초록 ▼

The invention is a computer module for scalably adding computing power and cooling capacity to a computer system. Computing power can be added by merely adding additional printed circuit cards to the computing module. Cooling capability is added by adding heat pipes to the computer module. The compu

The invention is a computer module for scalably adding computing power and cooling capacity to a computer system. Computing power can be added by merely adding additional printed circuit cards to the computing module. Cooling capability is added by adding heat pipes to the computer module. The computing module for a computer includes a first heat pipe assembly. The first heat pipe assembly has an evaporator plate with an evaporator surface. The first heat pipe also has a condenser in fluid communication with the evaporator plate. The evaporator plate is positioned adjacent one side of a printed circuit board populated with at least one electronic component. The computing module may use a printed circuit board which has two sides populated with electronic components. When a printed circuit board having components on two sides is used, a second heat pipe having the same construction, namely an evaporator plate with an evaporator surface and a condenser in fluid communication with said evaporator plate, is positioned adjacent the other side of said printed circuit board so that the electronic components on the other side are positioned adjacent said evaporator surface of said second heat pipe. The evaporator plate of each heat pipe is connected to the condenser by a plurality of necked-down regions. This forms at least one window between the condenser and the evaporator plate of each heat pipe. When more than one heat pipe is used in the computing module, the windows of the various heat pipes align. Electrical connector components can be routed through the windows. The connector component connects the edge of the printed circuit board positioned near the windows. Additional building blocks, comprising one additional heat pipe and one additional populated printed circuit card can be added to further scale up or upgrade a computer system.

대표청구항 ▼

[ What is claimed is:] [1.] A computing module for a computer, said module comprising:a first heat pipe assembly having a first evaporator plate, the first evaporator plate further comprising a pair of substantially planar exterior surfaces which define therebetween a first evaporator flow chamber,

[ What is claimed is:] [1.] A computing module for a computer, said module comprising:a first heat pipe assembly having a first evaporator plate, the first evaporator plate further comprising a pair of substantially planar exterior surfaces which define therebetween a first evaporator flow chamber, said first flow chamber extending to substantially the entire surface area of the first evaporator plate;a first condenser;a necked-down region located between the first evaporator flow chamber and the first condenser, such that the first condenser is in fluid communication through the necked-down region with said first evaporator plate flow chamber; anda circuit board populated with at least one electronic component, said first evaporator plate of said first heat pipe positioned adjacent a first side of said circuit board such that at least a portion of said at least one electronic component is adjacent said first evaporator plate exterior surface.