  10. Manole,Dan M.; Coffey,Donald L.; Moore,Michael J., Compact refrigeration system for providing multiple levels of cooling.
  11. Kang Sukhvinder ; Mahaney ; Jr. Howard Victor ; Schmidt Roger R. ; Singh Prabjit, Cooled IC chip modules with an insulated circuit board.
  12. Espersen,Morten; Kristensen,Thorben, Cooling arrangement for an integrated circuit.
  13. Nagashima James ; Ward Terence G. ; Downer Scott D., Electrically isolated power switching device mounting assembly for EMI reduction.
  14. Ashiwake Noriyuki,JPX ; Otaguro Toshio,JPX ; Nishihara Atsuo,JPX ; Honma Mitsuru,JPX, Electronic apparatus.
  15. Yoshikawa, Minoru, Electronic device having dewing prevention structure and dewing prevention structure of electronic device.
  16. Ikeda Tomoki,JPX, Electronic device mounting structure using electronic device mounting member and cushioning.
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  18. Monfarad, Ali Heydari, Field replaceable packaged refrigeration heat sink module for cooling electronic components.
  19. Cohen, Alan Mark, Heat dissipation assembly for computing devices.
  20. Cohen, Alan Mark, Heat dissipation assembly for computing devices.
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  23. Lin, Tzu Cheng; Chou, Wei Cheng, Heating and heat dissipating multi-layer circuit board structure for keeping operating temperature of electronic components.
  24. Sivertsen, Clas G., Housing for in-line video, keyboard and mouse remote management unit.
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  26. Wayburn, Lewis S.; Gage, Derek E.; Hayes, Andrew M.; Barker, R. Walton; Niles, David W., Integrated circuit cooling apparatus.
  27. Tilton,Donald E.; Knight,Paul A.; Knaggs,David H., Liquid thermal management socket system.
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  30. Goth, Gary F.; Hickey, Jody A.; Kearney, Daniel J.; Makowicki, Robert, Logic module refrigeration system with condensation control.
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  33. Righi, Stefano; Mills, Eric, Method and system for remote software debugging.
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  37. Rovang, Gene, Method and system for remote software testing.
  38. Rovang, Gene, Method and system for remote software testing.
  39. Goth, Gary F.; Hickey, Jody A.; Kearney, Daniel J.; Makowicki, Robert, Method for controlling a refrigeration unit for evaporator maintenance.
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  45. Messer,Jason Andrew; Ayanam,Varadachari Sudan; Seshadri,Ramkumar; Dharmapuri,Srinivasan S., Method, apparatus, and computer-readable medium for identifying character coordinates.
  46. Kalbarga, Subash, Method, system, and apparatus for communicating with a computer management device.
  47. Kalbarga, Subash, Method, system, and apparatus for communicating with a computer management device.
  48. Sobel, Larry D.; Capara, Jeff, Microelectronic system with integral cryocooler, and its fabrication and use.
  49. Patrick K. Sullivan, Moisture control system for electrical devices.
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  54. Sivertsen, Clas Gerhard, Redirecting input and output for multiple computers.
  55. Sivertsen, Clas Gerhard, Redirecting input and output for multiple computers.
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  59. Monfarad, Ali Heydari, Refrigeration cooling assisted MEMS-based micro-channel cooling system.
  60. Sivertsen, Clas Gerhard, Remotely controllable switch and testing methods using same.
  61. Sivertsen, Clas Gerhard, Remotely controllable switch and testing methods using same.
  62. Sobel,Larry D.; Capara,Jeff; Jenia,Justin C., Stacked-plate gas-expansion cooler assembly, fabrication method, and use.
  63. Huang Chiang Ming,TWX, Structure of a CPU securing seat.
  64. Binz, Dieter; Vogel, Albrecht; Krippner, Peter, Support for components used in microsystems technology.
  65. Righi, Stefano; Javeed, Ashraf, System and method for debugging a target computer using SMBus.
  66. Righi, Stefano; Javeed, Ashraf, System and method for debugging a target computer using SMBus.
  67. Mondal,Umasankar, Systems and methods for capturing screen displays from a host computing system for display at a remote terminal.
  68. Barabi, Nasser; Ho, Chee Wah; Tienzo, Joven R.; Kryachek, Oksana; Nazarov, Elena V., Systems and methods for conforming test tooling to integrated circuit device with heater socket.
  69. Sivertsen,Clas Gerhard, Systems and methods for establishing interaction between a local computer and a remote computer.
  70. Tousson Eliahou, Temperature self-regulated integrated circuits and devices.
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