$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Computer with improved internal cooling system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0115039 (1998-07-14)
발명자 / 주소
  • Hood
  • III Charles D.
  • Utz James
출원인 / 주소
  • Dell USA, L.P.
대리인 / 주소
    Haynes & Boone, L.L.P.
인용정보 피인용 횟수 : 55  인용 특허 : 10

초록

A portable computer according to which a processor is disposed in a chassis. A module housing is provided for insertion into and removal from, the chassis and contains a fan for flowing air from the processor, through the module housing and externally of the housing to cool the processor.

대표청구항

[ What is claimed is:] [1.] A portable computer comprising a chassis; at least one processor disposed in the chassis and comprising a housing, and a printed circuit board connected to the housing; at least one memory device disposed in the chassis; a module housing for insertion into and removal fro

이 특허에 인용된 특허 (10)

  1. Nelson Daryl J. (Beaverton OR) Noble Scott L. (Beaverton OR), Collapsible cooling apparatus for portable computer.
  2. Marino Jerry C. (Sudbury MA) Bibeau Lawrence J. (Worcester MA), Computer mounting assembly.
  3. Hicks, Roy T., Cooling and power input assembly.
  4. Winick Alan Lee ; Mitty Nagaraj ; Harpell Gary A., Cooling system for enclosed electronic components.
  5. Tragen Barry J. (Forest Grove OR), Electronic computer cabinetry having fan and power supply drawers and connector port arrangement.
  6. Harvey James C., Filtered air, temperature controlled removable computer cartridge devices.
  7. Kitlas Ken ; Foo Khim, Module shroud attachment to motherboard.
  8. Behl Sunny, PC card for cooling a portable computer.
  9. Wyler Gregory T. (Winchester MA), Silent air cooled computer having a hard disk drive with an acoustic shield and a heat sink arranged exterior to the dri.
  10. Larson Ralph I. (Bolton MA) Phillips Richard J. (Alachua FL) Beane Alan F. (Gilford NH), Two-phase cooling system for a laptop computer lid.

이 특허를 인용한 특허 (55)

  1. Malone,Christopher G.; Simon,Glenn C.; Bolich,Bryan; Tam,Victoria Tsang, Air duct with airtight seal.
  2. Holmes, Steven; Heirich, Douglas L., Apparatus for air cooling of an electronic device.
  3. Holmes, Steven; Heirich, Douglas L., Apparatus for air cooling of an electronic device.
  4. Holmes,Steven; Heirich,Douglas L., Apparatus for air cooling of an electronic device.
  5. Holmes,Steven; Heirich,Douglas L., Apparatus for air cooling of an electronic device.
  6. Sasaki, Chiyoshi, Apparatus for cooling a box with heat generating elements received therein and a method for cooling same.
  7. Broder Damon ; Hood ; III Charles D., Apparatus for cooling a heat generating component in a computer.
  8. Kardach,Jim; Williams,David; Distefano,Eric; Cardenas,Marlon; Hermerding,Jim, Apparatus for determining temperature of a portable computer system.
  9. Chen, Jung I, Assembly of computer peripherals.
  10. Homer, Steven S.; Lev, Jeffery A., Computer system having removable processor and modular thermal unit.
  11. Watts, Jr., La Vaughn F.; Dadzie, Kofi Nkisah; Zhang, Yi, Computer system thermal lap management method and apparatus.
  12. Bhatia Rakesh, Cooling fan for computing devices with split motor and fan blades.
  13. Tohru Nakanishi JP; Yasuharu Yamada JP; Masanori Kuzuno JP; Toshihiko Nishio JP, Cooling method and device for notebook personal computer.
  14. Hiroshi Nakamura JP; Katsumi Hisano JP; Kentaro Tomioka JP; Hiroshi Aoki JP; Katsuhiko Yamamoto JP, Cooling unit for cooling heat generating component and electronic apparatus having the cooling unit.
  15. Ming-Chuan Yu TW; Chung Che Yu TW, Detachable cooling device for computer.
  16. Karr, Ben, Device bay heat exchanger for a portable computing device.
  17. Lev, Jeffrey A.; Tracy, Mark S., Device cooling system.
  18. Lin, Chin Chi, Electrical device heat dissipation structure.
  19. Hasegawa, Hideaki; Aoki, Keiichi, Electronic apparatus.
  20. Chen, Jing; Chen, Chien-Lung, Electronic device.
  21. Chen, Chien Chang, External heat dissipator detachably adapted to a heat source to force away heat generated by the heat source.
  22. Shoei-Yuan Shih TW, Fan flow guide.
  23. Sun, Zheng-Heng, Heat dissipating device and supporting element thereof.
  24. Sygulla, John Michael; Ramakrishnan, Arun; Slowiak, Greg, Hierarchical system manager rollback.
  25. Michael, Mihalis, High-performance heat sink for printed circuit boards.
  26. Wu, Chi-Jung, Host apparatus with waterproof function and heat dissipation module thereof.
  27. Hood, III, Charles D.; Sauciuc, Ioan; Tantoush, Mohammed, Hybrid heat exchanger.
  28. Hood, III, Charles D.; Sauciuc, Ioan; Tantoush, Mohammed, Hybrid heat exchanger.
  29. Pokharna, Himanshu; Distefano, Eric, Increased thermal capability of portable electronic device in stationary or docked mode.
  30. Toyoda, Shigeru, Information processing apparatus with a chassis for thermal efficiency and method for making the same.
  31. Meng-Cheng Huang TW, Integral heat dissipating device.
  32. Charles W. Frank, Jr. ; Thomas D. Hanan ; Wally Szeremeta, Integrated computer module with airflow accelerator.
  33. Hood, III, Charles D.; Grossman, Philip, Liquid cooling system with automatic pump speed control.
  34. Coles, Henry C.; Vidales, Hector; Allen, Joseph R.; Nguyen, Tri, Low profile latch activator.
  35. Dean, Ronald P.; Richard, Owen T.; Armiger, William J.; Bullington, James R., Method and apparatus for securing a fan within a device.
  36. Corbett,Jesse V.; Steiner,David J.; Johnson,Donald C., Method of removing foreign particles from heat transfer surfaces of heat sinks.
  37. DiStefano, Eric; Seshan, Krishna, Mobile computer having a housing with openings for cooling.
  38. Xie, Hong, Portable and plugable thermal and power solution for a notebook or handheld device.
  39. Liu Louis,TWX ; Chang Grace,TWX, Portable computer host without any user interface.
  40. DeLuga,Ronald E.; Moore,Earl; Doczy,Paul, Portable computer power system.
  41. Becker, Craig Henry; Hsu, Jimmy Ming-Der; Vicknair, Wayne Elmo, Portable device for cooling a laptop computer.
  42. Liao, Pen-Hung; Huang, Shih-Wei; Tsai, Shui-Fa, Portable electronic device and detachable auxiliary heat-dissipating module thereof.
  43. Seibold, Lawrence B., Power supply cooling system.
  44. Pokharna,Himanshu; DiStefano,Eric, Pumped loop cooling with remote heat exchanger and display cooling.
  45. Coster, Daniel J.; De Iuliis, Daniele; Goh, Chiew-Siang; Heirich, Douglas L.; Holmes, Steven; Ive, Jonathan; Kim, Sung; Mariano, Rick; Misage, Thomas J.; Riccio, Dan; Tan, Tang Yew; Yaekel, Jeremy, Quick release structures for a computer.
  46. Coster,Daniel J.; De Iuliis,Daniele; Goh,Chiew Siang; Heirich,Douglas L.; Holmes,Steven; Ive,Jonathan P.; Kim,Sung; Mariano,Rick; Misage,Thomas J.; Riccio,Dan; Tan,Tang Yew; Yaekel,Jeremy, Quick release structures for a computer.
  47. Coster, Daniel J.; De Iuliis, Daniele G.; Goh, Chiew-Siang; Heirich, Douglas L.; Holmes, Steven W.; Ive, Jonathan P.; Kim, Sung H.; Mariano, Ricardo A.; Misage, Thomas J.; Riccio, Daniel J.; Tan, Tang Y.; Yaekel, Jeremy, Quick release structures for a memory drive.
  48. Arbogast, Porter; Roesner, Arlen L., Removable fan module and electronic device incorporating same.
  49. Reents, Jeffrey M.; Hayes, Jonathan A., Removable module for a console.
  50. Reents, Jeffrey M.; Hayes, Jonathan A., Removable module for a console.
  51. Ahrens, Michael; Daskalakis, George H.; Lofland, Steven J.; Pidwerbecki, David; Qiu, Bo; Raupp, James C.; Yee, Stacy L., Retractable heat exchanger.
  52. Kinstle, Robert Michael; Schlichter, Kevin; Barron, Seitu, Server with heat pipe cooling.
  53. Kinstle, Robert Michael; Schlichter, Kevin; Barron, Seitu, Server with heat pipe cooling.
  54. Huang,Yi Chang; Lin,Yao Chung, Transmission device capable of cooling a handheld electronic device.
  55. Hutchinson, David F.; McGowan, Matthew J., Variable length and directional cooling duct.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로