초록 ▼

A thermal management controller to regulate the operating temperature of high speed, high circuit density semiconductor dice in an electronic product. The thermal management controller monitors the temperature of a heat sink in thermal contact with the high speed, high circuit density semiconductor

A thermal management controller to regulate the operating temperature of high speed, high circuit density semiconductor dice in an electronic product. The thermal management controller monitors the temperature of a heat sink in thermal contact with the high speed, high circuit density semiconductor dice and also monitors the operational status of one or more specified devices which may increase the heat load within the electronic product. As the temperature of the heat sink increases and/or as specified devices increase the heat load in the electronic product, the thermal management controller will start cooling fans and/or increases the speed of the cooling fans to increase heat removal from the electronic product by forced convection. As the temperature of the heat sink decreases and/or as specified devices cease contributing to the heat load in the electronic product, the thermal management controller will decrease the speed of the cooling fans and/or turn off the cooling fans to decrease heat removal from the electronic product. If the temperature of the heat sink rises above a predetermined temperature, the thermal management structure will reduce the clock speed of the semiconductor dice. If the temperature of the heat sink rises above a predetermined maximum temperature, the thermal management structure will turn of the semiconductor dice.

대표청구항 ▼

[ What is claimed is:] [1.] A thermal management controller, the thermal management controller comprising:a thermal management structure, a temperature sensor, a control bus, a hardware control processor, a variable output voltage power supply, and a variable speed fan;the thermal management structu

[ What is claimed is:] [1.] A thermal management controller, the thermal management controller comprising:a thermal management structure, a temperature sensor, a control bus, a hardware control processor, a variable output voltage power supply, and a variable speed fan;the thermal management structure having a substrate and two heat sink pieces, the substrate having at least one semiconductor die, the substrate interposed between and thermally connected to the two heat sink pieces;the temperature sensor thermally connected to one of the two heat sink pieces, the temperature sensor electrically connected to the control bus;the hardware control processor electrically connected to the control bus;the variable output voltage power supply, the power supply having electric power output connections and a digital pot, the digital pot electrically connected to the control bus; andthe variable speed fan electrically connected to the electric power output connections of the power supply.