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Corrosion protection for metallic features 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-003/00
  • H01L-029/12
출원번호 US-0936750 (1997-09-25)
발명자 / 주소
  • Semkow Krystyna W.
  • O'Sullivan Eugene J.
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Townsend
인용정보 피인용 횟수 : 50  인용 특허 : 12

초록

A microelectronic structure, having 1) at least one metallic feature situated on a layer of material selected from the group consisting of nonmetallic and semiconductor materials; 2) a layer of a cobalt-phosphorus alloy (Co(P)) covering at least one of the at least one metallic feature; and 3) a lay

대표청구항

[ What is claimed is:] [1.] A microelectronic structure, comprising:at least one metallic feature situated on a layer of material selected from the group consisting of nonmetallic and semiconductor materials;a layer of a cobalt-phosphorus alloy (Co(P)) covering at least one of the at least one metal

이 특허에 인용된 특허 (12)

  1. Narcus Harold (15 Vesper St. Worcester MA 01602), Bright electroless plating process and plated articles produced thereby.
  2. Feldstein Nathan (Princeton NJ) Lindsay Deborah J. (Princeton NJ), Composite electroless plating-solutions, processes, and articles thereof.
  3. Schumm ; Jr. Brooke (Bay Village OH), Electroless plated plastic covers for galvanic cells.
  4. Inoue Manabu (Tokyo JPX) Kaneta Mitsutada (Ichikawa JPX) Ozawa Junko (Chiba JPX), Electroless plating solution and plating method with it.
  5. Shirahata ; Ryuji ; Suzuki ; Masaaki ; Kitamoto ; Tatsuji, Magnetic recording medium.
  6. Leever Harold (Bethlehem CT) Slominski Leo J. (Bristol CT), Method and composition for electroless nickel deposition.
  7. Zeller Faith M. (Eagan MN), Method of coating copper conductors on polyimide with a corrosion resistant metal, and module produced thereby.
  8. Waggoner John (Ft. Wayne IN), Method of using a shielding means to attenuate electromagnetic radiation in the radio frequency range.
  9. Kaja Suryanarayana (Hopewell Junction NY) O\Sullivan Eugene J. (Nyack NY) Schrott Alejandro G. (New York NY), Process for fabricating improved multilayer interconnect systems.
  10. Baudrand Donald W. (867 Downing Sq. Lincolnshire IL 60015) Fleming Rebecca P. (3220 Lothian Rd. ; #104 Fairfax VA 22031) Gniewek John J. (6025 Wendrew La. Tucson AZ 85711) Harvilchuck Joseph M. (P.O., Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and produc.
  11. Gomes JosM. G. (Loures PTX) Rodrigues Ana P. T. L. (Almada PTX), Selective process for printing circuit board manufacturing.
  12. Feldstein Nathan (Princeton NJ) Lindsay Deborah (Leeds GB2), Stabilized composite electroless plating compositions.

이 특허를 인용한 특허 (50)

  1. Mao, Fei; Cho, Hyun, Analyte monitoring devices.
  2. Yan, Wenguang; Lotfi, Ashraf W., Asymmetric power flow controller for a power converter and method of operating the same.
  3. Yan, Wenguang; Lotfi, Ashraf W., Asymmetric power flow controller for a power converter and method of operating the same.
  4. Yakobson,Eric; Hurtubise,Richard; Witt,Christian; Chen,Qingyun, Capping of metal interconnects in integrated circuit electronic devices.
  5. Yakobson,Eric; Hurtubise,Richard; Witt,Christian; Chen,Qingyun, Capping of metal interconnects in integrated circuit electronic devices.
  6. Valverde,Charles; Petrov,Nicolai; Yakobson,Eric; Chen,Qingyun; Paneccasio, Jr.,Vincent; Hurtubise,Richard; Witt,Christian, Cobalt and nickel electroless plating in microelectronic devices.
  7. Wirth, Alexandra, Compositions for the currentless deposition of ternary materials for use in the semiconductor industry.
  8. Wirth, Alexandra, Compositions for the currentless deposition of ternary materials for use in the semiconductor industry.
  9. Say, James L.; Tomasco, Michael Francis; Heller, Adam; Gal, Yoram; Aria, Behrad; Plante, Phillip John, Electrochemical analyte sensor.
  10. Say, James; Tomasco, Michael F.; Heller, Adam; Gal, Yoram; Aria, Behrad; Heller, Ephraim; Plante, Phillip John; Vreeke, Mark S., Electrochemical analyte sensor.
  11. Thie, William; Boyd, John M.; Redeker, Fritz C.; Dordi, Yezdi; Parks, John; Arunagiri, Tiruchirapalli; Owczarz, Aleksander; Balisky, Todd; Thomas, Clint; Wylie, Jacob; Schoepp, Alan M., Fluid handling system for wafer electroless plating and associated methods.
  12. Farrar,Paul A., Low capacitance wiring layout.
  13. Farrar, Paul A., Low capacitance wiring layout and method for making same.
  14. Farrar, Paul A., Low capacitance wiring layout and method for making same.
  15. Lotfi, Ashraf W.; Wilkowski, Mathew A.; Liakopoulos, Trifon M.; Weld, John D., Magnetic device having a conductive clip.
  16. Lotfi, Ashraf W.; Wilkowski, Mathew A.; Liakopoulos, Trifon M.; Weld, John D., Magnetic device having a conductive clip.
  17. Thie, William; Boyd, John M.; Redeker, Fritz C.; Dordi, Yezdi; Parks, John; Arunagiri, Tiruchirapalli; Owczarz, Aleksander; Balisky, Todd; Thomas, Clint; Wylie, Jacob; Schoepp, Alan M., Method and apparatus for wafer electroless plating.
  18. Farrar,Paul A., Method for fabricating a low capacitance wiring layout.
  19. Rostoker Michael D. ; Muthukumaraswamy Kumaraguru, Method of controlling critical dimension of features in integrated circuits (ICS), ICS formed by the method, and systems utilizing same.
  20. Lotfi, Ashraf W.; Wilkowski, Mathew A.; Liakopoulos, Trifon M.; Weld, John D., Method of forming a magnetic device having a conductive clip.
  21. Lotfi, Ashraf W.; Liakopoulos, Trifon M.; Filas, Robert W., Method of forming a micromagnetic device.
  22. Lotfi, Ashraf W.; Wilkowski, Mathew A.; Liakopoulos, Trifon M.; Weld, John D., Method of forming a power module with a magnetic device having a conductive clip.
  23. Lotfi, Ashraf W.; Wilkowski, Mathew; Weld, John D., Method of manufacturing a power module.
  24. Lotfi, Ashraf W.; Wilkowski, Mathew; Weld, John D., Method of manufacturing an encapsulated package for a magnetic device.
  25. Lotfi, Ashraf W.; Liakopoulos, Trifon M.; Filas, Robert W.; Panda, Amrit, Micromagnetic device and method of forming the same.
  26. Lotfi, Ashraf W.; Liakopoulos, Trifon M.; Filas, Robert W.; Panda, Amrit, Micromagnetic device and method of forming the same.
  27. Lotfi, Ashraf W.; Liakopoulos, Trifon M.; Filas, Robert W.; Panda, Amrit, Micromagnetic device and method of forming the same.
  28. Lotfi, Ashraf W.; Lopata, Douglas Dean; Weld, John David; Wilkowski, Mathew A., Module having a stacked magnetic device and semiconductor device and method of forming the same.
  29. Lotfi, Ashraf W.; Lopata, Douglas Dean; Weld, John David; Wilkowski, Mathew A., Module having a stacked magnetic device and semiconductor device and method of forming the same.
  30. Lotfi, Ashraf W.; Lopata, Douglas Dean; Weld, John David; Wilkowski, Mathew A., Module having a stacked passive element and method of forming the same.
  31. Lotfi, Ashraf W.; Lopata, Douglas Dean; Weld, John David; Wilkowski, Mathew A., Module having a stacked passive element and method of forming the same.
  32. Shah, Rajiv; Pendo, Shaun, Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures.
  33. Shah, Rajiv; Pendo, Shaun; Babiricki, Edward B., Multilayer substrate.
  34. Shah,Rajiv; Pendo,Shaun; Babiricki,Edward G., Multilayer substrate.
  35. Lotfi, Ashraf W.; Liakopoulos, Trifon M.; Filas, Robert W., Power converter employing a micromagnetic device.
  36. Mera, Narciso; Lopata, Douglas Dean; Lotfi, Ashraf W., Power converter for a memory module.
  37. Mera, Narciso; Lopata, Douglas Dean; Lotfi, Ashraf W., Power converter for a memory module.
  38. Abou-Alfotouh, Ahmed Mohamed; Dwarakanath, Mirmira Ramarao; Demski, Jeffrey, Power converter with a dynamically configurable controller and output filter.
  39. Dwarakanath, Mirmira Ramarao; Demski, Jeffrey; Abou-Alfotouh, Ahmed Mohamed, Power converter with a dynamically configurable controller based on a power conversion mode.
  40. Lopata, Douglas Dean; Lotfi, Ashraf W., Power converter with controller operable in selected modes of operation.
  41. Lopata, Douglas Dean; Lotfi, Ashraf W., Power converter with controller operable in selected modes of operation.
  42. Lopata, Douglas Dean; Lotfi, Ashraf W., Power converter with controller operable in selected modes of operation.
  43. Lopata, Douglas Dean; Lotfi, Ashraf W., Power converter with controller operable in selected modes of operation.
  44. Lotfi, Ashraf W.; Wilkowski, Mathew A.; Liakopoulos, Trifon M.; Weld, John D., Power module with a magnetic device having a conductive clip.
  45. Naoki Komai JP; Yuji Segawa JP; Takeshi Nogami JP, Process for fabricating a semiconductor device.
  46. Lee, Sung-Kwon, Semiconductor memory device and method for fabricating the same.
  47. Lindgren, Joseph T., Stable electroless fine pitch interconnect plating.
  48. Heller, Adam; Pishklo, Michael V., Subcutaneous glucose electrode.
  49. Heller, Adam; Pishko, Michael V., Subcutaneous glucose electrode.
  50. Ueno, Kazuyoshi; Osaka, Tetsuya; Takano, Nao, ULSI wiring and method of manufacturing the same.
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